936AC

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
D2PAK−5
CASE 936AC−01
ISSUE A
DATE 10 SEP 2009
A
SCALE 1:1
E
L1
B
A
SEATING
PLANE
0.10
A
E/2
M
B A
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH AND GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.005 MAXIMUM PER SIDE. THESE DIMENSIONS
TO BE MEASURED AT DATUM H.
4. THERMAL PAD CONTOUR OPTIONAL WITHIN
DIMENSIONS E, L1, D1, AND E1. DIMENSIONS
D1 AND E1 ESTABLISH A MINIMUM MOUNTING
SURFACE FOR THE THERMAL PAD.
D1
c2
E1
D
DETAIL C
H
5X
c
e
b
VIEW A−A
A
0.13
M
B A
M
B
H
SEATING
PLANE
A1
L3
L
RECOMMENDED
SOLDERING FOOTPRINT*
INCHES
MIN
MAX
0.170
0.180
0.000
0.010
0.026
0.036
0.017
0.026
0.045
0.055
0.325
0.368
0.250
−−−
0.380
0.420
0.200
−−−
0.067 BSC
0.580
0.620
0.090
0.110
−−−
0.066
0.010 BSC
0_
8_
MILLIMETERS
MIN
MAX
4.32
4.57
0.00
0.25
0.66
0.91
0.43
0.66
1.14
1.40
8.25
9.53
6.35
−−−
9.65
10.67
5.08
−−−
1.70 BSC
14.73
15.75
2.29
2.79
−−−
1.68
0.25 BSC
0_
8_
GENERIC
MARKING DIAGRAM*
M
0.424
GAUGE
PLANE
DIM
A
A1
b
c
c2
D
D1
E
E1
e
H
L
L1
L3
M
DETAIL C
XX
XXXXXXXXX
AWLYWWG
0.310
0.584
1
XXXXX
A
WL
Y
WW
G
0.176
5X
0.067
PITCH
0.040
DIMENSIONS: MILLIMETERS
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON14120D
ON SEMICONDUCTOR STANDARD
1
© Semiconductor Components Industries, LLC, 2000
August, 2000 − Rev. 01O
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
D2PAK−5
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled exceptCase
when
stamped
Outline
Number:
963F
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON14120D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY J. KEISER
17 DEC 2003
A
CHANGES RELATED TO CARSEM TO SEREMBAN TRANSFER. REDREW TO
JEDEC STANDARDS. ADDED SOLDER FOOTPRINT. REQ. BY B. FONTES.
10 SEP 2009
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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© Semiconductor Components Industries, LLC, 2009
September, 2009 − Rev. 01A
Case Outline Number:
936AC
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