568AN

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP6, 1.00x1.50
CASE 568AN
ISSUE A
SCALE 4:1
È
PIN A1
REFERENCE
2X
D
A
B
DIE COAT
A3
E
0.05 C
2X
DATE 30 JAN 2014
A2
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
DIM
A
A1
A2
A3
b
D
E
e
DETAIL A
0.05 C
TOP VIEW
A2
DETAIL A
GENERIC
MARKING DIAGRAM*
0.05 C
A
XXX
AYW
G
0.05 C
NOTE 3
6X
A1
SEATING
PLANE
e
b
0.05 C A B
C
SIDE VIEW
MILLIMETERS
MIN
MAX
0.54
0.63
0.21
0.26
0.36 REF
0.02 REF
0.315
0.335
1.00 BSC
1.50 BSC
0.50 BSC
e
A
Y
W
G
= Assembly Location
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
C
0.03 C
B
A
1 2 3
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
A1
0.50
PITCH
PACKAGE
OUTLINE
6X
0.50
PITCH
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON81730F
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WLCSP6, 1.00X1.50
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON81730F
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY M. HILTON.
16 JAN 2014
A
MODIFIED DIMENSION B VALUES TO 0.315 & 0.335. REQ. BY M. HILTON.
30 JAN 2014
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
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or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
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© Semiconductor Components Industries, LLC, 2014
January, 2014 − Rev. A
Case Outline Number:
568AN
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