485AR

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN28 4x4, 0.4P
CASE 485AR−01
ISSUE A
DATE 20 NOV 2009
1
SCALE 2:1
PIN ONE
REFERENCE
B
A
D
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
L
L1
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
ÏÏ
ÏÏ
EXPOSED Cu
0.10 C
0.10 C
L
MOLD CMPD
DETAIL B
TOP VIEW
ALTERNATE
CONSTRUCTION
A
DETAIL B
A3
0.10 C
GENERIC
MARKING DIAGRAM*
0.08 C
NOTE 4
A1
SIDE VIEW
SEATING
PLANE
C
XXXXXX
XXXXXX
ALYWG
G
0.10 C A B
D2
DETAIL A
K
8
0.10 C A B
15
28X
L
E2
1
PIN 1
INDICATOR
22
e
28X
BOTTOM VIEW
b
0.07 C A B
0.05 C
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.15
0.25
4.00 BSC
2.50
2.70
4.00 BSC
2.50
2.70
0.40 BSC
0.30 REF
0.30
0.50
−−−
0.15
XXXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer
to device data sheet for actual part
marking. Pb−Free indicator, “G”, may
or not be present.
RECOMMENDED
MOUNTING FOOTPRINT
NOTE 3
4.30
2.71
28X
0.62
1
2.71
4.30
PACKAGE
OUTLINE
0.40
PITCH
DOCUMENT NUMBER:
98AON30349E
28X
0.26
DIMENSIONS: MILLIMETERS
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
QFN28 4X4, 0.4P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON30349E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY M. LIN.
15 MAY 2008
A
CHANGED DIMENSIONS D2, E2, K, L, MOUNTING FOOTPRINT AND MARKING
DIAGRAM INFORMATION. REQ. BY J. LIU.
20 NOV 2009
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2009
November, 2009 − Rev. 01A
Case Outline Number:
485AR
Similar pages