Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
P5.064
5 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
Rev 3, 4/11
8°
0°
3.00 3
2.80
(1.90)
5
0.22
0.08 5
4
3.00
2.60
1.70
1.50
3
2
(0.95)
SEE DETAIL X
0.50
0.30
0.20 (0.008) M C
TOP VIEW
END VIEW
0.25
0.10
0.10 MIN
1.30
0.90
1.45 SEATING
0.90 PLANE
C
GAUGE PLANE
SEATING
PLANE
4
0.55
0.35
C
0.15
0.00
0.10 (0.004) C
(0.60)
SIDE VIEW
8°
0°
(0.25)
DETAIL "X"
5x (0.60)
5x (1.2)
5
4
(2.4)
NOTES:
1. Dimensioning and tolerance per ASME Y14.5M-1994.
3
2. Package conforms to EIAJ SC-74 and JEDEC MO178AA.
3. Package length and width are exclusive of mold flash, protrusions,
or gate burrs.
4. Footlength measured at reference to gauge plane.
5. Lead thickness applies to the flat section of the lead between
0.08mm and 0.15mm from the lead tip.
(2x 0.95)
(1.90)
TYPICAL RECOMMENDED LAND PATTERN
1
6. Controlling dimension: MILLIMETER.
Dimensions in ( ) for reference only.