Plastic Packages for Integrated Circuits Small Outline Transistor Plastic Packages (SOT23-8) 0.20 (0.008) M CL P8.064 C VIEW C 8 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE e b INCHES SYMBOL 8 6 7 5 CL CL E 1 2 3 E1 MILLIMETERS MAX MIN MAX NOTES A 0.036 0.057 0.90 1.45 - A1 0.000 0.0059 0.00 0.15 - A2 0.036 0.051 0.90 1.30 - b 0.009 0.015 0.22 0.38 - b1 0.009 0.013 0.22 0.33 c 0.003 0.009 0.08 0.22 6 4 e1 C D CL A MIN A2 A1 SEATING PLANE -C- c1 0.003 0.008 0.08 0.20 6 D 0.111 0.118 2.80 3.00 3 E 0.103 0.118 2.60 3.00 - E1 0.060 0.067 1.50 1.70 3 e 0.0256 Ref 0.65 Ref - e1 0.0768 Ref 1.95 Ref - L 0.10 (0.004) C 0.014 0.022 0.35 0.55 L1 0.024 Ref. 0.60 Ref. L2 0.010 Ref. 0.25 Ref. N 8 8 5 WITH b R 0.004 - 0.10 - PLATING b1 R1 0.004 0.010 0.10 0.25 α 0o 8o 0o 8o c c1 4 Rev. 2 9/03 NOTES: BASE METAL 1. Dimensioning and tolerance per ASME Y14.5M-1994. 2. Package conforms to EIAJ SC-74 and JEDEC MO178BA. 4X θ1 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. 4. Footlength L measured at reference to gauge plane. R1 5. “N” is the number of terminal positions. R GAUGE PLANE SEATING PLANE L C L1 4X θ1 VIEW C 1 α 6. These Dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip. 7. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only L2