Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Wafer Level Chip Scale Package
(WLCSP 0.4mm Ball Pitch)
W3x3.9C
3x3 ARRAY 9 BALL WAFER LEVEL CHIP SCALE PACKAGE
E
D
PIN 1
INDEX AREA
TOP VIEW
SYMBOL
MILLIMETERS
A
0.445 Min, 0.495 Nom, 0.545 Max
A1
0.190 ±0.025
A2
0.305 ±0.025
b
0.270 ±0.030
D
1.315 ±0.020
D1
0.800 BASIC
E
1.535 ±0.020
E1
0.800 BASIC
e
0.400 BASIC
SD
0 BASIC
SE
A2
0 BASIC
Number of Bumps: 9
A
Rev. 0 5/08
A1
NOTES:
b
1. Dimensions are in Millimeters.
SIDE VIEW
E1
SD
SE
3
e
2
1
D1
C
B
A
BOTTOM VIEW
1
b