Data Sheet

X3G-OH047; X3T-OH047;
X3G-OH048; X3T-OH048
Magnetic field sensor
Rev. 1 — 4 April 2011
Product specification
1. Product profile
1.1 General description
The X3G-OH047, X3G-OH048, X3T-OH047 and X3T-OH048 are sensitive magnetic field
sensors, employing the magneto-resistive effect of thin film permalloy. The sensors
contain two parallel supplied Wheatstone bridges at a relative angle of 45 to each other.
A rotating magnetic field in the surface parallel to the chip (x-y plane) will deliver two
independent sinusoidal output signals, one following a cos(2) and the other following
a sin(2) function,  being the angle between sensor and field direction (see Figure 5 and
Figure 6).
The X3G-OH047, X3G-OH048, X3T-OH047 and X3T-OH048 are suited for high precision
angle measurement applications under low field conditions (saturation field strength
25 kA/m).
The sensors can be operated at any frequency between DC and 1 MHz.
All type numbers shown in this data sheet are valid for a single-die (single sensor).
The double-die has two magnetic field sensors with electrical and magnetic parameters
which fulfill the specified single-die values and do not correlate to each other.
Table 1.
Product overview
Type number
Sensor
Packing
X3G-OH047
double-die
sawn wafer; on foil
X3G-OH048
single-die
sawn wafer; on foil
X3T-OH047
double-die
taped on reel
X3T-OH048
single-die
taped on reel
X3G-OH047/8; X3T-OH047/8
NXP Semiconductors
Magnetic field sensor
001aan663
KMZ44 is an internal name which is visible on the die
Fig 1.
Sensor die
1.2 Features and benefits





Accurate and reliable angle measurement
Mechanical robustness, contactless principle
Wear-free operation
Accuracy independent of mechanical tolerances
Extended temperature range
1.3 Applications
 Steering angle and torsion
 Headlight adjustment
 Motor positioning
X3G_T_OH047_048
Product specification
 Window wipers
 Fuel level
 Mirror positioning
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 4 April 2011
© NXP B.V. 2011. All rights reserved.
2 of 19
X3G-OH047/8; X3T-OH047/8
NXP Semiconductors
Magnetic field sensor
1.4 Quick reference data
Table 2.
Quick reference data
Tamb = 25 C; Hext = 25 kA/m; VCC = 5 V; unless otherwise specified.
Symbol
Parameter
VCC
supply voltage
Conditions
VM
peak voltage
see Figure 3
Voffset
offset voltage
per supply voltage;
see Figure 3
TCV(offset) offset voltage
temperature
coefficient
Rbridge
per supply voltage;
Tamb = 40 C to +150 C;
see Figure 3
bridge resistance
Min
Typ
Max
Unit
-
5
9
V
[1][2]
60
67
75
mV
[1]
2
-
+2
mV/V
[1][3]
2
-
+2
(V/V)/K
[1][4]
2.7
3.2
3.7
k
[1]
Applicable for bridge 1 and bridge 2.
[2]
VM = VO(max)  Voffset. Periodicity of VM: sin(2) and cos(2), respectively.
[3]
V offset  at 150 C  – V offset  at – 40 C 
TC V  offset  = ------------------------------------------------------------------------------------------------150 C –  – 40 C 
[4]
Bridge resistance between pad 5 to pad 1 and pad 4 to pad 2.
2. Pinning information
Table 3.
Pinning
Pad Symbol Description
1
ON1
output voltage bridge 1
2
ON2
output voltage bridge 2
3
GND
common ground
4
OP2
output voltage bridge 2
5
OP1
output voltage bridge 1
6
VCC
common bridge supply voltage
Simplified outline
1
6
2
5
3
4
001aan662
X3G_T_OH047_048
Product specification
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 4 April 2011
© NXP B.V. 2011. All rights reserved.
3 of 19
X3G-OH047/8; X3T-OH047/8
NXP Semiconductors
Magnetic field sensor
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
Description
Version
X3G-OH047
bare die
double-die; sawn wafer; on foil
OL-X3G-OH047
X3G-OH048
bare die
single-die; sawn wafer; on foil
OL-X3G-OH048
X3T-OH047
bare die
double-die; taped on reel
OL-X3T-OH047
X3T-OH048
bare die
single-die; taped on reel
OL-X3T-OH048
4. Circuit diagram
X3G-OH047/8; X3T-OH047/8
bridge 1
bridge 2
cos
R11
R13
VCC
OP1
VCC
sin
R21
R12
R14
R23
GND
ON1
R22
R24
OP2
ON2
VO1
VO2
V
V
VOP1
V
VON1
V
VOP2
VON2
V
V
008aaa264
Fig 2.
Device and test circuit diagram
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VCC
supply voltage
Hext
external magnetic field strength
Tamb
ambient temperature
[1]
X3G_T_OH047_048
Product specification
Conditions
[1]
Min
Max
Unit
-
9
V
25
-
kA/m
40
+150
C
Minimum stimulating magnetic field parallel to the chip surface (x-y plane) to achieve specified angular
accuracy.
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© NXP B.V. 2011. All rights reserved.
4 of 19
X3G-OH047/8; X3T-OH047/8
NXP Semiconductors
Magnetic field sensor
6. Characteristics
Table 6.
Characteristics
Tamb = 25 C; Hext = 25 kA/m[1]; VCC = 5 V; unless otherwise specified.
Symbol
Parameter
VCC
supply voltage
Conditions
Min
Typ
Max
Unit
-
5
9
V
VM
peak voltage
see Figure 3
[2][3]
60
67
75
mV
TCVM
peak voltage temperature
coefficient
Tamb = 40 C to +150 C
[2][4]
0.30
0.36
0.42
%/K
Rbridge
bridge resistance
[2][5]
2.7
3.2
3.7
k
[2][6]
0.24
0.27
0.29
%/K
[2]
2
-
+2
mV/V
TCR(bridge)
bridge resistance
temperature coefficient
Tamb = 40 C to +150 C
Voffset
offset voltage
per supply voltage;
see Figure 3
TCV(offset)
offset voltage temperature
coefficient
per supply voltage;
Tamb = 40 C to +150 C;
see Figure 3
[2][7]
2
-
+2
(V/V)/K
Vo(hys)
hysteresis output voltage
see Figure 4
[2][8]
0
0.05
0.18
%FS

angular velocity
k
amplitude synchronism
TCk
amplitude synchronism
temperature coefficient

angular inaccuracy
0
-
1
MHz
98.9
100
101.1
%
[10]
0.01
0
+0.01
%/K
[11]
0
0.05
0.1
deg
[9]
Tamb = 40 C to +150 C
[1]
Minimum stimulating magnetic field parallel to the chip surface (x-y plane) to achieve angular inaccuracy.
[2]
Applicable for bridge 1 and bridge 2.
[3]
VM = VO(max)  Voffset. Periodicity of VM: sin(2) and cos(2), respectively.
[4]
V M  at 150 C  – V M  at – 40 C 
TCVM = -------------------------------------------------------------------------------------------V M  at 25 C    150 C –  – 40 C  
[5]
Bridge resistance between pad 5 to pad 1 and pad 4 to pad 2.
[6]
R bridge  at 150 C  – R bridge  at – 40 C 
TCR  bridge  = -----------------------------------------------------------------------------------------------------R bridge  at 25 C    150 C –  – 40 C  
[7]
V offset  at 150 C  – V offset  at – 40 C 
TCV  offset  = ------------------------------------------------------------------------------------------------150 C –  – 40 C 
[8]
V O1  67.5 135  45  – V O1  67.5 45  135 
V o  hys 1 = --------------------------------------------------------------------------------------------------------------------------2  V M1
V O2  22.5 90  0  – V O2  22.5 0  90 
V o  hys 2 = --------------------------------------------------------------------------------------------------------------2  V M2
[9]
V M1
k = --------V M2
k  at 150 C  – k  at – 40 C 
[10] TCk = ---------------------------------------------------------------------------------------k  at 25 C    150 C –  – 40 C  
[11]  =  real –  meas ; Voffset = 0 V; inaccuracy of angular measurement due to deviations from ideal sinusoidal characteristics,
calculated from the third and fifth harmonics of the spectrum VO.
X3G_T_OH047_048
Product specification
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Rev. 1 — 4 April 2011
© NXP B.V. 2011. All rights reserved.
5 of 19
X3G-OH047/8; X3T-OH047/8
NXP Semiconductors
Magnetic field sensor
VO
(mV)
VO2
VM2
Voffset2
0
VO1
90
0
180
270
α (deg)
360
008aaa265
Fig 3.
Output signals related to the direction of the magnetic field
008aaa266
VO
(mV)
Vo(hys)2
VO1
0
VO2
Vo(hys)1
0
Fig 4.
X3G_T_OH047_048
Product specification
45
90
α (deg)
135
Definition of hysteresis
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X3G-OH047/8; X3T-OH047/8
NXP Semiconductors
Magnetic field sensor
7. Bare die outline
y
x
R13
R24
R23
RS
R11
R14
LDy
bridge 1 (cos)
α
bridge 2 (sin)
R22
R21
R12
RPy
1
6
2
3
Hext
5
4
LSy
x = 0,
y=0
PD
LSx
RPx
LDx
Fig 5.
Table 7.
X3G_T_OH047_048
Product specification
001aan691
Bare die outline (single die)
Mechanical dimensions for Figure 5
Symbol
Parameter
x
y
Radius/diameter
Unit
LD
die size
1150
1150
-
m
LS
sawing lane width
60
60
-
m
RP
reading point position
575
642
-
m
RS
sensitive area radius
-
-
480
m
PD
pad diameter
-
-
110
m
1
position pad 1
108
230
-
m
2
position pad 2
243
125
-
m
3
position pad 3
489
95
-
m
4
position pad 4
632
95
-
m
5
position pad 5
900
125
-
m
6
position pad 6
1032
200
-
m
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© NXP B.V. 2011. All rights reserved.
7 of 19
X3G-OH047/8; X3T-OH047/8
NXP Semiconductors
Magnetic field sensor
bridge 1 (cos)
y
bridge 2 (sin)
x
R13
R24
R23
RS
R11
R14
LDy
α
R22
R21
R12
RPy
1
6
2
3
4
7
Hext
12
8
5
9
10
11
LSy
x = 0,
y=0
PD
LSx
RP1x
RP2x
LDx
Fig 6.
001aan692
Bare die outline (double die)
Table 8.
Mechanical dimensions for Figure 6
Symbol
Parameter
x
y
LD
die size
2360
1150
Radius/diameter
Unit
m
LS
sawing lane width
60
60
m
RP1
reading point position 1
575
642
m
m
RP2
reading point position 2
1785
642
RS
sensitive area radius
-
-
480
m
PD
pad diameter
-
-
110
m
1
position pad 1
108
230
m
2
position pad 2
243
125
m
3
position pad 3
489
95
m
4
position pad 4
632
95
m
5
position pad 5
900
125
m
6
position pad 6
1032
200
m
7
position pad 7
1318
230
m
8
position pad 8
1453
125
m
9
position pad 9
1699
95
m
X3G_T_OH047_048
Product specification
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Rev. 1 — 4 April 2011
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8 of 19
X3G-OH047/8; X3T-OH047/8
NXP Semiconductors
Magnetic field sensor
Table 8.
Mechanical dimensions for Figure 6 …continued
Symbol
Parameter
x
y
10
position pad 10
1842
95
m
11
position pad 11
2110
125
m
12
position pad 12
2242
200
m
Table 9.
Radius/diameter
Unit
Wafer dimensions
Symbol
Parameter
Value
Unit
WD
wafer diameter
150
mm
WT
wafer thickness
380  15
m
8. Packing information
8.1 Tape construction for X3G-OH047 and X3G-OH048
liner (PET)
(38 μm)
adhesive (acrylic) (10 μm)
base film (PE)
(65 μm)
019aab732
Fig 7.
Tape construction
Table 10.
Material composition
Parameter
Content
Typical value
Unit
Total thickness
-
75
m
Adhesion
-
55 / 20
g/mm
Ionic impurity
Na+
0.027
g/ml
X3G_T_OH047_048
Product specification
K+
< 0.004
g/ml
Cl
0.045
g/ml
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Rev. 1 — 4 April 2011
© NXP B.V. 2011. All rights reserved.
9 of 19
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
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xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
NXP Semiconductors
X3G_T_OH047_048
Product specification
A
148
0.2 B
71.5 ±0.3
0.2
20
Ø3.175 h6 (2×)
2
2 B
+2
0
R (2×)
2.5
+0.05
0
60°
30°
30°
1
A
Ø2
27 0
-0.5
0.8
R1 max
1B
79.42
216
B01
ejector marks and sprue marks on this side
below the surface min 0.05 max 0.2
Ø195
10 of 19
© NXP B.V. 2011. All rights reserved.
0.2 B
Fig 8.
Geometrical dimensions of frame
216
B
019aab727
Magnetic field sensor
0.2 B
X3G-OH047/8; X3T-OH047/8
Rev. 1 — 4 April 2011
All information provided in this document is subject to legal disclaimers.
4 ±0.3
NXP Semiconductors
X3G-OH047/8; X3T-OH047/8
Magnetic field sensor
The barcode label consists of several numbers which are
explained below:
The first digits of the barcode show the batch number
for example 69594.030
The last three digits of the barcode show the wafer number
for example 69594.030
019aab728
Fig 9.
X3G_T_OH047_048
Product specification
Film Frame Carrier (FFC) with barcode label
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 4 April 2011
© NXP B.V. 2011. All rights reserved.
11 of 19
NXP Semiconductors
X3G-OH047/8; X3T-OH047/8
Magnetic field sensor
double die parallel to flat
flat
Wafer position to frame
019aab731
Fig 10. Wafer position to frame and double die position to wafer
X3G_T_OH047_048
Product specification
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 4 April 2011
© NXP B.V. 2011. All rights reserved.
12 of 19
X3G-OH047/8; X3T-OH047/8
NXP Semiconductors
Magnetic field sensor
8.2 Carrier tape for X3T-OH047 and X3T-OH048
B-B
K
Θ
A0
A
P
K0
D1
G
W
W1
B0
B
F
B
E
A
A-A
T1
D0
P2
T
P0
feed direction
position of pad 1
019aab730
Fig 11. Tape outline, carrier tape X3T-OH048
Table 11.
Dimensions for Figure 11 “Tape outline, carrier tape X3T-OH048”
Item
Symbol
Specification
Dimension [mm]
Tolerance
Overall dimensions
Tape width
W
8
0.1
Thickness
K
 1.2
-
Distance
G
 0.75
-
Diameter
D0
1.5
0.1
Distance
E
1.75
0.1
Pitch[1]
P0
4
0.1
Length direction
P2
2
0.05
Width direction
F
3.5
0.05
Length
A0
1.4
0.05
Width
B0
1.4
0.05
Depth
K0
0.8
0.05
Hole diameter
D1
0.5
0.1
Pitch
P
4
0.1
Sprocket holes
Distance between center lines
Compartments
Device
Outline
X3T-OH048
Rotation

 20
-
T
0.25
0.07
Carrier tape antistatic
Film thickness[2]
X3G_T_OH047_048
Product specification
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Rev. 1 — 4 April 2011
© NXP B.V. 2011. All rights reserved.
13 of 19
X3G-OH047/8; X3T-OH047/8
NXP Semiconductors
Magnetic field sensor
Table 11.
Dimensions for Figure 11 “Tape outline, carrier tape X3T-OH048” …continued
Item
Symbol
Specification
Dimension [mm]
Tolerance
Cover tape
Width
W1
 5.75
-
Film thickness
T1
 0.1
-
R
 30
-
Bending radius
In winding direction
[1]
Cumulate pitch error 0.2 over 10 pitch.
[2]
Carbon loaded polystyrene 100 % recyclable.
section
A-A
P2/P3
K0
P1
T
D1
Θ
A
B
T1
B
G
B0
W1
W
F0/F2
E
A
D0
pad 1
D
δ
P0
section
B-B
δ
detail Z
50:1
Z
A0
feed direction
measurement method of
compartment dimensions
019aab729
Fig 12. Tape outline, carrier tape X3T-OH047
Table 12.
Dimensions for Figure 12 “Tape outline, carrier tape X3T-OH047”
Item
Symbol
Specification
Dimension [mm]
Tolerance
Overall dimensions
Tape width
W
8
0.1
Distance
G
 0.75
-
Diameter
D0
1.5
0.1
Distance
E
1.75
0.1
Pitch[1]
P0
4
0.1
Sprocket holes
X3G_T_OH047_048
Product specification
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Rev. 1 — 4 April 2011
© NXP B.V. 2011. All rights reserved.
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X3G-OH047/8; X3T-OH047/8
NXP Semiconductors
Magnetic field sensor
Table 12.
Dimensions for Figure 12 “Tape outline, carrier tape X3T-OH047” …continued
Item
Symbol
Specification
Dimension [mm]
Tolerance
Distance between center lines
Sprocket hole / cavity center
P2
2
0.05
Sprocket hole / cavity hole
P3
2
0.05
Sprocket hole / cavity center
F0
3.5
0.05
Sprocket hole / cavity hole
F2
3.5
0.05
Length
A0
1.4
0.05
Width overall
B0
2.7
0.05
Depth
K0
0.5
0.05
Hole diameter
D1
0.5
0.1
Pitch
P1
4
0.1
Compartments
Device
Outline
X3T-OH047
Rotation

 15
-
Film thickness[2]
T
0.25
0.07
Bend

 0.3
-
Width
W1
5.3
0.1
Film thickness
T1
0.05
0.01
R
 30
-
Carrier tape antistatic
Cover tape
Bending radius
In winding direction
X3G_T_OH047_048
Product specification
[1]
Cumulate pitch error 0.2 over 10 pitch.
[2]
Carbon loaded polystyrene 100 % recyclable.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 4 April 2011
© NXP B.V. 2011. All rights reserved.
15 of 19
X3G-OH047/8; X3T-OH047/8
NXP Semiconductors
Magnetic field sensor
K0
P10
P0
D0
camber
T
P2/P3
E1
F0/F2
W
B0
D1
A0
P1
diagonale
pad 1
019aab734
Fig 13. Chip position and pad 1 location for X3T-OH048
pad 1
019aab733
Fig 14. Chip position and pad 1 location for X3T-OH047
9. Revision history
Table 13.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
X3G_T_OH047_048 v.1
20110404
Product specification
-
-
X3G_T_OH047_048
Product specification
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Rev. 1 — 4 April 2011
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16 of 19
X3G-OH047/8; X3T-OH047/8
NXP Semiconductors
Magnetic field sensor
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
10.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. The product is not designed, authorized or warranted to be
X3G_T_OH047_048
Product specification
suitable for use in medical, military, aircraft, space or life support equipment,
nor in applications where failure or malfunction of an NXP Semiconductors
product can reasonably be expected to result in personal injury, death or
severe property or environmental damage. NXP Semiconductors accepts no
liability for inclusion and/or use of NXP Semiconductors products in such
equipment or applications and therefore such inclusion and/or use is at the
customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 4 April 2011
© NXP B.V. 2011. All rights reserved.
17 of 19
X3G-OH047/8; X3T-OH047/8
NXP Semiconductors
Magnetic field sensor
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
X3G_T_OH047_048
Product specification
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 4 April 2011
© NXP B.V. 2011. All rights reserved.
18 of 19
NXP Semiconductors
X3G-OH047/8; X3T-OH047/8
Magnetic field sensor
12. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
8.2
9
10
10.1
10.2
10.3
10.4
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 4
Circuit diagram . . . . . . . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Bare die outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Packing information . . . . . . . . . . . . . . . . . . . . . 9
Tape construction for X3G-OH047 and
X3G-OH048 . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Carrier tape for X3T-OH047 and X3T-OH048. 13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Contact information. . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 4 April 2011
Document identifier: X3G_T_OH047_048
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