Data Sheet

62
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KMI17/4
Rotational speed sensor
Rev. 1 — 1 September 2014
Product data sheet
1. Product profile
1.1 General description
Based on the Anisotropic MagnetoResistive (AMR) effect, the KMI17/4 detects the
rotational speed of passive target wheels (i.e. having ferromagnetic teeth). This design
delivers secure speed information over a wide range of speed, air gap and temperature.
It delivers the speed information via a current protocol at the supply pins.
CAUTION
Do not press two or more products together against their magnetic forces.
1.2 Features and benefits








System in package
Two wire standard current interface
Large range of operating terminal voltage
Wide temperature range
High ElectroStatic Discharge (ESD) protection
Very low jitter
Automotive qualified in accordance with AEC-Q100 Rev-G (grade 0)
Customer Production Test Mode (CPTM)
1.3 Quick reference data
Table 1.
Quick reference data
Symbol Parameter
Conditions
Min
Typ
Max
Unit
VCC
supply voltage
normal operation mode;
Tamb  175 C;
referred to pin GND
4.5
-
16
V
normal operation mode
Tamb
ambient temperature
40
-
+150
C
ICCL
LOW-level supply current
5.88
7.0
8.4
mA
ICCH
HIGH-level supply current
11.76
14.0
16.8
mA
fo
output frequency
normal operation mode
0
-
20
kHz
dST
start-up air gap of
encoder wheel to sensor
surface
after power-on;
at start-up of encoder
wheel
0.5
-
2.4
mm
KMI17/4
NXP Semiconductors
Rotational speed sensor
2. Pinning information
Table 2.
Pinning
Pin
Symbol
Description
1
VCC
supply pin
2
GND
ground pin
Simplified outline
3. Ordering information
Table 3.
Ordering information
Type number Package
Name Description
KMI17/4
KMI17_4
Product data sheet
SIP2
Version
plastic single-ended multi-chip package; magnetized ferrite
SOT453E
magnet (4.25  5.2  3 mm); 4 interconnections; 2 in-line leads
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 September 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
2 of 16
KMI17/4
NXP Semiconductors
Rotational speed sensor
4. Functional diagram
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Fig 1.
Functional diagram of KMI17/4
5. Functional description
5.1 Functional principle
The KMI17/4 is sensitive to the motion of ferrous gear wheels. The functional principle is
shown in Figure 2. Due to the effect of flux bending, the different directions of magnetic
field lines in the MR sensor element cause an electrical signal. Because of the chosen
sensor orientation and the direction of ferrite magnetization the KMI17/4 is sensitive to
movement in the y direction in front of the sensor only; also see Figure 3.
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Fig 2.
Functional principle
KMI17_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 September 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
3 of 16
KMI17/4
NXP Semiconductors
Rotational speed sensor
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Fig 3.
Definition of coordinate system
The KMI17/4 comprises an MR sensor element and an Application-Specific Integrated
Circuit (ASIC) for signal conditioning (see Figure 1). Within the ASIC, the sinusoidal signal
coming from the MR element is amplified and passed to a Schmitt-trigger. The later
provides a conversion of the sinusoidal sensor signal into a rectangular output signal.
At the output pins, this rectangular output signal is provided as a modulation of the supply
current between a low level of 7 mA typically and a high level of 14 mA typically
(see Figure 4). With this current interface, safe sensor signal transport to the detection
circuit by using only a two-wire cable is provided. An integrated capacitor between the
supply terminals provides superior performance of the sensor concerning immunity to and
emission of electromagnetic disturbances.
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7
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P$
WS
W
tp
output duty cycle:  o = ----  100 %
T
Fig 4.
Output as a function of time
The offset control unit provides compensation of voltage offsets, which are included in the
MR bridge output due to fabrication tolerances. Therefore, during final test of each device,
this offset is measured at two different temperatures and stored in the non-volatile
memory. In combination with an on-chip temperature sensor, this two-point calibration
allows compensation of the temperature-dependent MR bridge offset.
Figure 7 shows a typical test and application circuit, where resistor RL provides the
conversion of the current signal into a voltage signal at the detection circuit.
KMI17_4
Product data sheet
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Rev. 1 — 1 September 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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KMI17/4
NXP Semiconductors
Rotational speed sensor
5.2 Modes of operation
5.2.1 Start-up mode
When supply voltage has been applied between terminals VCC and GND, all circuit parts
of the KMI17/4 are set into a defined initial state. The offset control unit instantly applies
an offset compensation voltage to the signal input. It is derived from the respective
content of the non-volatile memory and the device temperature. The device then enters
the normal operation mode.
5.2.2 Normal operation mode
During normal operation mode, the temperature-dependent offset is continuously
compensated, based on the actual chip temperature. For signal frequencies greater than
1 Hz, the offset compensation changes only by 1 bit per signal period. Therefore,
additional jitter is limited. For frequencies below 1 Hz offset changes are compensated
instantly. At signal frequencies greater than 16 Hz a duty cycle-dependent offset control
loop is activated. This control loop monitors the duty cycle of the output signal, which
should ideally (i.e. without offset) be at 50 %. In order to maintain a duty cycle of 50 %, the
offset compensation is controlled. Using this measure, offsets due to external magnetic
fields or eddy currents are compensated.
5.2.3 CPTM
CPTM is a test mode, that allows the air gap safety margin to be measured for a KMI17/4,
when mounted in the application. CPTM is entered, when a negative supply voltage
(VCC) is applied to the sensor. The characteristic feature of CPTM is, that by variation of
VCC a variable offset voltage is added to the sensor voltage within the ASIC. This offset
voltage in turn corresponds to an equivalent magnetic offset field (Heq).
Practically, in the CPTM and while the encoder wheel is rotating, VCC should be varied,
until the sensor device is just at the edge of failure. The edge of failure is just before
output pulses disappear. The value of VCC, adjusted to reach this state, corresponds to
the safety margin regarding magnetic offset (Heq). The relation VCC versus Heq is device
type specific. Finally, the magnetic offset margin corresponds to an air gap margin. The
relation between magnetic offset and air gap depends on the type of encoder used.
Figure 5 shows the characteristic of Heq versus VCC in principle.
KMI17_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 September 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
5 of 16
KMI17/4
NXP Semiconductors
Rotational speed sensor
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Fig 5.
Equivalent magnetic field strength versus supply voltage in Customer Production
Test Mode (CPTM)
6. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referred to
pin GND.
Symbol
Parameter
Conditions
Min
Max
Unit
VCC
supply voltage
normal operation mode
40 C < Tamb < +60 C;
lifetime mission profile
-
18
V
40 C < Tamb < +60 C;
5 minutes
-
28
V
40 C < Tamb < +150 C;
lifetime mission profile
-
16
V
150 C < Tamb < 175 C;
12  10 minutes total
-
16
V
28
-
V
40
+150
C
peak value; VCC < 16 V;
12  10 minutes total
40
+175
C
40 C < Tamb < +175 C
-
30
kA/m
CPTM; 10 C < Tamb < 50 C
Tamb
Hext
KMI17_4
Product data sheet
ambient temperature
external magnetic field
strength
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 September 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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KMI17/4
NXP Semiconductors
Rotational speed sensor
7. Recommended operating conditions
Table 5.
Operating conditions
The encoder is a ferromagnetic gear wheel with a module of 2.1 mm. The module m of a gear wheel is defined as the ratio of
outer diameter D and number of teeth N (m = D/N).
Symbol
Parameter
Conditions
Min
Max
Unit
VCC
supply voltage
normal operation mode;
Tamb  175 C; referred to pin GND
4.5
16
V
CPTM
27
5
V
50
75

RL
load resistance
CL
load capacitance
Tamb
ambient temperature
fo
output frequency
-
22
nF
normal operation mode
40
+150
C
CPTM
10
50
C
normal operation mode
0
20
kHz
CPTM
-
2.5
kHz
8. Characteristics
Table 6.
Characteristics
Characteristics are valid for the operating conditions specified in Section 7; voltages are referred to pin GND; unless
otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Normal operation mode
VCC(swon)
switch-on supply voltage
[1]
-
-
4.5
V
td(on)
turn-on delay time
[2]
-
-
1
ms
VCC(swoff)
switch-off supply voltage
ICC = ICCH
[1]
-
-
3.8
V
ICC = ICCL
[1]
-
-
4.27
V
ICC(swoff)
switch-off supply current
2.5
-
4.0
mA
ICCL
LOW-level supply current
5.88
7.0
8.4
mA
ICCH
HIGH-level supply current
11.76
14.0
16.8
mA
ICCH/ICCL
HIGH-level supply current to
LOW-level supply current ratio
1.8
2.0
2.2
-
Citg
integrated capacitance
between supply
terminals
-
2.2
-
nF
Hth
magnetic field strength threshold
(absolute value)
in y direction; including
hysteresis and offset
-
-
300
A/m
dICC/dt
rate of change of supply current
ICCL to ICCH
(10 % to 90 % and
90 % to 10 %);
RL = 50 ; no CL
6
-
28
mA/s
o
output duty cycle
H in y direction
> 500 A/m
30
-
70
%
fo
output frequency
normal operation mode
0
-
20
kHz
CPTM
-
-
2.5
kHz
KMI17_4
Product data sheet
VCC < 4 V
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 September 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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KMI17/4
NXP Semiconductors
Rotational speed sensor
Table 6.
Characteristics …continued
Characteristics are valid for the operating conditions specified in Section 7; voltages are referred to pin GND; unless
otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
module[3]
Period jitter with ideal ferromagnetic encoder with a
of 2.1 mm minimum and track width = 10 mm. The sensor
reading point is located within a distance x of 1 mm next to the center of the encoder track; see Figure 6
(T)
period jitter
low-field; RMS value;
due to noise at large air
gaps; H in y direction
= 500 A/m
[4]
-
-
0.5
%
high-field; RMS value;
due to noise; H in
y direction = 2500 A/m;
fo < 2.5 kHz
[4]
-
-
0.1
%
Air gap with ideal ferromagnetic encoder with a module[3] of 2.1 mm minimum and track width = 10 mm. The sensor reading
point is located within a distance x of 1 mm next to the center of the encoder track; see Figure 6
dST
start-up air gap of encoder wheel after power-on;
to sensor surface
at start-up of encoder
wheel
0.5
-
2.4
mm
d
air gap of encoder wheel to
sensor surface
in normal mode after
10 wheel rotations
0.5
-
2.8
mm
Heq = 0 A/m
16
15.5
15
V
Customer Production Test Mode (CPTM)
VCC(zo)
zero offset supply voltage
ICCL
LOW-level supply current
4.0
3.5
-
mA
ICCH
HIGH-level supply current
8.4
7
6.02
mA
H/VCC
magnetic field strength variation
with supply voltage
50
52
56
(A/m)/V
see Figure 5
[1]
Once VCC has exceeded VCC(swon), the sensor switches on and current levels and current ratios are maintained until VCC falls below
VCC(swoff).
[2]
After supplying more than VCC(swon) to the device, it needs a turn-on delay time of td(on) to reach stable operation. A stable supply current
indicates stable operation.
[3]
Module m of the gear wheel is defined as the ratio of outer diameter D and number of teeth N: m = D/N.
[4]
RMS value measured as spread of the delay between zero-crossing of the magnetic field and output of the associated speed pulse.
Extra jitter is possible due to disturbances on the supply line and other non-ideal conditions.
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Fig 6.
Sensor positioning
KMI17_4
Product data sheet
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Rev. 1 — 1 September 2014
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KMI17/4
NXP Semiconductors
Rotational speed sensor
9. Electromagnetic compatibility
The following tests have verified EMC:
9.1 Emission
CISPR25: radiated emission, Absorber-Lined Shielded Enclosure (ALSE) method.
9.2 Immunity to electrical transients
Tests were carried out with external protection circuit.
• ISO 7637-2 (second edition 2004): electrical transient conduction on supply lines;
test pulses 1, 2a, 3a, 3b and 5a
• ISO 7637-3: electrical transient transmission by capacitive and inductive coupling
9.3 Immunity to radiated disturbances
• ISO 11452-2: antenna in absorber lined shielded enclosure
• ISO 11452-4: Bulk Current Injection (BCI)
– Substitution method and closed loop method
• ISO 11452-5: strip line
• ISO 11452-7: Direct Power Injection (DPI)
– Differential mode and common mode
10. ElectroStatic Discharge (ESD)
The following tests have verified ESD in accordance with ISO 10605:
10.1 Powered contact discharge
16 kV (C = 330 pF, R = 2 k), function performance status II
10.2 Unpowered contact discharge
25 kV (C = 150 pF, R = 330 ), function performance status III
10.3 Powered air discharge
8 kV (C = 330 pF, R = 330 ), function performance status II
10.4 Unpowered air discharge
25 kV (C = 330 pF, R = 330 ), function performance status III
KMI17_4
Product data sheet
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Rev. 1 — 1 September 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
9 of 16
KMI17/4
NXP Semiconductors
Rotational speed sensor
11. Application information
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Fig 7.
Test and application circuit
12. Test information
12.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q100 Rev-G - Failure mechanism based stress test qualification for
integrated circuits, and is suitable for use in automotive applications.
KMI17_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 September 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
10 of 16
KMI17/4
NXP Semiconductors
Rotational speed sensor
13. Marking
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A: leading letters of type number (6 characters max.)
B: day code/date code
X: product manufacturing code; m for manufacturing Manila
YYY: day of year
Z: year of production (last figure)
C: moving direction
2D matrix code: norm: ISO/IEC DIS 16022/ECC 200; matrix dimension 12 dots  12 dots; matrix
field size approximately 1.62 mm  1.62 mm. The 2D code defines a unique identification number,
which is linked in a data base to the different batch numbers and test results.
Fig 8.
KMI17_4
Product data sheet
Marking
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Rev. 1 — 1 September 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
11 of 16
KMI17/4
NXP Semiconductors
Rotational speed sensor
14. Package outline
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Package outline SOT453E
KMI17_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 September 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
12 of 16
KMI17/4
NXP Semiconductors
Rotational speed sensor
15. Handling information
5PLQ
DDD
Dimensions in mm
(1) No bending allowed.
(2) Plastic body and interface plastic body - leads: application of bending forces not allowed.
Fig 10. Bending recommendation
16. Solderability information
Recommended soldering process for leaded devices is wave soldering. The maximum
soldering temperature is 260 C for maximum 5 s.
17. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
KMI17_4 v.1
20140901
Product data sheet
-
-
KMI17_4
Product data sheet
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Rev. 1 — 1 September 2014
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13 of 16
KMI17/4
NXP Semiconductors
Rotational speed sensor
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
KMI17_4
Product data sheet
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 September 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
14 of 16
KMI17/4
NXP Semiconductors
Rotational speed sensor
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
18.4 Trademarks
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
KMI17_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 September 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
15 of 16
KMI17/4
NXP Semiconductors
Rotational speed sensor
20. Contents
1
1.1
1.2
1.3
2
3
4
5
5.1
5.2
5.2.1
5.2.2
5.2.3
6
7
8
9
9.1
9.2
9.3
10
10.1
10.2
10.3
10.4
11
12
12.1
13
14
15
16
17
18
18.1
18.2
18.3
18.4
19
20
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Functional principle. . . . . . . . . . . . . . . . . . . . . . 3
Modes of operation . . . . . . . . . . . . . . . . . . . . . . 5
Start-up mode . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Normal operation mode . . . . . . . . . . . . . . . . . . 5
CPTM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Recommended operating conditions. . . . . . . . 7
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Electromagnetic compatibility . . . . . . . . . . . . . 9
Emission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Immunity to electrical transients . . . . . . . . . . . . 9
Immunity to radiated disturbances . . . . . . . . . . 9
ElectroStatic Discharge (ESD) . . . . . . . . . . . . . 9
Powered contact discharge . . . . . . . . . . . . . . . 9
Unpowered contact discharge . . . . . . . . . . . . . 9
Powered air discharge . . . . . . . . . . . . . . . . . . . 9
Unpowered air discharge . . . . . . . . . . . . . . . . . 9
Application information. . . . . . . . . . . . . . . . . . 10
Test information . . . . . . . . . . . . . . . . . . . . . . . . 10
Quality information . . . . . . . . . . . . . . . . . . . . . 10
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
Handling information. . . . . . . . . . . . . . . . . . . . 13
Solderability information. . . . . . . . . . . . . . . . . 13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Contact information. . . . . . . . . . . . . . . . . . . . . 15
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 1 September 2014
Document identifier: KMI17_4