943AE

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
HSOP28HC (375mil)
CASE 943AE
ISSUE A
DATE 08 NOV 2013
15.55 MAX
15.2±0.1
0~10°
(6.2)
1 2
2.0
0.8
0.3±0.1
HEAT
SPREADER
0.65±0.2
10.5±0.3
0.25
0.12
+0.1
−0.05
2.7±0.1
0.10
0.1±0.1 (2.25)
2.45 MAX
(0.8)
7.9±0.1
(4.9)
28
1.15
SOLDERING FOOTPRINT*
9.75
(Unit: mm)
0.80
0.42
NOTES:
1. The measurements are not to guarantee but for reference only.
2. Land pattern design in Fin area to be altered in response to customers’ individual application.
*For additional information on our Pb−Free strategy and soldering details, please download the
ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON65469E
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
HSOP28HC (375 MIL)
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON65469E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION FROM SANYO ENACT# S−034 TO
ON SEMICONDUCTOR. REQ. BY D. TRUHITTE.
30 NOV 2011
A
ADDED SOLDER FOOTPRINT INFORMATION. REQ. BY D. TRUHITTE.
08 NOV 2013
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
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© Semiconductor Components Industries, LLC, 2013
November, 2013 − Rev. A
Case Outline Number:
943AE
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