944AB

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
HSSOP48 (375mil)
CASE 944AB
ISSUE A
DATE 31 OCT 2013
18.15 MAX
17.8±0.1
0~10°
0.65
1.3
0.2±0.1
HEAT
SPREADER
0.65±0.2
10.5±0.3
(4.9)
12
7.9±0.1
(6.2)
48
+0.1
0.2 −0.05
0.12
1.5±0.1
0.10
0.1±0.1
(2.2)
2.4 MAX
(0.45)
GENERIC
MARKING DIAGRAM*
XXXXXXXXXX
YMDDD
XXXXX = Specific Device Code
Y = Year
M = Month
DDD = Additional Traceability Data
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER:
STATUS:
98AON65471E
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
HSSOP48 (375 MIL)
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON65471E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION FROM SANYO ENACT# S−249 TO ON
SEMICONDUCTOR. REQ. BY D. TRUHITTE.
30 NOV 2011
A
ADDED GENERIC MARKING DIAGRAM. REQ. BY D. TRUHITTE
31 OCT 2013
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
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© Semiconductor Components Industries, LLC, 2013
October, 2013 − Rev. A
Case Outline Number:
944AB