751CH

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC30 W / MFP30KR (375 mil)
CASE 751CH
ISSUE A
DATE 08 NOV 2013
15.55 MAX
0~10°
LASER MARKED
INDEX
(4.4)
7.9±0.1
(5.1)
1 2
0.65±0.2
30
10.5±0.3
15.2±0.1
+0.15
0.35 −0.05
1.0
0.15
+0.15
−0.05
(2.25)
2.45 MAX
(0.6)
0.25
0.1±0.1
S
0.10 S
9.75
(Unit: mm)
1.15
SOLDERING FOOTPRINT*
1.00
0.50
NOTE: The measurements are not to guarantee but for reference only.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
98AON67230E
ON SEMICONDUCTOR STANDARD
http://onsemi.com
SOIC30 W / MFP30KR (375 MIL)
1
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON67230E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION FROM SANYO ENACT# S−473 TO
ON SEMICONDUCTOR. REQ. BY D. TRUHITTE.
29 FEB 2012
A
ADDED SOLDER FOOTPRINT INFORMATION. REQ. BY D. TRUHITTE.
08 NOV 2013
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
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© Semiconductor Components Industries, LLC, 2013
November, 2013 − Rev. A
Case Outline Number:
751CH