751CH

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC30 W / MFP30KR (375 mil)
CASE 751CH
ISSUE A
DATE 08 NOV 2013
15.55 MAX
0~10°
LASER MARKED
INDEX
(4.4)
7.9±0.1
(5.1)
1 2
0.65±0.2
30
10.5±0.3
15.2±0.1
+0.15
0.35 −0.05
1.0
0.15
+0.15
−0.05
(2.25)
2.45 MAX
(0.6)
0.25
0.1±0.1
S
0.10 S
9.75
(Unit: mm)
1.15
SOLDERING FOOTPRINT*
1.00
0.50
NOTE: The measurements are not to guarantee but for reference only.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
98AON67230E
ON SEMICONDUCTOR STANDARD
http://onsemi.com
SOIC30 W / MFP30KR (375 MIL)
1
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON67230E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION FROM SANYO ENACT# S−473 TO
ON SEMICONDUCTOR. REQ. BY D. TRUHITTE.
29 FEB 2012
A
ADDED SOLDER FOOTPRINT INFORMATION. REQ. BY D. TRUHITTE.
08 NOV 2013
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
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any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
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© Semiconductor Components Industries, LLC, 2013
November, 2013 − Rev. A
Case Outline Number:
751CH
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