CD214A-F Serial SMA MDS

MATERIAL DECLARATION SHEET
Material Number
CD214A-F Serial
Product Line
Semiconductor Products
Compliance Date
RoHS Compliant
No.
Construction
Element(subpart)
2005/03/04
Yes
MSL
Homogeneous
Material
1
Material
weight
[mg]
1
Solder wafer
Metal
1.72
2
Dice
Metal
2.37
3
Molding compound
Plastic
38.83
4
Lead Wire
Metal
20.98
5
Plating
Metal
0.1
Total weight
64.0
This Document was updated on:
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Homogeneous
Material\
Substances
Lead *3
Tin
Silver
Silicon
Nickel
Aluminum
Lead*4
Phosphorus
Boron
Other trace metals
Silica
Epoxy Resin
Phenol Resin
Antimony trioxide
Copper
Misc not to declare
Tin
Misc not to declare
CASRN
if applicable
Materials
Mass %
7439-92-1
7440-31-5
7440-22-4
7440-21-3
7440-02-0
7429-90-5
7439-92-1
7723-14-0
7440-42-8
14808-60-7
29690-82-2
9003-35-4
1309-64-4
7440-50-8
7440-31-5
-
92.5
5
2.5
73.54
1.99
0.56
14.80
0.249
0.874
7.987
70
20
8
2
>99.0
<1.0
>99.0
<1.0
Material
Mass % of
total unit wt.
2.49
0.13
0.07
2.720
0.074
0.021
0.548
0.009
0.032
0.296
42.47
12.13
4.85
1.21
32.45
0.33
0.16
0.002
Subpart
mass of total
wt. (%)
2.69
3.7
60.67
32.78
0.16
2015/11/03
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CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
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MATERIAL DECLARATION SHEET
Important remarks:
1.
It is the responsibility of the user to verify they are accessing the latest version.
2. *:Excepted for RoHS 7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more
lead);
3. *:Excepted for RoHS 7(c) I-Electrical and electronic components containing lead in a glass or ceramic other then dielectric ceramic in
capacitors,e.g.piezoelectronic devices, or in a glass or ceramic matrix compound;
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