CD214A-T5.0A T170A T5.0CA T130CA MDS

MATERIAL DECLARATION SHEET
Material Number
Product Line
Compliance Date
RoHS Compliant
No.
Construction
Element(subpart)
CD214A-T5.0A~170A,CD214A-T5.0CA~130CA
Semiconductor Products
2011/01/01
YES
MSL
1
Homogeneous
Material
Material
weight [mg]
1
Dice
Silicon
1.330
2
High-melting point
Solder paste
Solder paste
2.003
Homogeneous
Material\
Substances
Silicon
Phosphorus
Boron
Nickel
Lead
Silicon dioxide
Aluminum oxide
Tin
Lead
Silver
Copper
3
Lead frame
Copper
27.5
4
Molding
compound
Epoxy material
31.035
5
Plating
Matte-100% tin
Total weight
0.663
62.531
This Document was updated on:
Iron
Phosphorus
Silica
Epoxy resin
Phenolic resin-A,B
Hydroxide metal
Carbon black
Tin
CASRN
if applicable
7440-21-3
7723-14-0
7440-42-8
7440-02-0
7439-92-1
7631-86-9
1344-28-1
7440-31-5
7439-92-1
7440-22-4
7440-50-8
7439-89-6
7723-14-0
14808-60-7
25928-94-3
9003-35-4
N/A
1333-86-4
7440-315
Materials
Mass %
60.18
0.01
0.01
14.8
12.5
10.0
2.5
5
92.5
2.5
99.8
0.15
0.05
76
9
8
6
1
100
Material Mass
Subpart
% of total unit mass of total
wt.
wt. (%)
1.28
0.0002
0.0002
0.3148
0.2659
0.2127
0.0532
0.16
2.963
0.08
43.89
0.066
0.022
37.72
4.467
3.971
2.978
0.496
1.06
2.127
3.203
43.978
49.632
1.06
2015/02/09
(EU) RoHS Directive 2011/65/EU ANNEX Application of lead which are exempted from the requirements
7(a) Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead)
7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix
compound.
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