CD214A-T150CA~T170CA MDS

MATERIAL DECLARATION SHEET
Material Number
Product Line
Compliance Date
RoHS Compliant
No.
CD214A-T150CA~170CA
Semiconductor Products
2011/01/01
YES
MSL
Homogeneous Material
Construction
Material
weight [mg]
Element(subpart)
1
Dice
Silicon
2.560
2
High-melting point
Solder paste
Solder paste
2.777
3
Lead frame
Copper
27.50
4
Plating
Homogeneous
Material\
Substances
Silicon
Phosphorus
Boron
Nickel
Lead
Silicon dioxide
Aluminum oxide
Tin
Lead
Silver
Copper
30.25
Iron
Phosphorus
Silica
Epoxy resin
Phenolic resin-A,B
Matte-100% tin
0.663
Carbon
Tin
Total weight
63.75
Molding compound Epoxy material
5
1
CASRN
if applicable
Materials
Mass %
7440-21-3
7723-14-0
7440-42-8
7440-02-0
7439-92-1
7631-86-9
1344-28-1
7440-31-5
7439-92-1
7440-22-4
7440-50-8
7439-89-6
7723-14-0
14808-60-7
25928-94-3
9003-35-4
60.18
0.01
0.01
14.80
12.50
10.00
2.50
5.00
92.50
2.50
99.80
0.15
0.05
76.00
9.00
8.00
N/A
6.00
1333-86-4
7440-315
1.00
100
Hydroxide metal
Material Mass
Subpart mass
% of total unit
of total wt. (%)
wt.
2.417
0.0004
0.0004
0.5943
4.01
0.502
0.4016
0.1004
0.218
4.03
4.36
0.109
43.051
43.14
0.065
0.022
36.063
4.271
3.796
47.45
2.847
0.475
1.04
1.04
This Document was updated on: 2015/02/09
(EU) RoHS Directive 2011/65/EU ANNEX Application of lead which are exempted from the requirements
7(a) Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead)
7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix
compound.
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