943AC

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
HSOP36 (375mil)
CASE 943AC
ISSUE A
DATE 08 NOV 2013
18.15 MAX
17.8±0.1
0~10°
0.8
2.0
0.3±0.1
HEAT
SPREADER
0.65±0.2
+0.1
0.25 −0.05
0.12
0.10
2.7±0.1
0.1±0.1
(2.25)
2.45 MAX
(0.5)
10.5±0.3
(4.9)
12
7.9±0.1
(6.2)
36
GENERIC
MARKING DIAGRAM*
XXXXXXXXXX
YMDDD
XXXXX = Specific Device Code
Y = Year
M = Month
DDD = Additional Traceability Data
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER:
STATUS:
98AON65466E
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
HSOP36 (375 MIL)
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
3
1.15
SOLDERING FOOTPRINT*
(Unit: mm)
9.75
(4.9)
(6.2)
0.80
0.42
NOTES:
1. The measurements are for reference only, and unable to guarantee.
2. Please take appropriate action to design the actual Exposed Die Pad and Fin portion.
3. After setting, verification on the product must be done.
(Although there are no recommended design for Exposed Die Pad and Fin portion Metal mask and shape
for Through−Hole pitch (Pitch & Via etc), checking the soldered joint condition and reliability verification of
soldered joint will be needed. Void G gradient G insufficient thickness of soldered joint or bond degradation
could lead IC destruction because thermal conduction to substrate becomes poor.)
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor
Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON65466E
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
HSOP36 (375 MIL)
http://onsemi.com
2
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 2 OFXXX
3
DOCUMENT NUMBER:
98AON65466E
PAGE 3 OF 3
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION FROM SANYO ENACT# S−035 TO ON
SEMICONDUCTOR. REQ. BY D. TRUHITTE.
30 NOV 2011
A
ADDED MARKING AND SOLDER FOOTPRINT INFORMATION. REQ. BY D.
TRUHITTE.
08 NOV 2013
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
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© Semiconductor Components Industries, LLC, 2013
November, 2013 − Rev. A
Case Outline Number:
943AC
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