REVISIONS LTR DATE (YR-MO-DA) APPROVED A Make change to 1.2.4 and power dissipation as specified under 1.3. - ro DESCRIPTION 99-06-09 R. MONNIN B Add appendix A. - ro 01-09-10 R. MONNIN C Add dose rate footnote under paragraph 1.5 and table I. Delete Neutron testing and Dose rate induced latchup testing. - ro 05-11-02 R. MONNIN D Add case outline X. Make changes to 1.2.4, 1.3 and figure 1. -rrp 09-03-09 R. HEBER E Delete figure 2, Radiation circuit and make change to paragraph 3.2.3. Delete references to device class M requirements. Update document paragraphs to current MIL-PRF-38535 requirements. - ro 16-06-02 C. SAFFLE REV SHEET REV E E E SHEET 15 16 17 REV STATUS REV E E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RICK OFFICER STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http://www.landandmaritime.dla.mil CHECKED BY RAJESH PITHADIA APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A MICHAEL FRYE DRAWING APPROVAL DATE 96-02-21 REVISION LEVEL E MICROCIRCUIT, LINEAR, RADIATION HARDENED, HIGH SPEED, LOW POWER, CURRENT FEEDBACK AMPLIFIER WITH PROGRAMMABLE OUTPUT LIMITING, MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 5962-96767 1 OF 17 5962-E374-16 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 F 96767 Federal stock class designator \ RHA designator (see 1.2.1) 01 V P C Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 Circuit function HS1135RH Radiation hardened D.I., high speed, low power, current feedback amplifier with programmable output limiting 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter X P Descriptive designator CDFP3-F14 GDIP1-T8 or CDIP2-T8 Terminals 14 8 Package style Flat pack Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-96767 A REVISION LEVEL E SHEET 2 1.3 Absolute maximum ratings. 1/ Voltage between +VS and –VS ..................................................................................... Differential input voltage ............................................................................................... Voltage at either input terminal ..................................................................................... Output current ............................................................................................................... Output current (50% duty cycle) .................................................................................... Maximum package power dissipation at TA = +125C (PD): Case X ....................................................................................................................... Case P ....................................................................................................................... Junction temperature (TJ) ............................................................................................. Storage temperature range (TSTG) ............................................................................... Lead temperature (soldering, 10 seconds) .................................................................... Thermal resistance, junction-to-case (JC): Case X ....................................................................................................................... Case P ....................................................................................................................... Thermal resistance, junction-to-ambient (JA) .............................................................. Case X ....................................................................................................................... Case P ....................................................................................................................... 12 V dc 5 V dc +VS to –VS Short circuit protected 2/ 60 mA 2/ 0.45 W 3/ 0.44 W 3/ +175C -65C to +150C +300C 25C/W 30C/W 115C/W 110C/W 115C/W 1.4 Recommended operating conditions. Operating supply voltage (VS) .................................................................................... 5 V Load resistance (RL) ..................................................................................................... 50 Ambient operating temperature range (TA) ................................................................... -55C to +125C 1.5 Radiation features. Maximum total dose available (dose rate = 50 – 300 rads(Si)/s) .................................. 300 krads (Si) 4/ _____ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Output is short circuit protected to ground. Brief short circuits to ground will not degrade reliability, however continuous (100% duty cycle) output current must not exceed 30 mA for maximum reliability. 3/ If device power exceeds package dissipation capability, provide heat sinking or derate linearly (the derating is based on JA) at the following rate of 8.7 mW/C for case outline P, or 9.1 mWC for case outline X. 4/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method 1019, condition A. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-96767 A REVISION LEVEL E SHEET 3 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this document. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-96767 A REVISION LEVEL E SHEET 4 TABLE I. Electrical performance characteristics. Test Conditions 1/ -55C TA +125C Symbol VS = 5 V Group A subgroups Device type 1 All unless otherwise specified Input offset voltage VIO VCM = 0 V M,D,P,L,R,F 2/ 3/ Common mode rejection CMRR ratio Limits Min -5 Unit Max 5 2,3 -10 10 1 -10 10 VCM = 1.8 V, 1 +V = 3.2 V, -V = -6.8 V, +V = 6.8 V, -V = -3.2 V 2 44 3 44 1 44 All 47 mV dB VCM = 1.2 V, +V = 3.8 V, -V = -6.2 V, +V = 6.2 V, -V = -3.8 V M,D,P,L,R,F 2/ 3/ Power supply rejection PSRRP ratio VS = 1.8 V, 1 +V = 6.8 V, -V = -5 V, +V = 3.2 V, -V = -5 V 2 46 3 46 1 46 VS = 1.8 V, 1 50 +V = 5 V, -V = -6.8 V, +V = 5 V, -V = -3.2 V 2 46 3 46 1 46 All 50 dB VS = 1.2 V, +V = 6.2 V, -V = -5 V, +V = 3.8 V, -V = -5 V M,D,P,L,R,F 2/ 3/ PSRRN VS = 1.2 V, +V = 5 V, -V = -6.2, +V = 5 V, -V = -3.8 V M,D,P,L,R,F 2/ 3/ Non-inverting input IBSP 1 VCM = 0 V (+IN) current M,D,P,L,R,F 2/ 3/ +IN current common CMSIBP mode sensitivity All -15 15 2,3 -25 25 1 -25 25 VCM = 1.8 V, 1 +V = 3.2 V, -V = -6.8 V, +V = 6.8 V, -V = -3.2 V 2 2.85 3 2.85 1 2.85 All 1.25 A A/V VCM = 1.2 V, +V = 3.8 V, -V = -6.2, +V = 6.2 V, -V = -3.8 V M,D,P,L,R,F 2/ 3/ +IN resistance +RIN 4/ 1 M,D,P,L,R,F 2/ 3/ All 800 2,3 350 1 350 k See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-96767 A REVISION LEVEL E SHEET 5 TABLE I. Electrical performance characteristics – Continued. Test Conditions 1/ -55C TA +125C Symbol Group A subgroups VS = 5 V Device type unless otherwise specified +IN current power supply PPSSIBP sensitivity Limits Min Unit Max 1 VS = 1.8 V, 1 +V = 6.8 V, -V = -5 V, +V = 3.2 V, -V = -5 V 2 3 3 3 1 3 VS = 1.8 V, 1 1 +V = 5 V, -V = -6.8 V, +V = 5 V, -V = -3.2 V 2 3 3 3 1 3 All A/V VS = 1.2 V, +V = 6.2 V, -V = -5 V, +V = 3.8 V, -V = -5 V M,D,P,L,R,F 2/ 3/ NPSSIBP VS = 1.2 V, +V = 5 V, -V = -6.2 V, +V = 5 V, -V = -3.8 V M,D,P,L,R,F 2/ 3/ Inverting input (-IN) IBSN 1 VCM = 0 V current M,D,P,L,R,F 2/ 3/ -IN current common CMSIBN mode sensitivity All -7.5 7.5 2,3 -25 25 1 -25 25 VCM = 1.8 V, 1 +V = 3.2 V, -V = -6.8 V, +V = 6.8 V, -V = -3.2 V 2 8 3 8 1 8 All A A/V 6 VCM = 1.2 V, +V = 3.8 V, -V = -6.2 V, +V = 6.2 V, -V = -3.8 V M,D,P,L,R,F 2/ 3/ -IN current power supply PPSSIBN sensitivity VS = 1.8 V, 1 +V = 6.8 V, -V = -5 V, +V = 3.2 V, -V = -5 V 2 8 3 8 1 8 VS = 1.8 V, 1 5 +V = 5 V, -V = -6.8 V, +V = 5 V, -V = -3.2 V 2 8 3 8 1 8 All A/V 5 VS = 1.2 V, +V = 6.2 V, -V = -5 V, +V = 3.8 V, -V = -5 V M,D,P,L,R,F 2/ 3/ NPSSIBN VS = 1.2 V, +V = 5 V, -V = -6.2 V, +V = 5 V, -V = -3.8 V M,D,P,L,R,F 2/ 3/ See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-96767 A REVISION LEVEL E SHEET 6 TABLE I. Electrical performance characteristics – Continued. Test Conditions 1/ -55C TA +125C Symbol Group A subgroups VS = 5 V Device type unless otherwise specified Output voltage swing VOP100 Min VIN = -3.2 V, AV = -1, 1 RL = 100 VIN = -3 V, AV = -1, RL = 100 VIN = -3 V, AV = -1, 2/ 3/ RL = 100 , M,D,P,L,R,F VON100 VIN = +3.2 V, AV = -1, RL = 100 VIN = +3 V, AV = -1, RL = 100 VIN = +3 V, AV = -1, 2/ 3/ RL = 100 , M,D,P,L,R,F VOP50 Limits VIN = -2.7 V, AV = -1, RL = 50 VIN = -2.25 V, AV = -1, RL = 50 VIN = -2.25 V, AV = -1, RL = 50 All Unit Max 3 2,3 2.8 1 2.8 V 1 -3 2,3 -2.8 1 -2.8 1 2.5 2 2.0 3 1.4 1 1.4 VIN = -2.25 V, 2/ 3/ AV = -1, RL = 50 , M,D,P,L,R,F VON50 VIN = +2.7 V, AV = -1, RL = 50 VIN = +2.25 V, AV = -1, RL = 50 VIN = +2.25 V, AV = -1, RL = 50 1 -2.5 2 -2.0 3 -1.4 1 -1.4 VIN = +2.25 V, 2/ 3/ AV = -1, RL = 50 , M,D,P,L,R,F See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-96767 A REVISION LEVEL E SHEET 7 TABLE I. Electrical performance characteristics – Continued. Test Conditions 1/ -55C TA +125C Symbol Group A subgroups VS = 5 V Output current +IOUT -IOUT Quiescent power supply ICC unless otherwise specified 5/ 1 M,D,P,L,R,F 2/ 3/ 1 28 5/ 1 -50 2 -40 3 -28 M,D,P,L,R,F 2/ 3/ 1 -28 RL = 100 1 6.6 7.1 2,3 6.2 7.5 1 6.2 7.5 1 -6.6 -7.1 2,3 -6.2 -7.5 1 -6.2 -7.5 -125 125 2,3 -150 150 1 -150 150 1 -125 125 2,3 -150 150 1 -150 150 RL = 100 1 AV = -1, VIN = -2 V, M,D,P,L,R,F 2/ 3/ AV = -1, VOUT = +2 V, VL = -1 V M,D,P,L,R,F 2/ 3/ Input clamp current VHBIAS 1,2,3 VH = 1 V M,D,P,L,R,F 2/ 3/ VLBIAS All All All 200 1 VL = -1 V mA mV A 200 1,2,3 -200 1 -200 M,D,P,L,R,F 2/ 3/ 1/ mA 28 VH = 1 V VLCLMP All Max 40 M,D,P,L,R,F 2/ 3/ VHCLMP Min 50 Unit 3 M,D,P,L,R,F 2/ 3/ Clamp accuracy Limits 2 current IEE Device type Unless otherwise specified, AV = +1, fixed resistance (RF) = 510 , source resistance (RS) = 0 , load resistance (RL) = 100 , and VOUT = 0 V. 2/ Devices supplied by this drawing meet all levels M, D, P, L, R, and F of irradiation. However, this device is only tested at the “F” level. When performing post irradiation electrical measurements for any RHA level, TA = +25C. 3/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method 1019, condition A. 4/ Guaranteed from +IN common mode rejection test, by: +RIN = 1/CMSIBP. 5/ Guaranteed from VOUT test with RL = 50 , by: IOUT = VOUT/50 . STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-96767 A REVISION LEVEL E SHEET 8 01 Device type Case outline X P Terminal symbol Terminal number 1 NC NC 2 NC -INPUT 3 -INPUT +INPUT 4 +INPUT -VS 5 NC VL 6 NC OUTPUT 7 -VS +VS 8 NC VH 9 NC ---- 10 VL ---- 11 OUTPUT ---- 12 +VS ---- 13 VH ---- 14 NC ---- FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-96767 A REVISION LEVEL E SHEET 9 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. 4.2.1 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections, and as specified herein. 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. Subgroups 4, 5, 6, 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-96767 A REVISION LEVEL E SHEET 10 TABLE IIA. Electrical test requirements. Test requirements Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group A test requirements (see 4.4) Group C end-point electrical parameters (see 4.4) Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) Subgroups (in accordance with MIL-PRF-38535, table III) Device Device class Q class V 1 1 1,2,3 1/ 1,2,3, 2/ 3/ 1,2,3 1,2,3 1 1,2,3 3/ 1 1 1 1 1/ PDA applies to subgroup 1. 2/ PDA applies to subgroups 1 and . 3/ Delta limits as specified in table IIB shall be required where specified, and the delta limits shall be completed with reference to the zero hour electrical parameters (see Table I). TABLE IIB. Burn-in and operating life test delta parameters. TA = +25C. Parameter Symbol Delta limits Input offset voltage VIO 3.0 mV Positive input bias current +IIB 6 A Negative input bias current -IIB 3 A 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table IIA herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25C 5C, after exposure, to the subgroups specified in table IIA herein. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-96767 A REVISION LEVEL E SHEET 11 4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883 method 1019, condition A and as specified herein. 4.4.4.1.1 Accelerated annealing test. Accelerated annealing tests shall be performed on all devices requiring a RHA level greater than 5 krads(Si). The post-anneal end-point electrical parameter limits shall be as specified in table I herein and shall be the pre-irradiation end-point electrical parameter limit at 25C ±5C. Testing shall be performed at initial qualification and after any design or process changes which may affect the RHA response of the device. 4.4.4.2 Dose rate burnout. When required by the customer, test shall be performed on devices, SEC, or approved test structures at technology qualifications and after any design or process changes which may effect the RHA capability of the process. Dose rate burnout shall be performed in accordance with test method 1023 of MIL-STD-883 and as specified herein. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108. 6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0540. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in MIL-HDBK-103 and QML-38535. The vendors listed in MIL-HDBK-103 and QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DLA Land and Maritime-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-96767 A REVISION LEVEL E SHEET 12 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-96767 A.1 SCOPE A.1.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers approved QM plan for use in monolithic microcircuits, multi-chip modules (MCMs), hybrids, electronic modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes consisting of military high reliability (device class Q) and space application (device class V) are reflected in the Part or Identification Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. A.1.2 PIN. The PIN is as shown in the following example: 5962 F Federal stock class designator \ RHA designator (see A.1.2.1) 96767 01 V 9 A Device type (see A.1.2.2) Device class designator (see A.1.2.3) Die code Die details (see A.1.2.4) / \/ Drawing number A.1.2.1 RHA designator. Device classes Q and V RHA identified die meet the MIL-PRF-38535 specified RHA levels. A dash (-) indicates a non-RHA die. A.1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 HS1135RH Radiation hardened D.I., high speed, low power, current feedback amplifier with programmable output limiting A.1.2.3 Device class designator. Device class Q or V STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 Device requirements documentation Certification and qualification to the die requirements of MIL-PRF-38535 SIZE 5962-96767 A REVISION LEVEL E SHEET 13 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-96767 A.1.2.4 Die details. The die details designation is a unique letter which designates the die's physical dimensions, bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for each product and variant supplied to this appendix. A.1.2.4.1 Die physical dimensions. Die type Figure number 01 A-1 A.1.2.4.2 Die bonding pad locations and electrical functions. Die type Figure number 01 A-1 A.1.2.4.3 Interface materials. Die type Figure number 01 A-1 A.1.2.4.4 Assembly related information. Die type Figure number 01 A-1 A.1.3 Absolute maximum ratings. See paragraph 1.3 herein for details. A.1.4 Recommended operating conditions. See paragraph 1.4 herein for details. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-96767 A REVISION LEVEL E SHEET 14 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-96767 A.2 APPLICABLE DOCUMENTS. A.2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARD MIL-STD-883 - Test Method Standard Microcircuits. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) A.2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. A.3 REQUIREMENTS A.3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer’s Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. A.3.2 Design, construction and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein and the manufacturer’s QM plan for device classes Q and V. A.3.2.1 Die physical dimensions. The die physical dimensions shall be as specified in A.1.2.4.1 and on figure A-1. A.3.2.2 Die bonding pad locations and electrical functions. The die bonding pad locations and electrical functions shall be as specified in A.1.2.4.2 and on figure A-1. A.3.2.3 Interface materials. The interface materials for the die shall be as specified in A.1.2.4.3 and on figure A-1. A.3.2.4 Assembly related information. The assembly related information shall be as specified in A.1.2.4.4 and on figure A-1. A.3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be as defined in paragraph 3.2.3 herein. A.3.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post-irradiation parameter limits are as specified in table I of the body of this document. A.3.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testing sufficient to make the packaged die capable of meeting the electrical performance requirements in table I. A.3.5 Marking. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a customer, shall be identified with the wafer lot number, the certification mark, the manufacturer’s identification and the PIN listed in A.1.2 herein. The certification mark shall be a “QML” or “Q” as required by MIL-PRF-38535. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-96767 A REVISION LEVEL E SHEET 15 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-96767 A.3.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see A.6.4 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply for this appendix shall affirm that the manufacturer’s product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the requirements herein. A.3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuit die delivered to this drawing. A.4 VERIFICATION A.4.1 Sampling and inspection. For device classes Q and V, die sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer’s Quality Management (QM) plan. The modifications in the QM plan shall not affect the form, fit, or function as described herein. A.4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in the manufacturer’s QM plan. As a minimum, it shall consist of: a. Wafer lot acceptance for class V product using the criteria defined in MIL-STD-883, method 5007. b. 100% wafer probe (see paragraph A.3.4 herein). c. 100% internal visual inspection to the applicable class Q or V criteria defined in MIL-STD-883, method 2010 or the alternate procedures allowed in MIL-STD-883, method 5004. A.4.3 Conformance inspection. A.4.3.1 Group E inspection. Group E inspection is required only for parts intended to be identified as radiation assured (see A.3.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End point electrical testing of packaged die shall be as specified in table IIA herein. Group E tests and conditions are as specified in paragraphs 4.4.4, 4.4.4.1, 4.4.4.1.1, and 4.4.4.2 herein. A.5 DIE CARRIER A.5.1 Die carrier requirements. The requirements for the die carrier shall be accordance with the manufacturer’s QM plan or as specified in the purchase order by the acquiring activity. The die carrier shall provide adequate physical, mechanical and electrostatic protection. A.6 NOTES A.6.1 Intended use. Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications, and logistics purposes. A.6.2 Comments. Comments on this appendix should be directed to DLA Land and Maritime -VA, Columbus, Ohio, 43218-3990 or telephone (614)-692-0540. A.6.3 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. A.6.4 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in MIL-HDBK-103 and QML-38535. The vendors listed within MIL-HDBK-103 and QML-38535 have submitted a certificate of compliance (see A.3.6 herein) to DLA Land and Maritime -VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-96767 A REVISION LEVEL E SHEET 16 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-96767 -INPUT VH +VS OUTPUT +INPUT -VS VL Die bonding pad locations and electrical functions Die physical dimensions. Die size: 1500 microns x 1500 microns Die thickness: 14 mils 1 mils Interface materials. Top metallization: Metal 1: Al Cu (2%) / TiW 8.0 kÅ 0.4 kÅ Metal 2: AlCu 16.0 kÅ 0.8 kÅ Backside metallization: None Glassivation. Type: Nitride Thickness: 4.0 kÅ 0.5 kÅ Substrate: UHF-1. Bonded wafer. Dielectric Isolation (DI) Assembly related information. Substrate potential: Floating Special assembly instructions: None FIGURE A-1. Die bonding pad locations and electrical functions. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-96767 A REVISION LEVEL E SHEET 17 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 16-06-02 Approved sources of supply for SMD 5962-96767 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962F9676701VPA 3/ HS7-1135RH-Q 5962F9676701VXC 34371 HS9-1135RH-Q 5962F9676701VPC 34371 HS7B-1135RH-Q 5962F9676701V9A 34371 HS0-1135RH-Q 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply. Vendor CAGE number 34371 Vendor name and address Intersil Corporation 1650 Robert J. Conlan Blvd. NE Palm Bay, FL 32905-3406 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.