V40PW10C Datasheet

V40PW10C
www.vishay.com
Vishay General Semiconductor
High Current Density Surface Mount
Trench MOS Barrier Schottky Rectifier
Ultra Low VF = 0.44 V at IF = 5 A
FEATURES
• Very low profile - typical height of 1.3 mm
TMBS® eSMP® Series
• Trench MOS Schottky technology
• Ideal for automated placement
• Low forward voltage drop, low power losses
K
• High efficiency operation
• Meets MSL level 1, per J-STD-020, LF maximum peak
of 260 °C
1
2
• AEC-Q101 qualified available
- Automotive ordering code: base P/NHM3
SlimDPAK
PIN 1
PIN 2
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
K
HEATSINK
TYPICAL APPLICATIONS
For use in low voltage high frequency DC/DC converters,
freewheeling diodes, and polarity protection applications.
PRIMARY CHARACTERISTICS
IF(AV)
40 A
VRRM
100 V
IFSM
240 A
VF at IF = 20 A (TA = 125 °C)
0.70 V
MECHANICAL DATA
Case: SlimDPAK
Molding compound meets UL 94 V-0 flammability rating
Base P/N-M3 - halogen-free, RoHS-compliant
Base P/NHM3 - halogen-free, RoHS-compliant, and
AEC-Q101 qualified
TJ max.
150 °C
Package
SlimDPAK
Diode variation
Dual common cathode
Terminals: matte tin plated
J-STD-002 and JESD 22-B102
leads,
solderable
per
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
Device marking code
Peak forward surge current 8.3 ms single half sine-wave
superimposed on rated load per diode
Operating junction and storage temperature range
UNIT
V40PW10C
Maximum repetitive peak reverse voltage
Maximum average forward rectified current (fig. 1)
V40PW10C
VRRM
per device
per diode
100
V
40
A
20
A
IFSM
240
A
TJ, TSTG
-40 to +150
°C
IF(AV) (1)
Note
(1) With infinite heat sink
Revision: 21-Dec-15
Document Number: 87656
1
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V40PW10C
www.vishay.com
Vishay General Semiconductor
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
TEST CONDITIONS
SYMBOL
IF = 5.0 A
TA = 25 °C
IF = 10 A
Instantaneous forward voltage
IF = 20 A
VF (1)
IF = 5.0 A
TA = 125 °C
IF = 10 A
IF = 20 A
VR = 70 V
Reverse current
Typical junction capacitance
MAX.
0.52
-
0.62
-
0.81
0.89
0.44
-
0.56
-
0.70
0.78
TA = 25 °C
0.01
-
TA = 125 °C
8.0
-
-
0.5
16
35
1470
-
TA = 25 °C
VR = 100 V
TYP.
IR (2)
TA = 125 °C
4.0 V, 1 MHz
CJ
UNIT
V
mA
pF
Notes
(1) Pulse test: 300 μs pulse width, 1 % duty cycle
(2) Pulse test: pulse width  5 ms
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
RJA
Typical thermal resistance
V40PW10C
(1)(2)
55
RJM (3)
UNIT
°C/W
1.5
Notes
(1) The heat generated must be less than thermal conductivity from junction-to-ambient: dP /dT < 1/R
D
J
JA
(2) Free air, mounted on recommended copper pad area; thermal resistance R
JA - junction to ambient
(3) Mounted on infinite heat sink; thermal resistance R
JM - junction-to-mount
ORDERING INFORMATION (Example)
PREFERRED P/N
UNIT WEIGHT (g) PREFERRED PACKAGE CODE
BASE QUANTITY
DELIVERY MODE
V40PW10C-M3/I
0.20
I
4500
13" diameter plastic tape and reel
V40PW10CHM3/I (1)
0.20
I
4500
13" diameter plastic tape and reel
Note
AEC-Q101 qualified
(1)
Revision: 21-Dec-15
Document Number: 87656
2
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V40PW10C
www.vishay.com
Vishay General Semiconductor
50.0
TM = 105 °C, RthJM = 1.5 °C/W
40.0
30.0
20.0
10.0
TA = 25 °C, RthJA = 55 °C/W
0
0
25
50
75
100
Instantaneous Reverse Current (mA)
Average Forward Rectified Current (A)
RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)
100
125
TJ = 150 °C
TJ = 100 °C
1
0.1
TJ = 25 °C
0.01
0.001
150
10
Mount Temperature (°C)
20
30
40
60
70
80
90
100
Fig. 4 - Typical Reverse Leakage Characteristics
10 000
Junction Capacitance (pF)
20.0
D = 0.8
15.0
D = 0.5
D = 0.3
D = 1.0
10.0
D = 0.2
T
D = 0.1
5.0
D = tp/T
TJ = 25 °C
f = 1.0 MHz
Vsig = 50 mVp-p
1000
100
10
tp
1
0.0
0
5
10
15
20
0.1
25
1
Average Forward Current (A)
Transient Thermal Impedance (°C/W)
TJ = 150 °C
TJ = 125 °C
1
TJ = 100 °C
TJ = 25 °C
0.1
0
0.2
0.4
0.6
0.8
1.0
100
Fig. 5 - Typical Junction Capacitance
100
10
10
Reverse Voltage (V)
Fig. 2 - Forward Power Loss Characteristics
Instantaneous Forward Current (A)
50
Percent of Rated Peak Reverse Voltage (%)
Fig. 1 - Maximum Forward Current Derating Curve
Average Power Loss (W)
TJ = 125 °C
10
1.2
1.4
Instantaneous Forward Voltage (V)
Fig. 3 - Typical Instantaneous Forward Characteristics
100
Junction to Ambient
10
Junction to Mount
1
0.1
0.01
0.1
1
10
100
t - Pulse Duration (s)
Fig. 6 - Typical Transient Thermal Impedance
Revision: 21-Dec-15
Document Number: 87656
3
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V40PW10C
www.vishay.com
Vishay General Semiconductor
Thermal Resistance (°C/W)
80
Epoxy printed circuit
board FR4 copper
thickness = 70 μm
70
60
50
40
30
20
10
S (cm2)
0
0
1
2
3
4
5
6
7
8
9
10
Copper Pad Areas (cm2)
Fig. 7 - Typical Resistance Junction to Ambient vs.
Copper Pad Areas
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
SlimDPAK
0.055 (1.40)
0.047 (1.20)
0.249 (6.32)
0.239 (6.08)
0.016 (0.41)
0.010 (0.25)
0.028 (0.70)
0.012 (0.30)
0.265 (6.72)
0.255 (6.48)
0.370 (9.40)
0.339 (8.60)
0.008
0.000
0.055
0.039
0.090
NOM.
(2.29)
(0.20)
(0.00)
(1.40)
(1.00)
0.180
NOM.
(4.57)
Mounting Pad Layout
0.240
MIN.
(6.10)
0.224 (5.70)
0.209 (5.30)
0.205
NOM.
(5.20)
0.235
MIN.
(5.97)
0.386
REF.
(9.80)
0.075
MIN.
(1.90)
0.035 (0.90)
0.028 (0.70)
0.090
NOM.
(2.29)
0.055
MIN.
(1.40)
Revision: 21-Dec-15
Document Number: 87656
4
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000