DATASHEET

EL5129, EL5329
®
Data Sheet
May 13, 2005
Multi-Channel Buffers
Features
The EL5129 and EL5329 integrate multiple gamma buffers
and a single VCOM buffer for use in large panel LCD
displays of 10” and greater. The EL5129 integrates 6 gamma
channels and the EL5329 integrates 10 gamma channels.
Half of the gamma channels in each device are designed to
swing to the upper supply rail, with the other half designed to
swing to the lower rail. The output capability of each channel
is 10mA continuous, with 120mA peak. The gamma buffers
feature a 10MHz 3dB bandwidth specification and a 9V/µs
slew rate.
• Multiple gamma buffers
- 6 channels (EL5129)
- 10 channels (EL5329)
The VCOM amplifier is designed to swing from rail to rail. The
output current capability of the VCOM in the EL5129 and
EL5329 is 30mA continuous, 150mA peak and a slew rate of
10V/µs.
Ordering Information
PART NUMBER
PACKAGE
FN7430.1
• Single VCOM amplifier
• Low supply current
- 3.5mA (EL5129)
- 5.5mA (EL5329)
• For higher speed or higher output power, see the EL5x24
family
• Pb-free available (RoHS compliant)
Applications
• TFT-LCD monitors
• LCD televisions
TAPE &
REEL
PKG DWG. #
EL5129IRE
20-Pin HTSSOP
-
MDP0048
EL5129IRE-T7
20-Pin HTSSOP
7”
MDP0048
EL5129IRE-T13
20-Pin HTSSOP
13”
MDP0048
EL5129IREZ
(See Note)
20-Pin HTSSOP
(Pb-free)
-
MDP0048
EL5129IREZ-T7
(See Note)
20-Pin HTSSOP
(Pb-free)
7”
MDP0048
EL5129IREZ-T13
(See Note)
20-Pin HTSSOP
(Pb-free)
13”
MDP0048
EL5129IRZ
(See Note)
20-Pin TSSOP
(Pb-free)
-
MDP0044
EL5129IRZ-T7
(See Note)
20-Pin TSSOP
(Pb-free)
7”
MDP0044
EL5129IRZ-T13
(See Note)
20-Pin TSSOP
(Pb-free)
13”
MDP0044
EL5329IREZ
(See Note)
28-Pin HTSSOP
(Pb-free)
-
MDP0048
EL5329IREZ-T7
(See Note)
28-Pin HTSSOP
(Pb-free)
7”
MDP0048
EL5329IREZ-T13
(See Note)
28-Pin HTSSOP
(Pb-free)
13”
MDP0048
EL5329IRZ
(See Note)
28-Pin TSSOP
(Pb-free)
-
MDP0044
EL5329IRZ-T7
(See Note)
28-Pin TSSOP
(Pb-free)
7”
MDP0044
EL5329IRZ-T13
(See Note)
28-Pin TSSOP
(Pb-free)
13”
MDP0044
• Industrial flat panel displays
NOTE: Intersil Pb-free products employ special Pb-free material sets; molding
compounds/die attach materials and 100% matte tin plate termination finish, which are
RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-352-6832 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2005. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
EL5129, EL5329
Pinouts
EL5129
(20-PIN TSSOP, HTSSOP)
TOP VIEW
EL5329
(28-PIN TSSOP, HTSSOP)
TOP VIEW
20 VS+
VS+ 1
28 VS+
OUT1 2
19 IN1
NC 2
27 NC
OUT2 3
18 IN2
OUT1 3
26 IN1
OUT3 4
17 IN3
OUT2 4
25 IN2
16 IN4
OUT3 5
24 IN3
15 IN5
OUT4 6
23 IN4
OUT5 7
14 IN6
OUT5 7
NC 8
13 NC
OUT6 8
12 INCOM
OUT7 9
20 IN7
11 VS-
OUT8 10
19 IN8
OUT9 11
18 IN9
OUT10 12
17 IN10
VS+ 1
OUT4 5
OUT5 6
THERMAL
PAD*
OUTCOM 9
VS- 10
* THERMAL PAD CONNECTED TO PIN 10 OR 11 (VS-)
OUTCOM 13
VS- 14
THERMAL
PAD*
22 IN5
21 IN6
16 INCOM
15 VS-
* THERMAL PAD CONNECTED TO PIN 14 OR 15 (VS-)
2
FN7430.1
May 13, 2005
EL5129, EL5329
Absolute Maximum Ratings (TA = 25°C)
Supply Voltage between VS+ and VS- . . . . . . . . . . . . . . . . . . . .+18V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . VS- -0.5V, VS+ +0.5V
Maximum Continuous Output Current (VOUT0-9) . . . . . . . . . . 15mA
Maximum Continuous Output Current (VOUTA). . . . . . . . . . . 100mA
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves
Maximum Die Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Ambient Operating Temperature . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests
are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
Electrical Specifications
PARAMETER
VS+ = +15V, VS- = 0, RL = 10kΩ, CL = 10pF to 0V, TA = 25°C unless otherwise specified
DESCRIPTION
CONDITIONS
MIN
TYP
MAX
UNIT
20
mV
INPUT CHARACTERISTICS (REFERENCE BUFFERS)
VOS
Input Offset Voltage
VCM = 0V
2
TCVOS
Average Offset Voltage Drift
(Note 1)
5
IB
Input Bias Current
VCM = 0V
2
RIN
Input Impedance
10
MΩ
CIN
Input Capacitance
1.35
pF
AV
Voltage Gain
1V ≤ VOUT ≤ 14V
CMIR
Input Voltage Range
µV/°C
50
nA
0.992
1.008
V/V
EL5129, IN1 to IN3
1.5
VS+
V
EL5329, IN1 to IN5
1.5
VS+
V
EL5129, IN4 to IN6
0
VS+
-1.5
V
EL5329, IN6 to IN10
0
VS+
-1.5
V
INPUT CHARACTERISTICS (VCOM BUFFER)
VOS
Input Offset Voltage
VCM = 7.5V
1
TCVOS
Average Offset Voltage Drift
(Note 1)
3
IB
Input Bias Current
VCM = 7.5V
2
RIN
Input Impedance
10
MΩ
CIN
Input Capacitance
1.35
pF
VREG
Load Regulation
CMIRCOM
Input Voltage Range VCOM
VCOM = 7.5V, -60mA < IL < 60mA
20
mV
µV/°C
50
nA
-20
+20
mV
0
VS+
V
OUTPUT CHARACTERISTICS (REFERENCE BUFFERS)
VOH
High Output Voltage - EL5129 & EL5329
(Output 1)
VIN = 15V, IO = 5mA
High Output Voltage - EL5129 (Output 2, 3),
EL5329 (Output 2-5)
VOL
14.85
14.9
V
14.8
14.85
V
13.45
13.5
V
High Output Voltage - EL5129 (Output 4-6),
EL5329 (Output 6-10)
VIN = 13.5V, IO = 5mA
Low Output Voltage - EL5129 (Output 1-3),
EL5329 (Output 1-5)
VIN = 1.5V, IO = 5mA
1.5
1.55
V
Low Output Voltage - EL5129 (Output 4-5),
EL5329 (Output 6-9)
VIN = 0V, IO = 5mA
150
200
mV
100
150
mV
Low Output Voltage - EL5129 (Output 6),
EL5329 (Output 10)
ISC
Short Circuit Current
3
100
120
mA
FN7430.1
May 13, 2005
EL5129, EL5329
Electrical Specifications
PARAMETER
VS+ = +15V, VS- = 0, RL = 10kΩ, CL = 10pF to 0V, TA = 25°C unless otherwise specified (Continued)
DESCRIPTION
CONDITIONS
MIN
TYP
14.85
14.9
MAX
UNIT
OUTPUT CHARACTERISTICS (VCOM BUFFER)
VOH
High Level Saturated Output Voltage
VS+ = 15V, IO = -5mA, VI = 15V
VOL
Low Level Saturated Output Voltage
VS+ = 15V, IO = -5mA, VI = 0V
ISC
Short Circuit Current
0.1
V
0.15
V
150
170
mA
Reference buffer VS from 5V to 15V
50
80
dB
VCOM buffer, VS from 5V to 15V
55
80
dB
POWER SUPPLY PERFORMANCE
PSRR
IS
Power Supply Rejection Ratio
Total Supply Current
EL5129
3.5
4.5
mA
EL5329
5.5
7
mA
DYNAMIC PERFORMANCE (BUFFER AMPLIFIERS)
SR
Slew Rate (Note 2)
tS
Settling to +0.1% (AV = +1)
BW
-3dB Bandwidth
CS
Channel Separation
5
9
V/µs
500
ns
RL = 10kΩ, CL = 10pF
10
MHz
f = 5MHz
75
dB
10
V/µs
(AV = +1), VO = 2V step
EL5129 & EL5329 DYNAMIC PERFORMANCE (VCOM AMPLIFIERS)
SR
Slew Rate (Note 2)
-4V ≤ VOUT ≤ 4V, 20% to 80%
tS
Settling to +0.1% (AV = +1)
(AV = +1), VO = 2V step
350
ns
BW
-3dB Bandwidth
RL = 10kΩ, CL = 10pF
15
MHz
CS
Channel Separation
f = 5MHz
75
dB
7
NOTES:
1. Measured over operating temperature range
2. Slew rate is measured on rising and falling edges
4
FN7430.1
May 13, 2005
EL5129, EL5329
Pin Descriptions
EL5129
EL5329
PIN NAME
PIN FUNCTION
1, 20
1, 28
VS+
2
3
OUT1
Output gamma channel 1
3
4
OUT2
Output gamma channel 2
4
5
OUT3
Output gamma channel 3
5
6
OUT4
Output gamma channel 4
6
7
OUT5
Output gamma channel 5
Output gamma channel 6
Positive supply voltage
7
8
OUT6
8, 13
2, 27
NC
9
13
OUTCOM
10, 11
14, 15
VS-
12
16
INCOM
14
21
IN6
Input gamma channel 6
15
22
IN5
Input gamma channel 5
16
23
IN4
Input gamma channel 4
17
24
IN3
Input gamma channel 3
18
25
IN2
Input gamma channel 2
19
26
IN1
Input gamma channel 1
No connect
Output, VCOM
Negative supply
Input, VCOM
9
OUT7
Output gamma channel 7
10
OUT8
Output gamma channel 8
11
OUT9
Output gamma channel 9
12
OUT10
Output gamma channel 10
17
IN10
Input gamma channel 10
18
IN9
Input gamma channel 9
19
IN8
Input gamma channel 8
20
IN7
Input gamma channel 7
5
FN7430.1
May 13, 2005
EL5129, EL5329
Block Diagram
VS+
EL5129
COLUMN
DRIVER
VCOM
Typical Performance Curves
5
10
VS=±7.5V
CL=10pF
6
1
RL=1kΩ
-1
RL=562Ω
-3
-5
100
10K
100K
1M
10M
100M
FREQUENCY (Hz)
FIGURE 1. FREQUENCY RESPONSE FOR VARIOUS RLOAD
(BUFFER)
6
CL=47pF
2
-2
CL=12pF
-6
RL=150Ω
1K
CL=100pF
RL=10kΩ
GAIN (dB)
GAIN (dB)
3
VS=±7.5V
RL=10kΩ
-10
1K
10K
100K
1M
10M
100M
1G
FREQUENCY (Hz)
FIGURE 2. FREQUENCY RESPONSE FOR VARIOUS CLOAD
(BUFFER)
FN7430.1
May 13, 2005
EL5129, EL5329
Typical Performance Curves
(Continued)
VS=±7.5V
RL=10kΩ
CL=8pF
VS=±7.5V
RL=10kΩ
CL=8pF
VIN
2V/DIV
50mV/DIV
VOUT
VOUT
1µs/DIV
100ns/DIV
FIGURE 3. LARGE SIGNAL TRANSIENT RESPONSE (BUFFER)
FIGURE 4. SMALL SIGNAL TRANSIENT RESPONSE (BUFFER)
20
VS=±7.5V
RL=1kΩ
0 CL=1.5pF
100
PSRR (dB)
VOLTAGE NOISE (nV/√Hz)
VS=±7.5V
-20
PSRR+
-40
PSRR-60
10
10K
100K
1M
10M
-80
1K
100M
10K
FREQUENCY (Hz)
100K
1M
10M
FREQUENCY (Hz)
FIGURE 5. INPUT NOISE SPECIAL DENSITY vs FREQUENCY
(BUFFER)
FIGURE 6. PSRR vs FREQUENCY (BUFFER)
5
60
VS=±7.5V
RL=10kΩ
50 VOPP=1V
VS=±7.5V
CL=10pF
3
40
GAIN (dB)
VOLTAGE NOISE (nV/√Hz)
VIN
30
RL=10kΩ
RL=1kΩ
1
RL=562Ω
-1
20
-3
10
0
0
500
1K
1.5K
2K
CLOAD (pF)
FIGURE 7. OVERSHOOT vs CAPACITANCE LOAD (BUFFER)
7
-5
100
RL=150Ω
1K
10K
100K
1M
10M
100M
FREQUENCY (Hz)
FIGURE 8. FREQUENCY RESPONSE FOR VARIOUS RLOAD
(VCOM)
FN7430.1
May 13, 2005
EL5129, EL5329
Typical Performance Curves
10
(Continued)
10
VS=±7.5V
RL=10kΩ
CL=100pF
6
VS=±7.5V
RL=1kΩ
6
2
-2
GAIN (dB)
GAIN (dB)
CL=47pF
CL=47pF
CL=12pF
-6
-10
1K
CL=100pF
2
-2
CL=12pF
-6
10K
100K
1M
10M
100M
-10
1K
1G
10K
100K
FREQUENCY (Hz)
1M
10M
100M
FREQUENCY (Hz)
FIGURE 9. FREQUENCY RESPONSE FOR VARIOUS CLOAD
(VCOM)
VS=±7.5V
RL=10kΩ
CL=8pF
FIGURE 10. FREQUENCY RESPONSE FOR VARIOUS CLOAD
(VCOM)
VS=±7.5V
RL=10kΩ
CL=8pF
VIN
2V/DIV
VOUT
1µs/DIV
100ns/DIV
FIGURE 11. LARGE SIGNAL TRANSIENT RESPONSE (VCOM)
FIGURE 12. SMALL SIGNAL TRANSIENT RESPONSE (VCOM)
-20
VS=±7.5V
VOLTAGE NOISE (nV/√Hz)
VS=±7.5V
RL=1kΩ
0 CL=1.5pF
PSRR (dB)
VIN
50mV/DIV
VOUT
-20
PSRR+
-40
PSRR-60
-80
1K
1G
10K
100K
1M
FREQUENCY (Hz)
FIGURE 13. PSRR vs FREQUENCY (VCOM)
8
10M
100
10
10K
100K
1M
10M
100M
FREQUENCY (Hz)
FIGURE 14. INPUT NOISE SPECIAL DENSITY vs FREQUENCY
(VCOM)
FN7430.1
May 13, 2005
EL5129, EL5329
Typical Performance Curves
(Continued)
1K
50
OUTPUT IMPEDANCE (Ω)
OVERSHOOT (%)
VS=±7.5V
RL=10kΩ
40 VOPP=1V
30
20
10
0
0
200
400
600
VS=±5V
100
10
BUFFER
VCOM
1
0
1K
800
10K
CLOAD (pF)
0
VS=±7.5V
RL=10kΩ
700 CL=8pF
VS=±5V
-10 AV=+1
RL=1kΩ
-20 FREQ=200kHz
THD (dB)
BUFFER
600
VCOM
500
400
-30
-40
BUFFER
-50
-60
300
200
10M
FIGURE 16. OUTPUT IMPEDANCE vs FREQUENCY
800
VCOM
-70
2
3
4
5
-80
6
1
2
3
4
STEP SIZE (+V)
909mW
0.8
0.7
833mW
θJA=110°C/W
800mW
TSSOP28
θJA=120°C/W
0.6
HTSSOP20
0.5
0.4
θJA=125°C/W
TSSOP20
0.3
θJA=140°C/W
0.2
0.1
0
0
25
75 85 100
50
125
150
AMBIENT TEMPERATURE (°C)
FIGURE 19. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
9
9
8
10
3.5
HTSSOP28
714mW
7
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - HTSSOP
EXPOSED DIEPAD SOLDERED TO PCB PER
JESD51-5
POWER DISSIPATION (W)
1
6
FIGURE 18. TOTAL HARMONIC DISTORTION vs OUTPUT
VOLTAGE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
0.9
5
VOPP (V)
FIGURE 17. SETTLING TIME vs STEP SIZE
POWER DISSIPATION (W)
1M
FREQUENCY (Hz)
FIGURE 15. OVERSHOOT vs CAPACITANCE LOAD (VCOM)
SETTLING TIME (ns)
100K
HTSSOP28
3.333W
3
θJA=30°C/W
2.5 2.857W
HTSSOP20
θJA=35°C/W
2
1.5 1.333W
TSSOP28
θJA=75°C/W
1 1.111W
TSSOP20
θJA=90°C/W
0.5
0
0
25
50
75 85 100
125
150
AMBIENT TEMPERATURE (°C)
FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FN7430.1
May 13, 2005
EL5129, EL5329
Description of Operation and Application
Information
Product Description
The EL5129 and EL5329 are fabricated using a high voltage
CMOS process. They exhibit rail to rail input and output
capability and have very low power consumption. When
driving a load of 10K and 12pF, the buffers have a
-3dB bandwidth of 10MHz and exhibit 9V/µs slew rate. The
VCOM amplifier has a -3dB bandwidth of 12MHz and exhibit
10V/µs slew rate.
Input, Output, and Supply Voltage Range
The EL5129 and EL5329 are specified with a single nominal
supply voltage from 5V to 15V or a split supply with its total
range from 5V to 15V. Correct operation is guaranteed for a
supply range from 4.5V to 16.5V.
The input common-mode voltage range of the EL5129 and
EL5329 within 500mV beyond the supply rails. The output
swings of the buffers and VCOM amplifier typically extend to
within 100mV of the positive and negative supply rails with
load currents of 5mA. Decreasing load currents will extend
the output voltage even closer to each supply rails.
maximum junction temperature for the application to
determine if load conditions need to be modified for the
buffer to remain in the safe operating area.
The maximum power dissipation allowed in a package is
determined according to:
T JMAX - T AMAX
P DMAX = -------------------------------------------Θ JA
where:
• TJMAX = Maximum junction temperature
• TAMAX = Maximum ambient temperature
• θJA = Thermal resistance of the package
• PDMAX = Maximum power dissipation in the package
The maximum power dissipation actually produced by an IC
is the total quiescent supply current times the total power
supply voltage, plus the power in the IC due to the loads, or:
P DMAX = V S × I S + Σi × [ ( V S + – V OUT i ) × I LOAD i ] +
( V S + – V OUT ) × I LA
when sourcing, and:
Output Phase Reversal
The EL5129 and EL5329 are immune to phase reversal as
long as the input voltage is limited from VS- -0.5V to VS+
+0.5V. Although the device's output will not change phase,
the input's over-voltage should be avoided. If an input
voltage exceeds supply voltage by more than 0.6V,
electrostatic protection diode placed in the input stage of the
device begin to conduct and over-voltage damage could
occur.
Output Drive Capability
The EL5129 and EL5329 do not have internal short-circuit
protection circuitry. The buffers will limit the short circuit
current to ±120mA and the VCOM amplifier will limit the short
circuit current to ±170mA if the outputs are directly shorted
to the positive or the negative supply. If the output is shorted
indefinitely, the power dissipation could easily increase such
that the part will be destroyed. Maximum reliability is
maintained if the output continuous current never exceeds
±15mA for the buffers and ±100mA for the VCOM amplifier.
These limits are set by the design of the internal metal
interconnections.
The Unused Buffers
It is recommended that any unused buffers should have their
inputs tied to ground plane.
P DMAX = V S × I S + Σi × [ ( V OUT i – V S - ) × I LOAD i ] +
( V OUT – V S - ) × I LA
when sinking.
where:
• i = 1 to total number of buffers
• VS = Total supply voltage of buffer and VCOM
• ISMAX = Total quiescent current
• VOUTi = Maximum output voltage of the application
• VOUT = Maximum output voltage of VCOM
• ILOADi = Load current of buffer
• ILA = Load current of VCOM
If we set the two PDMAX equations equal to each other, we
can solve for the RLOAD's to avoid device overheat. The
package power dissipation curves provide a convenient way
to see if the device will overheat. The maximum safe power
dissipation can be found graphically, based on the package
type and the ambient temperature. By using the previous
equation, it is a simple matter to see if PDMAX exceeds the
device's power derating curves.
Power Dissipation
With the high-output drive capability of the EL5129 and
EL5329, it is possible to exceed the 125°C “absolutemaximum junction temperature” under certain load current
conditions. Therefore, it is important to calculate the
10
FN7430.1
May 13, 2005
EL5129, EL5329
Power Supply Bypassing and Printed Circuit
Board Layout
As with any high frequency device, good printed circuit
board layout is necessary for optimum performance. Ground
plane construction is highly recommended, lead lengths
should be as short as possible, and the power supply pins
must be well bypassed to reduce the risk of oscillation. For
normal single supply operation, where the VS- pin is
connected to ground, one 0.1µF ceramic capacitor should be
placed from the VS+ pin to ground. A 4.7µF tantalum
capacitor should then be connected from the VS+ pin to
ground. One 4.7µF capacitor may be used for multiple
devices. This same capacitor combination should be placed
at each supply pin to ground if split supplies are to be used.
Important Note: The metal plane used for heat sinking of
the device is electrically connected to the negative
supply potential (VS-). If VS- is tied to ground, the
thermal pad can be connected to ground. Otherwise, the
thermal pad must be isolated from any other power
planes.
11
FN7430.1
May 13, 2005
EL5129, EL5329
TSSOP Package Outline Drawing
12
FN7430.1
May 13, 2005
EL5129, EL5329
HTSSOP Package Outline Drawing
NOTE: The package drawing shown here may not be the latest version. To check the latest revision, please refer to the Intersil
website at <http://www.intersil.com/design/packages/index.asp>
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
13
FN7430.1
May 13, 2005
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