INTERSIL HFA1212883

HFA1212/883
PRELIMINARY
Dual, High Speed, Low Power,
Video Closed Loop Buffer
June 1994
Features
Description
• This Circuit is Processed in Accordance to MIL-STD883 and is Fully Conformant Under the Provisions of
Paragraph 1.2.1.
The HFA1212/883 is a dual closed loop Buffer featuring user
programmable gain and high speed performance. Manufactured on Intersil’s proprietary complementary bipolar UHF-1
process, this device offers wide -3dB bandwidth of 340MHz,
very fast slew rate, excellent gain flatness and high output
current.
• User Programmable For Closed-Loop Gains of +1, -1
or +2 Without Use of External Resistors
• Standard Operational Amplifier Pinout
• Low Supply Current. . . . . . . . . . 5.9mA/Op Amp (Typ)
• Excellent Gain Accuracy . . . . . . . . . . . . . . 0.99V/V (Typ)
• Wide -3dB Bandwidth . . . . . . . . . . . . . . . 340MHz (Typ)
• Fast Slew Rate . . . . . . . . . . . . . . . . . . . . 1155V/µs (Typ)
• High Input Impedance . . . . . . . . . . . . . . . . . . 1MΩ (Typ)
• Excellent Gain Flatness (to 50MHz) . . . . ±0.02dB (Typ)
• Fast Overdrive Recovery. . . . . . . . . . . . . . . <10ns (Typ)
Applications
A unique feature of the pinout allows the user to select a voltage gain of +1, -1, or +2, without the use of any external
components. Gain selection is accomplished via connections to the inputs, as described in the “Application Information” section. The result is a more flexible product, fewer part
types in inventory, and more efficient use of board space.
Compatibility with existing op amp pinouts provides flexibility to
upgrade low gain amplifiers, while decreasing component
count. Unlike most buffers, the standard pinout provides an
upgrade path should a higher closed loop gain be needed at a
future date.
Ordering Information
• Flash A/D Driver
• Video Switching and Routing
PART NUMBER
• Pulse and Video Amplifiers
HFA1212MJ/883
TEMPERATURE
RANGE
PACKAGE
-55oC to +125oC
8 Lead CerDIP
• Wideband Amplifiers
• RF/IF Signal Processing
• Medical Imaging Systems
Pinout
HFA1212/883
(CERDIP)
TOP VIEW
OUT1
1
8
V+
7
OUT2
6
-IN2
5
+IN2
-+
-IN1
2
+IN1
3
V-
4
+-
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
3-219
511111-883
File Number 3742
Spec Number
Specifications HFA1212/883
Absolute Maximum Ratings
Thermal Information
Voltage Between V+ and V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12V
Voltage at Either Input Terminal . . . . . . . . . . . . . . . . . . . . . . V+ to VOutput Current (Note 1) . . . . . . . . . . . . . . . . Short Circuit Protected
Output Current (50% Duty Cycle, Note 1) . . . . . . . . . . . . . . . . 60mA
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175oC
ESD Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . > 2000V
Storage Temperature Range . . . . . . . . . . . . . . -65oC ≤ TA ≤ +150oC
Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . +300oC
Thermal Resistance
θJA
θJC
CerDIP Package . . . . . . . . . . . . . . . . . 115oC/W
30oC/W
Maximum Package Power Dissipation at +75oC
CerDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.87W
Package Power Dissipation Derating Factor above +75oC
CerDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.7mW/oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Operating Conditions
Operating VSUPPLY (±VS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±5V
Operating Temperature Range . . . . . . . . . . . . . -55oC ≤ TA ≤ +125oC
RL ≥ 50Ω
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
Device Tested at: VSUPPLY = ±5V, AV = +1, RSOURCE = 0Ω, RL = 100Ω, VOUT = 0V, Unless Otherwise Specified.
LIMITS
PARAMETERS
Output Offset
Voltage
SYMBOL
VOS
CONDITIONS
VCM = 0V
GROUP A
SUBGROUPS
TEMPERATURE
MIN
MAX
UNITS
1
+25oC
-10
10
mV
-20
20
mV
-15
15
mV
-30
30
mV
2, 3
Channel-to-Channel
Output Offset
Voltage Mismatch
∆VOS
Common Mode
Rejection Ratio
CMRR
Power Supply
Rejection Ratio
Channel-to-Channel
+IN Current
Mismatch
1
2, 3
PSRRP
PSRRN
Non-Inverting Input
(+IN) Current
VCM = 0V
IBSP
∆IBSP
+125oC,
-55oC
+25oC
+125oC,
-55oC
∆VCM = ±1.8V
V+ = 3.2V, V- = -6.8V
V+ = 6.8V, V- = -3.2V
1
+25oC
42
-
dB
2
+125oC
39
-
dB
∆VCM = ±1.2V
V+ = 3.8V, V- = -6.2V
V+ = 6.2V, V- = -3.8V
3
-55oC
39
-
dB
∆VSUPPLY = ±1.8V
V+ = 6.8V, V- = -5V
V+ = 3.2V, V- = -5V
1
+25oC
45
-
dB
2
+125oC
42
-
dB
∆VSUPPLY = ±1.2V
V+ = 6.2V, V- = -5V
V+ = 3.8V, V- = -5V
3
-55oC
42
-
dB
∆VSUPPLY = ±1.8V
V+ = 5V, V- = -6.8V
V+ = 5V, V- = -3.2V
1
+25oC
45
-
dB
2
+125oC
42
-
dB
∆VSUPPLY = ±1.2V
V+ = 5V, V- = -6.2V
V+ = 5V, V- = -3.8V
3
-55oC
42
-
dB
VCM = 0V
1
+25oC
-15
15
µA
2, 3
+125oC, -55oC
-25
25
µA
1
+25oC
-15
15
µA
2, 3
+125oC, -55oC
-25
25
µA
VCM = 0V
Spec Number
3-220
511111-883
Specifications HFA1212/883
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued)
Device Tested at: VSUPPLY = ±5V, AV = +1, RSOURCE = 0Ω, RL = 100Ω, VOUT = 0V, Unless Otherwise Specified.
LIMITS
PARAMETERS
SYMBOL
+IN Current Common
Mode Sensitivity
CMSIBP
+IN Resistance
Gain
+RIN
AVP1
AVM1
AVP2
Channel-to-Channel
Gain Mismatch
∆AVP1
∆AVM1
∆AVP2
Output Voltage
Swing
VOP100
VON100
Output Voltage
Swing
VOP50
VON50
GROUP A
SUBGROUPS
TEMPERATURE
MIN
MAX
UNITS
∆VCM = ±1.8V
V+ = 3.2V, V- = -6.8V
V+ = 6.8V, V- = -3.2V
1
+25oC
-
1.25
µA/V
2
+125oC
-
2.85
µA/V
∆VCM = ±1.2V
V+ = 3.8V, V- = -6.2V
V+ = 6.2V, V- = -3.8V
3
-55oC
-
2.85
µA/V
Note 2
1
+25oC
800
-
kΩ
CONDITIONS
AV = +1
VIN = -1V to +1V
AV = -1
VIN = -1V to +1V
AV = +2
VIN = -1V to +1V
AV = +1
VIN = -1V to +1V
AV = -1
VIN = -1V to +1V
AV = +2
VIN = -1V to +1V
o
o
2, 3
+125 C, -55 C
350
-
kΩ
1
+25oC
0.98
1.02
V/V
o
o
2, 3
+125 C, -55 C
0.975
1.025
V/V
1
+25oC
-0.98
-1.02
V/V
-0.975
-1.025
V/V
1.96
2.04
V/V
1.95
2.05
V/V
-0.02
0.02
V/V
-0.025
0.025
V/V
-0.025
0.025
V/V
-0.025
0.025
V/V
-0.04
0.04
V/V
-0.05
0.05
V/V
3
-
V
2.8
-
V
-
-3
V
-
-2.8
V
2, 3
1
2, 3
1
2, 3
1
2, 3
1
2, 3
-55oC
+25oC
+125oC,
-55oC
+25oC
+125oC,
-55oC
+25oC
+125oC,
-55oC
+25oC
+125oC,
-55oC
+25oC
AV = -1
RL = 100Ω
VIN = -3.2V
AV = -1
RL = 100Ω
VIN =+3.2V
VIN = +3V
2, 3
AV = -1
RL = 50Ω
VIN = -2.7V
1
+25oC
2.5
-
V
VIN = -2.25V
2
+125oC
2.0
-
V
VIN = -2.25V
3
-55oC
1.4
-
V
VIN = +2.7V
1
+25oC
-
-2.5
V
VIN = +2.25
V
2
+125oC
-
-2.0
V
VIN = +2.25
V
3
-55oC
-
-1.4
V
AV = -1
RL = 50Ω
VIN = -3V
1
+125oC,
2, 3
1
+125oC,
-55oC
+25oC
+125oC,
-55oC
Spec Number
3-221
511111-883
Specifications HFA1212/883
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued)
Device Tested at: VSUPPLY = ±5V, AV = +1, RSOURCE = 0Ω, RL = 100Ω, VOUT = 0V, Unless Otherwise Specified.
LIMITS
PARAMETERS
SYMBOL
Output Current
+IOUT
-IOUT
Quiescent Power
Supply Current
ICC
CONDITIONS
GROUP A
SUBGROUPS
TEMPERATURE
MIN
MAX
UNITS
1
+25oC
50
-
mA
2
+125oC
40
-
mA
3
-55oC
28
-
mA
1
+25oC
-
-50
mA
2
+125oC
-
-40
mA
3
-55oC
-
-28
mA
1
+25oC
5.6
6.1
mA/Op Amp
5.2
6.5
mA/Op Amp
-6.1
-5.6
mA/Op Amp
-6.5
-5.2
mA/Op Amp
Note 3
Note 3
RL = 100Ω
+125oC,
2, 3
IEE
RL = 100Ω
-55oC
+25oC
1
+125oC,
2, 3
-55oC
NOTES:
1. Output is short circuit protected to ground. Brief short circuits to ground will not degrade reliability, however continuous (100% duty cycle)
output current must not exceed 30mA for maximum reliability.
2. Guaranteed from +IN Common Mode Rejection Test, by: +RIN = 1/CMSIBP .
3. Guaranteed from VOUT Test with RL = 50Ω, by: IOUT = VOUT/50Ω.
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS
Table 2 Intentionally Left Blank.
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS
Table 3 Intentionally Left Blank.
TABLE 4. ELECTRICAL TEST REQUIREMENTS
MIL-STD-883 TEST REQUIREMENTS
SUBGROUPS (SEE TABLE 1)
Interim Electrical Parameters (Pre Burn-In)
1
Final Electrical Test Parameters
1(Note 1), 2, 3
Group A Test Requirements
1, 2, 3
Groups C and D Endpoints
1
NOTE:
1. PDA applies to Subgroup 1 only.
Spec Number
3-222
511111-883
HFA1212/883
Die Characteristics
DIE DIMENSIONS:
69 x 92 x 19 mils ± 1 mils
1750 x 2330 x 483µm ± 25.4µm
METALLIZATION:
Type: Metal 1: AICu(2%)/TiW
Thickness: Metal 1: 8kÅ ± 0.4kÅ
Type: Metal 2: AICu(2%)
Thickness: Metal 2: 16kÅ ± 0.8kÅ
GLASSIVATION:
Type: Nitride
Thickness: 4kÅ ± 0.5kÅ
WORST CASE CURRENT DENSITY:
TBD
TRANSISTOR COUNT: 150
SUBSTRATE POTENTIAL (Powered Up): Floating (Recommend Connection to V-)
Metallization Mask Layout
HFA1212/883
-IN1
OUT1
NC
V+
NC
OUT2
+IN1
NC
-IN2
V-
NC
+IN2
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may
result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Spec Number
3-223
511111-883