TSS0230U Taiwan Semiconductor Small Signal Product Surface Mount Schottky Barrier FEATURES - Designed for mounting on small surface - Extremely thin/leadless package - Low capacitance - Low forward voltage drop - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 0603 MECHANICAL DATA - Case: 0603 - Molding compound, UL flammability classification rating 94V-0 - Terminal: Gold plated, solderable per MIL-STD-750, method 2026 - Polarity : Indicated by cathode band - Weight : 3 mg (approximately) - Marking code: BB MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER SYMBOL VALUE UNIT VRRM 35 V DC Reverse Voltage VR 30 V Average Forward Current IO 200 mA Peak Forward Surge Current 8.3 ms Single Half Sine-Wave Superimposed on Rate Load IFSM 1.0 A Power Dissipation Pd 150 mW Forward Voltage @ IF=200mA VF 0.6 V IR 1.0 μA Typical Capacitance Between Terminals VR=1V, f =1.0MHz Reverse Voltage CJ 1.5 pF Junction Temperature TJ -40 to +125 o C -40 to +125 o C Repetitive Peak Reverse Voltage Reverse Leakage Current Storage Temperature VR=10V TSTG Version: D1601 TSS0230U Taiwan Semiconductor Small Signal Product RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) Fig.1 Forward characteristics Fig. 2 Reverse characteristics 1000 1000 125°C 100 Reverse Current (μA) Forward Current (mA) 100 10 125°C 75°C 25°C -25°C 1 75°C 10 1 25°C 0.1 -25°C 0.01 0.1 400u 0.001 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 5 10 15 20 25 30 1 Reverse Voltage (V) Forward voltage (V) 2 Fig. 3 Capacitance between terminals characteristics Fig. 4 Current derating curve Average Forward Current (%) Capacitance Between Terminals (pF) 3 120 100 f = 1MHz 10 4 100 80 Fig. 3 60 40 Fig. 4 20 0 1 0 5 10 15 20 25 0 30 Reverse Voltage (V) 25 50 75 100 125 150 VCE(sat) Ambient Temperature (°C) 1 IF=360mA 580 570 560 550 AVG=560mV 540 0 10 20 30 40 50 60 70 80 90 100 1000 900 800 700 600 500 400 300 200 100 0 VR=10V AVG=111nA 0 10 20 30 40 50 60 70 80 90 100 Capacitance between terminals (pF) 590 Fig 7 CT Dispersion Map Fig 6 IR Dispersion Map Reverse Dumont (nA) Forward Voltage (mV) Fig 5 VF Dispersion Map 50 45 40 35 30 25 20 15 10 5 0 2 f=1MHz VR=10V 3 AVG18pF 4 0 10 20 30 40 50 60 70 80 90 100 5 Version: D1601 TSS0230U Taiwan Semiconductor Small Signal Product ORDERING INFORMATION PART NO. PACKING CODE TSS0230U RG PACKING CODE SUFFIX PACKAGE PACKING 0603 4K / 7" Reel G Note: Whole series with green compound EXAMPLE EXAMPLE P/N PART NO. PACKING CODE TSS0230U RGG TSS0230U RG PACKING CODE DESCRIPTION SUFFIX G Green compound PACKAGE OUTLINE DIMENSION 0603 DIM. Unit (mm) Unit (inch) Min Typ. Max Min Typ. Max L 1.60 - 1.80 0.063 - 0.071 W 0.80 - 1.00 0.031 - 0.039 T 0.70 - 0.85 0.028 - 0.033 C - 0.45 - - 0.018 - D - 0.70 - - 0.028 - Version: D1601 TSS0230U Taiwan Semiconductor Small Signal Product Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Version: D1601