SMB10J SERIES Taiwan Semiconductor CREAT BY ART 1000W Surface Mount Transient Voltage Suppressor FEATURES - Low profile package - Ideal for automated placement - Glass passivated junction - Excellent clamping capability - Fast response time: typically less than 1.0ps - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 DO-214AA (SMB) MECHANICAL DATA Case: DO-214AA (SMB) Molding compound: UL flammability classification rating 94V-0 Moisture sensitivity level: level 1, per J-STD-020 Part no. with suffix "H" means AEC-Q101 qualified Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 2 whisker test Weight: 0.11 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) SYMBOL VALUE UNIT Peak power dissipation at TA=25°C, tp=1ms (Note 1) PARAMETER PPK 1000 W Steady state power dissipation PD 5 W Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 100 A VF 3.5 V RθJL RθJA 20 100 °C/W TJ - 55 to +175 °C TSTG - 55 to +175 °C Maximum instantaneous forward voltage at 50 A for unidirectional only Typical thermal resistance Operating junction temperature range Storage temperature range Note 1: Non-repetitive current pulse per fig. 3 and derated above TA=25°C per fig. 2 Devices for bipolar applications 1. For bidirectional use CA suffix ORDERING INFORMATION PART NO. PART NO. SUFFIX PACKING CODE PACKING CODE SUFFIX (*) R5 SMB10J30A H R4 G M4 PACKAGE PACKING SMB 850 / 7" Plastic reel SMB 3,000 / 13" Paper reel SMB 3,000 / 13" Plastic reel *: Optional available EXAMPLE EXAMPLE P/N PART NO. SMB10J30AHR5G SMB10J30A PART NO. SUFFIX H PACKING CODE R5 PACKING CODE SUFFIX G DESCRIPTION AEC-Q101 qualified Green compound Version: A1511 SMB10J SERIES Taiwan Semiconductor CREAT BY ART RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) FIG.2 PULSE DERATING CURVE FIG. 1 PEAK PULSE POWER RATING CURVE 125 Non-reperirive pulse waveform shown in fig.3 PEAK PULSE POWER(PPP) OR CURRENT (IPP) A DERATING IN PERCENTAGE (%) PPPM, PEAK PULSE POWER, KW 100 10 100 75 50 25 0 1 1 10 100 0 1000 tp, PULSE WIDTH, (μs) Peak value IPPM 100 Half value-IPPM/2 80 10/1000μs, waveform as defined by R.E.A. 60 40 20 td 0 0 0.5 1 1.5 2 t, TIME ms 2.5 100 125 150 175 200 100 3 3.5 4 IFSM, PEAK FORWARD SURGE CURRENT (A) PEAK PULSE CURRENT (%) 120 75 FIG. 4 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT UNIDIRECTIONAL ONLY Pulse width(td) is defined as the point where the peak current decays to 50% of IPPM tr=10μs 50 TA, AMBIENT TEMPERATURE (°C) FIG. 3 CLAMPING POWER PULSE WAVEFORM 140 25 8.3ms single half sine wave 10 1 10 100 NUMBER OF CYCLES AT 60 Hz Version: A1511 SMB10J SERIES Taiwan Semiconductor CREAT BY ART Device Marking Code Device Breakdown Voltage Test Stand-Off VBR (V) Current Voltage IT VWM @ VWM Current IPPM @ IPPM Maximum Maximum Maximum Reverse Leakage Peak Pulse Clamping Voltage BI UNI BI Min Max (mA) (V) IR (μA) (A) VC (V) SMB10J9.0A SMB10J9.0CA 1KV KVC 10.0 11.1 1 9 10 64.9 15.4 SMB10J10A SMB10J10CA 1KX KXC 11.1 12.3 1 10 8 58.8 17.0 SMB10J11A SMB10J11CA 1KZ KZC 12.2 13.5 1 11 5 54.9 18.2 SMB10J12A SMB10J12CA 1LE LEC 13.3 14.7 1 12 5 50.3 19.9 SMB10J13A SMB10J13CA 1LG LGC 14.4 15.9 1 13 5 46.5 21.5 SMB10J14A SMB10J14CA 1LK LKC 15.6 17.2 1 14 5 43.1 23.2 SMB10J15A SMB10J15CA 1LM LMC 16.7 18.5 1 15 1 41.0 24.4 SMB10J16A SMB10J16CA 1LP LPC 17.8 19.7 1 16 1 38.5 26.0 SMB10J17A SMB10J17CA 1LR LRC 18.9 20.9 1 17 1 36.2 27.6 SMB10J18A SMB10J18CA 1LT LTC 20.0 22.1 1 18 1 34.2 29.2 SMB10J20A SMB10J20CA 1LV LVC 22.2 24.5 1 20 1 30.9 32.4 SMB10J22A SMB10J22CA 1LX LXC 24.4 26.9 1 22 1 28.2 35.5 SMB10J24A SMB10J24CA 1LZ LZC 26.7 29.5 1 24 1 25.7 38.9 SMB10J26A SMB10J26CA 1ME MEC 28.9 31.9 1 26 1 23.8 42.1 SMB10J28A SMB10J28CA 1MG MGC 31.1 34.4 1 28 1 22.0 45.4 SMB10J30A SMB10J30CA 1MK MKC 33.3 36.8 1 30 1 20.7 48.4 SMB10J33A SMB10J33CA 1MM MMC 36.7 40.6 1 33 1 18.8 53.3 SMB10J36A SMB10J36CA 1MP MPC 40.0 44.2 1 36 1 17.2 58.1 SMB10J40A SMB10J40CA 1MR MRC 44.4 49.1 1 40 1 15.5 64.5 UNI Version: A1511 SMB10J SERIES Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DO-214AA (SMB) Unit (mm) DIM. Unit (inch) Min Max Min Max A 1.95 2.10 0.077 0.083 B 4.25 4.75 0.167 0.187 C 3.48 3.73 0.137 0.147 D 1.99 2.61 0.078 0.103 E 0.90 1.41 0.035 0.056 F 5.10 5.30 0.201 0.209 G 0.10 0.20 0.004 0.008 H 0.15 0.31 0.006 0.012 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 2.3 0.091 B 2.5 0.098 C 4.3 0.169 D 1.8 0.071 E 6.8 0.268 MARKING DIAGRAM P/N = Specific Device Code G = Green Compound YW = Date Code F = Factory Code Note: Cathode band for uni-directional products only Version: A1511 SMB10J SERIES Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Version: A1511