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THC63LVDM83C(5S) _Rev.1.00_E
THC63LVDM83C(5S)
REDUCED SWING LVDS 24Bit COLOR HOST-LCD PANEL INTERFACE
General Description
Features
The THC63LVDM83C(5S) transmitter is designed to
support pixel data transmission between Host and Flat
Panel Display from NTSC up to SXGA+ resolutions.
The THC63LVDM83C(5S) converts 28bits of CMOS/
TTL data into LVDS(Low Voltage Differential Signaling) data stream. The transmitter can be programmed
for rising edge or falling edge clocks through a dedicated pin. At a transmit clock frequency of 85MHz,
24bits of RGB data and 4bits of timing and control data
(HSYNC, VSYNC, CNTL1, CNTL2) are transmitted at
an effective rate of 595Mbps per LVDS channel.
• Wide dot clock range: 8-85MHz suited for NTSC,
VGA, SVGA, XGA
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PLL requires no external components
Supports spread spectrum clock generator
On chip jitter filtering
Clock edge selectable
Supports reduced swing LVDS for low EMI
Power down mode
Low power single 3.3V CMOS design
Low profile 56 Lead TSSOP Package
1.2 up to 3.3V tolerant data inputs to connect
directly to low power,low voltage application and
graphic processor.
Backward compatible with
THC63LVDM83R(24bits)
Block Diagram
THC63LVDM83C(5S)
CMOS/TTL
INPUTS
TB0-6
TC0-6
TD0-6
7
7
7
7
TTL PARALLEL TO SERIAL
TA0-6
DATA
(LVDS)
TA +/TB +/TC +/TD +/(56-595Mbit/On Each
LVDS Channel)
TRANSMITTER
CLKIN
(8 to 85MHz)
TCLK +/CLOCK
(LVDS)
8-85MHz
PLL
R/F
/PDWN
RS
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THine Electronics, Inc.
THC63LVDM83C(5S)_Rev.1.00_E
Pin Out
THC63LVDM83C(5S)
RS
TD1
TA5
TA6
GND
TB0
TB1
TD2
VCC
TD3
TB2
TB3
GND
TB4
TB5
TD4
R/F
TD5
TB6
TC0
GND
TC1
TC2
TC3
TD6
VCC
TC4
TC5
Copyright (C)2011 THine Electronics, Inc.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
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TA4
TA3
TA2
GND
TA1
TA0
TD0
LVDS GND
TATA+
TBTB+
LVDS VCC
LVDS GND
TCTC+
TCLKTCLK+
TDTD+
LVDS GND
PLL GND
PLL VCC
PLL GND
/PDWN
CLK IN
TC6
GND
THine Electronics, Inc.
THC63LVDM83C(5S)_Rev.1.00_E
Pin Description
Pin Name
Pin #
Type
Description
TA+, TA-
47, 48
LVDS OUT
TB+, TB-
45, 46
LVDS OUT
TC+, TC-
41, 42
LVDS OUT
TD+, TD-
37, 38
LVDS OUT
TCLK+, TCLK-
39, 40
LVDS OUT
TA0 ~ TA6
51, 52, 54, 55, 56, 3, 4
IN
TB0 ~ TB6
6, 7, 11, 12, 14, 15, 19
IN
TC0 ~ TC6
20, 22, 23, 24, 27, 28, 30
IN
TD0 ~ TD6
50, 2, 8, 10, 16, 18, 25
IN
/PDWN
32
IN
LVDS Data Out.
LVDS Clock Out.
Pixel Data Inputs.
H: Normal operation,
L: Power down (all outputs are Hi-Z)
LVDS swing mode, VREF select.
RS
1
RS
LVDS
Swing
Small Swing
Input Support
VCC
350mV
N/A
0.6 ~ 1.4V
350mV
RS=VREFa
GND
200mV
N/A
IN
a. VREF is Input Reference Voltage.
Input Clock Triggering Edge Select.
R/F
17
IN
VCC
9, 26
Power
CLKIN
31
IN
GND
5, 13, 21,
29, 53
H: Rising edge, L: Falling edge
Power Supply Pins for TTL inputs and digital
circuitry.
Clock in.
Ground
Ground Pins for TTL inputs and digital circuitry.
LVDS VCC
44
Power
Power Supply Pins for LVDS Outputs.
LVDS GND
36, 43, 49
Ground
Ground Pins for LVDS Outputs.
PLL VCC
34
Power
Power Supply Pin for PLL circuitry.
PLL GND
33, 35
Ground
Ground Pins for PLL circuitry.
Copyright (C)2011 THine Electronics, Inc.
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THine Electronics, Inc.
THC63LVDM83C(5S) _Rev.1.00_E
Absolute Maximum Ratings 1
Supply Voltage (VCC)
-0.3V ~ +4.0V
CMOS/TTL Input Voltage
-0.3V ~ (VCC + 0.3V)
CMOS/TTL Output Voltage
-0.3V ~ (VCC + 0.3V)
LVDS Driver Output Voltage
-0.3V ~ (VCC + 0.3V)
Output Current
continuous
Junction Temperature
+125 °C
Storage Temperature Range
-55 °C ~ +150 °C
Resistance to soldering heat
+260 °C /10sec
Maximum Power Dissipation @+25 °C
0.5W
Recommended Operating Conditions
Parameter
Min
Typ
Max
Units
All Supply Voltage
3.0
3.3
3.6
V
Operating Ambient Temperature
-40
85
°C
CLK IN Frequency
8
85
MHz
1. “Absolute Maximum Ratings” are those valued beyond which the safety of the device can not be guaranteed. They
are not meant to imply that the device should be operated at these limits. The tables of “Electrical Characteristics”
specify conditions for device operation.
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THine Electronics, Inc.
THC63LVDM83C(5S)_Rev.1.00_E
Electrical Characteristics
CMOS/TTL DC Specifications
VCC = VCC = PLL VCC = LVDS VCC
Symbol
Parameter
VIH
High Level Input Voltage
RS=VCC or GND
2.0
VCC
V
VIL
Low Level Input Voltage
RS=VCC or GND
GND
0.8
V
1.2
2.8
V
VDDQ1
Conditions
Small Swing Voltage
VREF
Input Reference Voltage
Small Swing (RS=VDDQ/2)
VSH2
Small Swing High Level
Input Voltage
VREF = VDDQ/2
VSL2
Small Swing Low Level
Input Voltage
VREF = VDDQ/2
IINC
Input Current
0V ≤ V IN ≤ V CC
Min.
Typ.
Max.
Units
VDDQ/2
VDDQ/2
+100mV
V
VDDQ/2
-100mV
± 10
V
uA
Notes: 1VDDQ voltage defines max voltage of small swing input. It is not an actual input voltage.
2
Small swing signal is applied to TA0-6,TB0-6,TC0-6,TD0-6 and CLKIN.
LVDS Transmitter DC Specifications
VCC = VCC = PLL VCC = LVDS VCC
Symbol
Parameter
Conditions
Normal
swing
VOD
Differential Output Voltage
RL=100Ω
Min.
Typ.
Max.
Units
250
350
500
mV
100
200
300
mV
35
mV
RS=VCC
Reduced
swing
RS=GND
ΔVOD
VOC
Change in VOD between
complementary output states
Common Mode Voltage
ΔVOC
Change in VOC between
complementary output states
IOS
Output Short Circuit Current
IOZ
Output TRI-STATE Current
Copyright (C)2011 THine Electronics, Inc.
RL=100Ω
VOUT=0V, RL=100Ω
/PDWN=0V,
VOUT=0V to VCC
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1.125
1.25
1.375
V
35
mV
-24
mA
± 10
uA
THine Electronics, Inc.
THC63LVDM83C(5S)_Rev.1.00_E
Supply Current
VCC = VCC = PLL VCC = LVDS VCC
Symbol
ITCCG
Parameter
Transmitter Supply
Current
Condition(*)
RL=100Ω,CL=5pF
VCC=3.3V, f=85MHz
Gray Scale Pattern
ITCCW
Transmitter Supply
Current
RL=100Ω,CL=5pF
VCC=3.3V, f=85MHz
Worst Case Pattern
ITCCS
Transmitter Power
Down Supply Current
/PDWN = L
Typ.
Max.
Units
RS=VCC
52
58
mA
RS=GND
40
46
mA
RS=VCC
61
67
mA
RS=GND
50
56
mA
10
uA
Gray Scale Pattern
CLK
Tx1
Tx2
Tx3
Tx4
Tx5
Tx6
x= A, B, C, D
Worst Case Pattern
CLK
Tx1
Tx2
Tx3
Tx4
Tx5
Tx6
x= A, B, C, D
Fig1. Data Pattern
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THC63LVDM83C(5S)_Rev.1.00_E
Switching Characteristics
VCC = VCC = PLL VCC = LVDS VCC
Symbol
Parameter
tTCIT
CLK IN Transition time
tTCP
CLK IN Period
tTCH
Min.
Typ.
Max.
Units
5.0
ns
11.7
T
125
ns
CLK IN High Time
0.35T
0.5T
0.65T
ns
tTCL
CLK IN Low Time
0.35T
0.5T
0.65T
ns
tTCD
CLK IN to TCLK+/- Delay
tTS
TTL Data Setup to CLK IN
tTH
TTL Data Hold from CLK IN
tLVT
LVDS Transition Time
3T
ns
2.5
ns
0
ns
0.6
1.5
ns
0.0
+0.2
ns
tTOP1
Output Data Position0 (T=11.7ns)
-0.2
tTOP0
Output Data Position1 (T=11.7ns)
T
--- – 0.2
7
T
--7
T
--- + 0.2
7
ns
tTOP6
Output Data Position2 (T=11.7ns)
T
2 --- – 0.2
7
T
2 --7
T
2 --- + 0.2
7
ns
tTOP5
Output Data Position3(T=11.7ns)
T
3 --- – 0.2
7
T
3 --7
T
3 --- + 0.2
7
ns
tTOP4
Output Data Position4 (T=11.7ns)
T
4 --- – 0.2
7
T
4 --7
T
4 --- + 0.2
7
ns
tTOP3
Output Data Position5 (T=11.7ns)
T
5 --- – 0.2
7
T
5 --7
T
5 --- + 0.2
7
ns
tTOP2
Output Data Position6 (T=11.7ns)
T
6 --- – 0.2
7
T
6 --7
T
6 --- + 0.2
7
ns
tTPLL
Phase Lock Loop Set
10.0
ms
AC Timing Diagrams
TTL Input
90%
CLK IN
90%
10%
10%
t TCIT
t TCIT
Fig2. CLKIN Transition Time
LVDS Output
Vdiff=(TA+)-(TA-)
TA+
Vd if f
5pF
80%
80%
20%
20%
100Ω
TAt LVT
LVDS Output Load
t LVT
Fig3. LVDS Output Load and Transition Time
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THC63LVDM83C(5S)_Rev.1.00_E
AC Timing Diagrams
RS Pin
VCC
0.6~1.4V
GND
tTCP
TTL Inputs
tTC H
VOD
350mV
200mV
VCC
CLK IN
VCC/2
VCC/2
VCC/2
GND
t T CL
tT S
tT H
VCC
Tx0-Tx6
VCC/2
VCC/2
GND
t TCD
TCLK+
VOD
VOC
TCLKNote:
CLK IN: for R/F=GND, denote as solid line,
for R/F=VCC, denote as dashed line.
Fig4. CLKIN Period, High/Low Time, Setup/Hold Timing
Small Swing Inputs
tTC P
t T CH
RS Pin
VREF
VCC
0.6~1.4V
GND
VCC/2
Input Voltage of RS pin
VCC/2
VD DQ
CLK IN
VD DQ /2
V DD Q /2
VREF
VDD Q /2
GND
t TCL
t TS
t TH
VDDQ
Tx0-Tx6
V D D Q/ 2
VD DQ /2
VREF
GND
tTCD
TCLK+
VOC
TCLK-
Note:
CLK IN: for R/F=GND, denote as solid line,
for R/F=VCC, denote as dashed line.
Fig5. Small Swing Inputs
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THC63LVDM83C(5S)_Rev.1.00_E
AC Timing Diagrams
LVDS Output
TCLK+/(Differential)
Vdiff = 0V
Vdiff = 0V
TA+/-
TA6
TA5
TA4
TA3
TA2
TA1
TA0
TB+/-
TB6
TB5
TB4
TB3
TB2
TB1
TB0
TC+/-
TC6
TC5
TC4
TC3
TC2
TC1
TC0
TD+/-
TD6
TD5
TD4
TD3
TD2
TD1
TD0
Previous Cycle
Next Cycle
t TOP1
t TOP0
t TOP6
t TOP5
t TOP4
t TOP3
t TOP2
Fig6. LVDS Output Data Position
Phase Lock Loop Set Time
/PDWN
2.0V
3.6V
VCC
3.0V
tTPLL
CLKIN
Vdiff = 0V
TCLK+/Fig7. PLL Lock Set Time
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THC63LVDM83C(5S) _Rev.1.00_E
Note
1)Cable Connection and Disconnection
Don't connect and disconnect the LVDS cable, when the power is supplied to the system.
2)GND Connection
Connect the each GND of the PCB which THC63LVDM83C(5S) and LVDS-Rx on it. It is better for EMI reduction to
place GND cable as close to LVDS cable as possible.
3)Multi Drop Connection
Multi drop connection is not recommended.
TCLK+
THC63LVDM83C(5S)
LVDS-Rx
TCLK-
LVDS-Rx
4)Asynchronous use
Asynchronous use such as following systems are not recommended.
CLKOUT
DATA
TCLK+
THC63LVDM83C(5S)
CLKOUT
LVDS-Rx
TCLK-
TCLK-
IC
IC
CLKOUT
DATA
TCLK+
THC63LVDM83C(5S)
CLKOUT
DATA
LVDS-Rx
TCLK-
DATA
TCLK+
THC63LVDM83C(5S)
TCLK-
IC
IC
TCLK+
CLKOUT
DATA
Copyright (C)2011 THine Electronics, Inc.
THC63LVDM83C(5S)
TCLK-
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THC63LVDM83C(5S) _Rev.1.00_E
Package
56 Lead Molded Thin Shrink Small Outline Package, JEDEC
Unit : millimeters
14.0 ± 0.1
56
29
8.1 ± 0.1
6.1 ± 0.1
4.05
1
28
(1.0)
1.2 MAX
0.10 ± 0.05
0.50 TYP
Copyright (C)2011 THine Electronics, Inc.
0.20 TYP
11/12
THine Electronics, Inc.
THC63LVDM83C(5S)_Rev.1.00_E
Notices and Requests
1. The product specifications described in this material are subject to change without prior notice.
2. The circuit diagrams described in this material are examples of the application which may not
always apply to the customer's design. We are not responsible for possible errors and omissions
in this material. Please note if errors or omissions should be found in this material, we may not
be able to correct them immediately.
3. This material contains our copy right, know-how or other proprietary. Copying or disclosing to
third parties the contents of this material without our prior permission is prohibited.
4. Note that if infringement of any third party's industrial ownership should occur by using this
product, we will be exempted from the responsibility unless it directly relates to the production
process or functions of the product.
5. This product is presumed to be used for general electric equipment, not for the applications
which require very high reliability (including medical equipment directly concerning people's
life, aerospace equipment, or nuclear control equipment). Also, when using this product for the
equipment concerned with the control and safety of the transportation means, the traffic signal
equipment, or various Types of safety equipment, please do it after applying appropriate
measures to the product.
6. Despite our utmost efforts to improve the quality and reliability of the product, faults will occur
with a certain small probability, which is inevitable to a semi-conductor product. Therefore, you
are encouraged to have sufficiently redundant or error preventive design applied to the use of the
product so as not to have our product cause any social or public damage.
7. Please note that this product is not designed to be radiation-proof.
8. Customers are asked, if required, to judge by themselves if this product falls under the category
of strategic goods under the Foreign Exchange and Foreign Trade Control Law.
THine Electronics, Inc.
E-mail: [email protected]
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