Data Sheet

SO
D1
23W
PNS40010ER
400 V, 1 A high power density, standard switching time
PN-rectifier
Rev. 2 — 21 August 2012
Product data sheet
1. Product profile
1.1 General description
High power density, standard switching time PN-rectifier with high-efficiency planar
technology, encapsulated in a small and flat lead SOD123W Surface-Mounted
Device (SMD) plastic package.
1.2 Features and benefits
 Forward current IF ≤ 1 A
 Low inductance
 Reverse voltage VR ≤ 400 V
 Standard switching time
 Small and flat lead SMD plastic
package
 Low forward voltage
 Package height typ. 1 mm
 Low reverse current
 High power capability
 AEC-Q101 qualified
1.3 Applications
 General-purpose rectification
 Standard switching applications
 Reverse polarity protection
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Tsp ≤ 160 °C
-
-
1.4
A
-
-
400
V
IF
forward current
VRRM
repetitive peak reverse
voltage
VR
reverse voltage
-
-
400
V
IFSM
non-repetitive peak
forward current
Tj(init) = 25 °C; tp = 8 ms; square wave
-
-
32
A
VF
forward voltage
IF = 1 A; tp ≤ 300 µs; δ ≤ 0.02 ;
Tj = 25 °C
-
0.93
1.1
V
IF(AV)
average forward
current
δ = 0.5 ; f = 20 kHz; Tamb ≤ 115 °C;
square wave
-
-
1
A
-
-
1
A
δ = 0.5 ; f = 20 kHz; Tsp ≤ 170 °C;
square wave
[1]
Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.
[1]
PNS40010ER
NXP Semiconductors
400 V, 1 A high power density, standard switching time PN-rectifier
2. Pinning information
Table 2.
Pinning information
Pin
Symbol Description
1
K
cathode
2
A
anode
Simplified outline
1
Graphic symbol
2
SOD123W
1
2
006aab040
3. Ordering information
Table 3.
Ordering information
Type number
PNS40010ER
Package
Name
Description
Version
SOD123W
plastic surface mounted package; 2 leads
SOD123W
4. Marking
Table 4.
Marking codes
Type number
Marking code
PNS40010ER
EH
PNS40010ER
Product data sheet
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Rev. 2 — 21 August 2012
© NXP B.V. 2012. All rights reserved.
2 of 14
PNS40010ER
NXP Semiconductors
400 V, 1 A high power density, standard switching time PN-rectifier
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VRRM
Conditions
Min
Max
Unit
repetitive peak reverse voltage
-
400
V
VR
reverse voltage
-
400
V
-
280
V
-
1.4
A
-
1
A
δ = 0.5 ; f = 20 kHz; Tsp ≤ 170 °C;
square wave
-
1
A
-
32
A
VRMS
RMS voltage
IF
forward current
Tsp ≤ 160 °C
IF(AV)
average forward current
δ = 0.5 ; f = 20 kHz; square wave;
Tamb ≤ 115 °C
IFSM
non-repetitive peak forward
current
square wave; Tj(init) = 25 °C; tp = 8 ms
Ptot
total power dissipation
Tamb ≤ 25 °C
[1]
[2]
-
750
mW
[3]
-
1300
mW
[4]
-
2300
mW
-
175
°C
Tj
junction temperature
Tamb
ambient temperature
-55
175
°C
Tstg
storage temperature
-65
175
°C
Unit
[1]
Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[4]
Device mounted on a ceramic PCB, AI2O3, standard footprint.
6. Thermal characteristics
Table 6.
Symbol
Rth(j-a)
Rth(j-sp)
Thermal characteristics
Parameter
thermal resistance
from junction to
ambient
Conditions
in free air
thermal resistance
from junction to solder
point
Min
Typ
Max
[1]
-
-
200
K/W
[2]
-
-
115
K/W
[3]
-
-
65
K/W
[4]
-
-
15
K/W
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[3]
Device mounted on an FR4 PCB, AI2O3, standard footprint.
[4]
Soldering point of cathode tab.
PNS40010ER
Product data sheet
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Rev. 2 — 21 August 2012
© NXP B.V. 2012. All rights reserved.
3 of 14
PNS40010ER
NXP Semiconductors
400 V, 1 A high power density, standard switching time PN-rectifier
aaa-003979
103
Zth(j-a)
(K/W)
duty cycle =
0.75
102
0.33
0.2
1
0.5
0.25
0.1
0.05
10
0.02
0.01
0
1
10-1
10-3
10-2
10-1
1
10
102
tp (s)
103
FR4 PCB, standard footprint
Fig 1.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
aaa-003980
103
Zth(j-a)
(K/W)
duty cycle =
102
0.75
0.33
0.2
1
0.5
0.25
0.1
10
0.05
0.01
0.02
0
1
10-1
10-3
10-2
10-1
1
10
102
tp (s)
103
FR4 PCB, mounting pad for cathode 1 cm2
Fig 2.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PNS40010ER
Product data sheet
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Rev. 2 — 21 August 2012
© NXP B.V. 2012. All rights reserved.
4 of 14
PNS40010ER
NXP Semiconductors
400 V, 1 A high power density, standard switching time PN-rectifier
aaa-003981
103
Zth(j-a)
(K/W)
duty cycle =
102
1
0.75
0.5
0.33
0.2
0.25
10
0.1
1
0.05
0.02
0.01
0
10-1
10-3
10-2
10-1
1
102
10
103
tp (s)
Ceramic PCB, Al2O3, standard footprint
Fig 3.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
7. Characteristics
Table 7.
Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VF
forward voltage
IF = 0.5 A; tp ≤ 300 µs; δ ≤ 0.02 ;
Tj = 25 °C
-
0.89
1.05
V
IF = 0.7 A; tp ≤ 300 µs; δ ≤ 0.02 ;
Tj = 25 °C
-
0.91
1.07
V
IF = 1 A; tp ≤ 300 µs; δ ≤ 0.02 ;
Tj = 25 °C
-
0.93
1.1
V
IF = 0.5 A; tp ≤ 300 µs; δ ≤ 0.02 ;
Tj = 125 °C
-
0.76
0.92
V
IF = 0.7 A; tp ≤ 300 µs; δ ≤ 0.02 ;
Tj = 125 °C
-
0.78
0.95
V
IF = 1 A; tp ≤ 300 µs; δ ≤ 0.02 ;
Tj = 125 °C
-
0.81
0.98
V
IF = 1 A; tp ≤ 300 µs; δ ≤ 0.02 ;
Tj = -40 °C
-
1.01
1.18
V
IF = 1 A; tp ≤ 300 µs; δ ≤ 0.02 ;
Tj = 150 °C
-
0.78
0.95
V
IF = 1 A; tp ≤ 300 µs; δ ≤ 0.02 ;
Tj = 175 °C
-
0.75
0.92
V
PNS40010ER
Product data sheet
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Rev. 2 — 21 August 2012
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PNS40010ER
NXP Semiconductors
400 V, 1 A high power density, standard switching time PN-rectifier
Table 7.
Characteristics …continued
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IR
reverse current
VR = 400 V; Tj = -40 °C
-
0.1
10
nA
VR = 400 V; Tj = 25 °C
-
0.001
1
µA
VR = 400 V; Tj = 125 °C
-
1
50
µA
VR = 400 V; Tj = 150 °C
-
5
250
µA
VR = 400 V; Tj = 175 °C
-
10
500
µA
Cd
diode capacitance
VR = 4 V; f = 1 MHz; Tamb = 25 °C
-
8
20
pF
trr
reverse recovery time
IF = 0.5 A; IR = 1 A; IR(meas) = 0.25 A;
Tamb = 25 °C
-
0.8
1.8
µs
aaa-003982
10
IR
(A)
IF
(A)
aaa-003983
10-4
(1)
10-5
(2)
1
10-6
(3)
10-7
10-1
(4)
10-8
10-2
(1)
10-9
(2)
(3)
10-3
(5)
10-10
(4) (5) (6)
(6)
10-11
10-4
0.0
Fig 4.
0.5
1.0
VF (V)
1.5
10-12
0
100
(1) Tj = 175 °C
(1) Tj = 175 °C
(2) Tj = 150 °C
(2) Tj = 150 °C
(3) Tj = 125°C
(3) Tj = 125 °C
(4) Tj = 85 °C
(4) Tj = 85 °C
(5) Tj = 25 °C
(5) Tj = 25 °C
(6) Tj = −40 °C
(6) Tj = −40 °C
Forward current as a function of forward
voltage; typical values
PNS40010ER
Product data sheet
Fig 5.
200
300
VR (V)
400
Reverse current as a function of reverse
voltage; typical values
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© NXP B.V. 2012. All rights reserved.
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PNS40010ER
NXP Semiconductors
400 V, 1 A high power density, standard switching time PN-rectifier
aaa-003984
20
aaa-003985
103
Cd
(pF)
IFSM
(A)
15
102
10
5
0
0
100
200
300
VR (V)
10
102
400
f = 1 MHz; Tamb = 25 °C
Fig 6.
103
104
tp (μs)
Tamb = 25 °C
Diode capacitance as a function of reverse
voltage; typical values
Fig 7.
aaa-003986
1.2
PF(AV)
(W)
Non-repetitive peak forward current as a
function of pulse duration; typical values
aaa-003987
4.5
PR(AV)
(mW)
(4)
(3)
(1)
0.8
3.0
(2)
(3)
(2)
(1)
0.4
1.5
0.0
0.0
Fig 8.
0.5
1.0
IF(AV) (A)
0.0
1.5
(4)
0
100
Tj = 175 °C
Tj = 175 °C
(1) δ = 0.1
(1) δ = 1
(2) δ = 0.2
(2) δ = 0.9
(3) δ = 0.5
(3) δ = 0.8
(4) δ = 1
(4) δ = 0.5
Average forward power dissipation as a
function of average forward current; typical
values
PNS40010ER
Product data sheet
Fig 9.
200
300
VR (V)
400
Average reverse power dissipation as a
function of reverse voltage; typical values
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Rev. 2 — 21 August 2012
© NXP B.V. 2012. All rights reserved.
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PNS40010ER
NXP Semiconductors
400 V, 1 A high power density, standard switching time PN-rectifier
aaa-003988
1.5
aaa-003989
1.5
(1)
IF(AV)
(A)
IF(AV)
(A)
(1)
1.0
1.0
(2)
(2)
(3)
(3)
0.5
0.5
(4)
(4)
0.0
0
50
100
150
200
Tamb (°C)
0.0
0
100
150
200
Tamb (°C)
FR4 PCB, standard footprint
FR4 PCB, mounting pad for cathode 1 cm2
Tj = 175 °C
Tj = 175 °C
(1) δ = 1 (DC)
(1) δ = 1 (DC)
(2) δ = 0.5; f = 20 kHz
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig 10. Average forward current as a function of
ambient temperature; typical values
aaa-003990
1.5
Fig 11. Average forward current as a function of
ambient temperature; typical values
aaa-003991
1.5
(1)
(1)
IF(AV)
(A)
IF(AV)
(A)
1.0
1.0
(2)
(2)
(3)
(3)
0.5
0.5
(4)
0.0
50
0
(4)
50
100
150
200
Tamb (°C)
0.0
0
50
100
Ceramic PCB, Al2O3, standard footprint
Tj = 175 °C
Tj = 175 °C
(1) δ = 1 (DC)
(1) δ = 1 (DC)
(2) δ = 0.5; f = 20 kHz
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
150
Tsp (°C)
200
(4) δ = 0.1; f = 20 kHz
Fig 12. Average forward current as a function of
ambient temperature; typical values
PNS40010ER
Product data sheet
Fig 13. Average forward current as a function of solder
point temperature; typical values
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Rev. 2 — 21 August 2012
© NXP B.V. 2012. All rights reserved.
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PNS40010ER
NXP Semiconductors
400 V, 1 A high power density, standard switching time PN-rectifier
8. Test information
tr
tp
t
D.U.T.
10 %
+ IF
IF
RS = 50 Ω
SAMPLING
OSCILLOSCOPE
trr
t
Ri = 50 Ω
V = VR + IF × RS
(1)
90 %
VR
mga881
input signal
output signal
Fig 14. Reverse recovery time: test circuit and waveforms
P
tcy
duty cycle δ =
tp
tcy
tp
t
006aac658
Fig 15. Duty cycle definition
The current ratings for the typical waveforms are calculated according to the equations:
IF(AV) = IM × δ with IM defined as peak current, IRMS = IF(AV) at DC, and IRMS = IM × √δ with
IRMS defined as RMS current.
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
PNS40010ER
Product data sheet
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Rev. 2 — 21 August 2012
© NXP B.V. 2012. All rights reserved.
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PNS40010ER
NXP Semiconductors
400 V, 1 A high power density, standard switching time PN-rectifier
9. Package outline
1.9
1.5
1.1
0.9
1
0.6
0.3
3.7
3.3
2.8
2.4
2
0.22
0.10
1.05
0.75
Dimensions in mm
08-11-06
Fig 16. Package outline SOD123W
10. Soldering
4.4
2.9
2.8
solder lands
solder resist
1.1 1.2
(2×) (2×)
2.1 1.6
solder paste
occupied area
1.1
(2×)
1.2
(2×)
Dimensions in mm
sod123w_fr
Fig 17. Reflow soldering footprint for SOD123W
PNS40010ER
Product data sheet
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Rev. 2 — 21 August 2012
© NXP B.V. 2012. All rights reserved.
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PNS40010ER
NXP Semiconductors
400 V, 1 A high power density, standard switching time PN-rectifier
11. Revision history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PNS40010ER v.2
20120821
Product data sheet
-
PNS40010ER v.1
-
-
Modifications:
PNS40010ER v.1
PNS40010ER
Product data sheet
•
Data sheet status updated
20120615
Preliminary data sheet
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Rev. 2 — 21 August 2012
© NXP B.V. 2012. All rights reserved.
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PNS40010ER
NXP Semiconductors
400 V, 1 A high power density, standard switching time PN-rectifier
12. Legal information
12.1 Data sheet status
Document status[1] [2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term 'short data sheet' is explained in section "Definitions".
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URLhttp://www.nxp.com.
12.2 Definitions
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with theTerms and conditions of commercial sale of NXP Semiconductors.
PNS40010ER
Product data sheet
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 21 August 2012
© NXP B.V. 2012. All rights reserved.
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PNS40010ER
NXP Semiconductors
400 V, 1 A high power density, standard switching time PN-rectifier
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published athttp://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Adelante,Bitport,Bitsound,CoolFlux,CoReUse,DESFire,EZ-HV,FabKey,G
reenChip,HiPerSmart,HITAG,I²C-bus
logo,ICODE,I-CODE,ITEC,Labelution,MIFARE,MIFARE Plus,MIFARE
Ultralight,MoReUse,QLPAK,Silicon
Tuner,SiliconMAX,SmartXA,STARplug,TOPFET,TrenchMOS,TriMedia
andUCODE — are trademarks of NXP B.V.
HD Radio andHD Radio logo — are trademarks of iBiquity Digital
Corporation.
13. Contact information
For more information, please visit:http://www.nxp.com
For sales office addresses, please send an email to:salesaddresses@nxp.com
PNS40010ER
Product data sheet
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PNS40010ER
NXP Semiconductors
400 V, 1 A high power density, standard switching time PN-rectifier
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
12.1
12.2
12.3
12.4
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
General description . . . . . . . . . . . . . . . . . . . . . .1
Features and benefits . . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Quick reference data . . . . . . . . . . . . . . . . . . . . .1
Pinning information . . . . . . . . . . . . . . . . . . . . . . .2
Ordering information . . . . . . . . . . . . . . . . . . . . . .2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3
Thermal characteristics . . . . . . . . . . . . . . . . . . .3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Test information . . . . . . . . . . . . . . . . . . . . . . . . . .9
Quality information . . . . . . . . . . . . . . . . . . . . . . .9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 11
Legal information. . . . . . . . . . . . . . . . . . . . . . . .12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Contact information. . . . . . . . . . . . . . . . . . . . . .13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 21 August 2012
Document identifier: PNS40010ER