DATASHEET

DATASHEET
Charging System Safety Circuit
ISL9211B
Features
The ISL9211B is an integrated circuit (IC) optimized to provide
a redundant safety protection to a Li-ion battery charging
system. The IC monitors input voltage, battery voltage, and
charge current. When any of these parameters exceeds its
limit, the IC turns off an internal N-channel MOSFET to remove
power from the charging system to the battery. The IC also
monitors its own internal temperature and turns off the
N-channel MOSFET when the temperature exceeds +150°C.
Together with the battery charger IC and the protection module
in a battery pack, the charging system using the ISL9211B has
triple-level protection and is two-fault tolerant.
• 24V Max Input Voltage
The IC is designed to turn on the internal NFET slowly, to avoid
in-rush current at power-up. It turns off the NFET quickly when
the input is overvoltage, to remove power before damage
occurs. The ISL9211B has a logic flag output to indicate a fault
condition. The enable input allows the system to cut off the
input power, if needed.
• Easy to Use
Related Literature
• Digital Still Cameras
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
• Portable Instruments
• Supports Up To 2.0A Input Current
• Fully Integrated Protection Circuit for Three Protected
Variables
• High Accuracy Protection Thresholds
• User Programmable Overcurrent Protection Threshold
• Responds to Input Overvoltage in Less Than 1µs
• High Immunity of False Triggering Under Transients
• Fault Indication for Various Fault Occurrence
• Pb-Free (RoHS Compliant)
Applications
• Cell Phones
• PDAs and Smart Phones
• Desktop Chargers
• Technical Brief TB379 “Thermal Characterization of
Packaged Semiconductor Devices”
• Technical Brief TB389 “PCB Land Pattern Design and
Surface Mount Guidelines for QFN Packages”
INPUT
INPUT
VIN
OUT
C1
ISL6292
BATTERY
CHARGER
C2
ISL9211B
ILIM
RVB
VB
EN
DISA
ENA
RLIM
GND
FAULT
BATT
PACK
FIGURE 1. TYPICAL APPLICATION CIRCUIT
November 4, 2014
FN7861.1
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC. 2011, 2014. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
ISL9211B
Block Diagram
IN P U T
OUT
V IN
IS L 6 2 9 2
BATTERY
CHARGER
Q1
Q2
POR
P R E -R E G
REF
R1
FET
D R IV E R
CP1
R2
Q3
R L IM
CP2
R VB
R3
R4
GND
FAULT
Pin Configuration
EN
Pin Descriptions
ISL9211B
(8 LD µTDFN)
TOP VIEW
VIN
1
8
OUT
GND
2
7
ILIM
NC
3
6
VB
FAULT
4
5
EN
PAD
2
VB
CP3
Q4
Submit Document Feedback
EA
0 .8 V
L O G IC
1 .2 V
IL IM
SYMBOL
PIN
NUMBER
VIN
1
The input power source. VIN can withstand
24V input.
GND
2
System ground reference.
NC
3
No connection, and must be left floating.
FAULT
4
FAULT is an open-drain logic output that turns
LOW when any protection event occurs.
EN
5
IC enable pin. Pull this pin to LO to enable the
device and pull it to HI to disable.
VB
6
Battery voltage monitoring input. This pin is
connected to the battery pack positive
terminal via an isolation resistor.
ILIM
7
Overcurrent protection threshold setting pin.
Connect a resistor between this pin and GND
to set the OCP threshold.
OUT
8
Output pin.
PAD
PAD
DESCRIPTION
Exposed pad. Connect to system ground.
FN7861.1
November 4, 2014
ISL9211B
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART
MARKING
ISL9211BIRU58XZ-T
58X
TEMP RANGE
(°C)
-40 to +85
PACKAGE
Tape and Reel
(Pb-free)
8 Ld µTDFN
PKG.
DWG. #
L8.2x2B
NOTES:
1. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu-Ag plate
- e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL9211B. For more information on MSL please see Tech Brief TB363.
Submit Document Feedback
3
FN7861.1
November 4, 2014
ISL9211B
Absolute Maximum Ratings
Thermal Information
Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 26V
Output and VB Pin (OUT, VB) (Note 4) . . . . . . . . . . . . . . . . . . . . . -0.3V to 8V
Other Pins (ILIM, FAULT, EN) . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 5.5V
ESD Rating
Human Body Model (Tested per JESD22-A114F) . . . . . . . . . . . . . . . . 3kV
Machine Model (Tested per JESD22-A115-A) . . . . . . . . . . . . . . . . . 200V
Latch Up (Tested per JESD78B; Class II, Level A) . . . . . . . . . . . . . . . 100mA
Thermal Resistance (Typical)
JA (°C/W) JC (°C/W)
8 Ld 2x2 µTDFN (Notes 5, 6). . . . . . . . . . . . .
98
37
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . .+150°C
Maximum Storage Temperature Range . . . . . . . . . . . . . .-65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Supply Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3V to 24V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. The maximum voltage rating for the VB pin under continuous operating conditions is 5.5V. All other pins are allowed to operate continuously at the
absolute maximum ratings.
5. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
6. For JC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
Boldface limits apply over the operating temperature range, -40°C to +85°C.
PARAMETER
MIN
(Note 8)
TYP
MAX
(Note 8)
UNITS
Rising
-
-
2.47
V
Falling
2.20
-
-
V
RLIM = 24.9k, EN = L
-
-
1000
µA
EN = H
-
80
-
µA
5.6
5.8
6.0
V
-
100
-
mV
5.55
-
-
V
-
-
1
µs
0.93
1.0
1.07
A
-
2.0
-
A
SYMBOL
TEST CONDITIONS
POWER-ON RESET
VIN Threshold
VPOR
VIN Bias Current
IVIN
PROTECTIONS
Input OVP Protection
VOVP
Input OVP Hysteresis
Input OVP Falling Threshold
Input OVP Response Time (Note 7)
Overcurrent Protection
IOCP
VVB = 3V, RLIM = 24.9kΩ
Maximum Output Current
IMAX
RLIM = 9.53kΩ
Overcurrent Protection Blanking Time
BTOCP
-
2.0
-
µs
Battery Overvoltage Protection Threshold
VBOVP
4.25
4.34
4.40
V
-
30
-
mV
-
180
-
µs
-
-
20
nA
Over-Temperature Protection Rising Threshold
-
150
-
°C
Over-Temperature Protection Falling Threshold
-
110
-
°C
EN Input Logic HIGH
1.5
-
-
V
EN Input Logic LOW
-
-
0.4
V
EN Internal Pull-down Resistor
-
200
-
kΩ
-
0.4
0.8
V
Battery OVP Threshold Hysteresis
Battery OVP Blanking Time
BTBOVP
VB Pin Leakage Current
VVB = 4.34V
LOGIC
FAULT Output Logic Low
Submit Document Feedback
Sink 5mA current
4
FN7861.1
November 4, 2014
ISL9211B
Electrical Specifications
Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued)
PARAMETER
MIN
(Note 8)
TYP
MAX
(Note 8)
UNITS
Pin Voltage = 4.2V
-
-
1.5
µA
Measured at 200mA
-
170
280
mΩ
SYMBOL
FAULT Output Logic High Leakage Current
TEST CONDITIONS
POWER MOSFET
On-Resistance (Note 7)
rDS(ON)
NOTES:
7. Limits should be considered typical and are not production tested.
8. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
Typical Application
INPUT
VIN
OUT
C1
ISL6292
BATTERY
CHARGER
C2
ISL9211B
RVB
VB
ILIM
EN
ENA
RLIM
FAULT
GND
PART
5
BATT
PACK
DESCRIPTION
RLIM
24.9kΩ
RVB
200kΩ to 1MΩ
C1,C2
Submit Document Feedback
DISA
1µF/25V X5R ceramic capacitor
FN7861.1
November 4, 2014
ISL9211B
Typical Operating Performance
RVB = 200kΩ, unless otherwise noted.
Test conditions for typical operating performance are: VIN = 5V, TA = +25°C, RLIM = 24.9kΩ,
FIGURE 2. POWER UP WITH 500mA LOAD (CH1 = VOUT,
CH2 = VIN, CH4 = IOUT)
FIGURE 3. INPUT OVERVOLTAGE PROTECTION - VIN STEPPING
FROM 5.5V TO 9.5V (CH1 = V FAULT, CH2 = VIN,
CH3 = VOUT)
FIGURE 4. INPUT OVERVOLTAGE PROTECTION - VIN SLOWLY
RAMPING UP TO OVP THRESHOLD (CH1 = VFAULT,
CH2 = VIN, CH3 = VOUT)
FIGURE 5. LINE TRANSIENT - VIN STEPPING FROM 6.5V TO 5.5V
(CH1 = VFAULT, CH2 = VIN, CH3 = VOUT)
FIGURE 6. SHORT CIRCUIT TEST (CH1 = VOUT, CH2 = VFAULT,
CH4 = IOUT)
Submit Document Feedback
6
FIGURE 7. BATTERY OVERVOLTAGE PROTECTION - VB VARYING
BETWEEN 4.3V TO 4.5V. THE IC LATCHED OFF AFTER
16 COUNTS PROTECTION (CH1 = VFAULT, CH2 = VIN,
CH3 = VB, CH4 = VOUT)
FN7861.1
November 4, 2014
ISL9211B
Typical Operating Performance Test conditions for typical operating performance are: VIN = 5V, TA = +25°C, RLIM = 24.9kΩ,
RVB = 200kΩ, unless otherwise noted. (Continued)
FIGURE 9. ZOOMED-IN VIEW OF FIGURE 8
FIGURE 8. POWER UP WITH OUTPUT SHORTED (CH1 = VFAULT,
CH2 = VIN, CH4 = IOUT)
5.85
2.52
2.48
5.80
RISING THRESHOLD
2.40
VOVP (V)
VPOR (V)
2.44
2.36
FALLING THRESHOLD
2.32
2.28
RISING THRESHOLD
5.75
5.70
FALLING THRESHOLD
5.65
2.24
2.20
-50
-30
-10
10
30
50
70
5.60
-50
90
-30
-10
FIGURE 10. VPOR vs TEMPERATURE
1.03
1.01
1.00
0.99
0.98
3.0V
90
0.984
0.982
0.980
0.978
0.976
0.974
0.96
10
30
50
70
90 110 130
TEMPERATURE (°C)
FIGURE 12. OVERCURRENT PROTECTION vs TEMPERATURE AT
VARIOUS INPUT VOLTAGES
Submit Document Feedback
70
0.986
4.3V
1.02
0.95
-50 -30 -10
50
0.988
5.0V
0.97
30
FIGURE 11. INPUT OVERVOLTAGE PROTECTION vs TEMPERATURE
ILIM PIN VOLTAGE (V)
OVERCURRENT PROTECTION (A)
1.04
10
TEMPERATURE (°C)
TEMPERATURE (°C)
7
0.972
-50 -30 -10
10
30
50
70
90 110 130
TEMPERATURE (°C)
FIGURE 13. ILIM PIN VOLTAGE vs TEMPERATURE
FN7861.1
November 4, 2014
ISL9211B
Typical Operating Performance Test conditions for typical operating performance are: VIN = 5V, TA = +25°C, RLIM = 24.9kΩ,
RVB = 200kΩ, unless otherwise noted. (Continued)
350
3.0V
300
4.3V
rDS(ON) (mΩ)
250
200
150
5.0V
100
50
0
-50 -30 -10
10
30
50
70
90
110 130
TEMPERATURE (°C)
FIGURE 14. ON-RESISTANCE vs TEMPERATURE AT DIFFERENT INPUT VOLTAGES
Theory of Operation
The ISL9211B is an integrated circuit (IC) optimized to provide
redundant safety protection to a Li-ion battery against charging
system failures. The IC monitors input voltage, battery voltage,
and charge current. When any of these parameters exceeds its
limit, the IC turns off an internal N-channel MOSFET to remove
power from the charging system. The IC also monitors its own
internal temperature and turns off the N-channel MOSFET when
temperature exceeds +150°C. Together with the battery charger
IC and the protection module in a battery pack, the charging
system has triple-level protection against overcharging the Li-ion
battery and is two-fault tolerant. The ISL9211B protects up to
26V input voltage.
Power-Up
The ISL9211B has a power-on reset (POR) threshold of 2.47V
(max). Before the input voltage reaches the POR threshold, the
internal power NFET is off. Approximately 10ms after the input
voltage exceeds the POR threshold, the IC resets itself and
begins soft-start. The 10ms delay allows any transients at the
input during a hot insertion of the power supply to settle down
before the IC starts to operate. The soft-start slowly turns on the
power NFET to reduce the inrush current as well as the input
voltage drop during the transition. Figure 2 shows the power-up
sequence.
Input Overvoltage Protection (OVP)
The input voltage is monitored by the comparator, CP1, as shown
in the “Block Diagram” on page 2. CP1 has an accurate
reference of 1.2V from the bandgap reference. The OVP
threshold is set by the resistive divider consisting of R1 and R2.
When the input voltage exceeds the threshold, CP1 outputs a
logic signal to turn off the power NFET within 1µs (see Figure 3).
This prevents high input voltage from damaging the electronics
in a handheld system. Hysteresis for the input OVP threshold is
given in the “Electrical Specifications” table on page 4. When the
input overvoltage condition is removed, the ISL9211B re-enables
the output by running through soft-start, as shown in Figure 5.
Because of the 10ms delay before soft-start, the output is never
Submit Document Feedback
8
enabled if the input rises above the OVP threshold quickly, as
shown in Figure 6.
Battery Overvoltage Protection
Battery voltage OVP is realized with the VB pin. The comparator,
CP3, shown in the “Block Diagram” on page 2, monitors the VB
pin and issues an overvoltage signal when battery voltage
exceeds the 4.34V battery OVP threshold. The threshold has
30mV built-in hysteresis. The comparator, CP3, has a built-in
180µs blanking time to prevent any transient voltage from
triggering OVP. If the OVP situation still exists after the blanking
time, the power NFET is turned off. The control logic contains a
4-bit binary counter so that, if the battery overvoltage event
occurs 16 times, the power NFET is turned off permanently, as
shown in Figure 7. Recycling the input power resets the counter
and restarts the ISL9211B.
The resistor, RVB, between the VB pin and the battery, as shown
in “TYPICAL APPLICATION CIRCUIT” on page 1, is an important
component. This resistor provides a current limit in case the VB
pin is shorted to the input voltage under a failure mode. VB pin
leakage current under normal operation is negligible, which
allows a resistance of 200kΩ to 1MΩ to be used.
Overcurrent Protection (OCP)
To prevent charging the battery with excessive current, the
current in the power NFET is limited. Current is sensed using the
voltage drop across the power FET after it is turned on. The
reference for the OCP is generated using a sensing FET, Q2
(mirror to Q1), as shown in the “Block Diagram” on page 2. The
current in the sensing FET is forced to match the value
programmed by the ILIM pin. The OCP threshold can be set with
the resistor, RLIM, as shown in Table 1.
The size of the power FET, Q1, is 31,250 times the size of the
sensing FET. Therefore, when the current in the power FET is
31,250 times the current in the sensing FET, the drain voltage of
the power FET falls below that of the sensing FET. The
comparator, CP2, then outputs a signal to turn off the power FET.
When an OCP condition is encountered, the power FET is turned
off immediately and then attempts to restart. If the condition
FN7861.1
November 4, 2014
ISL9211B
TABLE 1. CURRENT LIMIT RESISTOR SETTINGS
RLIM
(kΩ)
OCP
(mA)
RLIM
(kΩ)
OCP
(mA)
82.5
300
21
1200
61.9
400
19.1
1300
49.9
500
16.5
1400
41.2
600
15.4
1500
35.7
700
14
1600
31.6
800
12.4
1700
28
900
11.3
1800
24.9
1000
10.5
1900
22.6
1100
9.53
2000
Internal Over-Temperature Protection
The ISL9211B monitors its own internal temperature to prevent
thermal failures. When the internal temperature reaches
+150°C, the IC turns off the N-channel power MOSFET. The IC
does not resume operation until the internal temperature drops
below +110°C.
Fault Indication Output
The FAULT pin is an open-drain output that indicates a LOW
signal when any of the three fault events occurs. This provides a
signal to the microprocessor to take further action to enhance
the safety of the charging system.
Applications Information
The ISL9211B is designed to meet the “Lithium-Safe” criteria
when operating together with a qualified Li-ion battery charger.
The “Lithium-Safe” criteria require the charger output to fall
within the green region shown in Figure 15 under normal
operating conditions and not to fall within the red region when
there is a single fault in the charging system. Taking into account
the safety circuit in a Li-ion battery pack, the charging system is
allowed to have two faults without creating hazardous conditions
for the battery cell. The output of a Li-ion charger such as the
ISL6292C has a typical I-V curve (shown by the blue lines in
Figure 15) under normal operation (shown by the green region).
The function of the ISL9211B is to add a redundant protection
layer such that, under any single fault condition, the charging
system output does not exceed the I-V limits (shown by the red
lines). As Figure 15 shows, a charging system that includes the
ISL9211B and the ISL6292C chip set can easily meet the
“Lithium-Safe” test criteria.
The ISL9211B is a simple device that requires only three external
components, in addition to the ISL6292 charger circuit, to meet
the “Lithium-Safe” criteria (see “TYPICAL APPLICATION CIRCUIT”
on page 1. The selection of the current limit resistor, RLIM, is
Submit Document Feedback
9
given in “Overcurrent Protection (OCP)” on page 8.
1000
ISL9211B
LIMITS
CHARGE CURRENT (mA)
persists, the FET shuts off again. This hiccup mode continues
until the OCP condition is cleared. Figures 8 and 9 show the
waveforms during power-up when the output is shorted to
ground.
ISL6292C
LIMITS
0
1
3
2
4
5
6
BATTERY VOLTAGE (V)
FIGURE 15. LITHIUM-SAFE OPERATING REGIONS
RVB Selection
RVB prevents a large current from the VB pin to the battery
terminal, in case the ISL9211B fails. The recommended value is
between 200kΩ and 1MΩ. With 200kΩ resistance, the
worst-case current flowing from the VB pin to the charger output
is shown in Equation 1, assuming VB pin voltage is 24V under
failure mode and battery voltage is 4.2V.
 24V – 4.2V    200k  = 99A
(EQ. 1)
Such a small current can easily be absorbed by the bias current
of other components in a handheld system. Increasing the RVB
value reduces the worst-case current but at the same time
increases the error for the 4.34V battery OVP threshold.
The battery OVP threshold error is the original accuracy at the VB
pin given in the “Electrical Specifications” table on page 4, plus
the voltage built across RVB by the VB pin leakage current. The
VB pin leakage current is less than 20nA, as given in the
“Electrical Specifications” table on page 4. With a 200kΩ
resistor, the worst-case additional error is 4mV; with a 1MΩ
resistor, the worst-case additional error is 20mV.
Capacitor Selection
The input capacitor (C1 in the “TYPICAL APPLICATION CIRCUIT”
on page 1) is for decoupling. A higher value reduces the voltage
drop or the over-shoot during transients.
Two scenarios can cause input voltage over-shoot. The first one is
when the AC adapter is inserted live (hot insertion). The second
one is when the current in the power NFET of the ISL9211B has a
step-down change. Figure 16 shows an equivalent circuit for the
ISL9211B input. The cable between the AC/DC converter output
and the handheld system input has a parasitic inductor. The
parasitic resistor is the sum of various components, such as the
cable, the adapter output capacitor ESR, the connector contact
resistance, and so on.
FN7861.1
November 4, 2014
ISL9211B
C1
L
R
AC/DC
ADAPTER
The recommended input decoupling capacitor is a 25V, X5R
dielectric ceramic capacitor with a value between 0.1µF and 1µF.
C2
ISL9211B
CABLE
HANDHELD SYSTEM
FIGURE 16. EQUIVALENT CIRCUIT FOR ISL9211B INPUT
During the load current step-down transient, the energy stored in
the parasitic inductor is used to charge the input decoupling
capacitor, C2. The ISL9211B is designed to turn off the power
NFET slowly during an OCP and battery OVP event. Because of
this design, the input over-shoot during these events is not
significant. During an input OVP, however, the NFET is turned in
less than 1µs and can lead to significant over-shoot. Higher
capacitance reduces the over-shoot.
The output of the ISL9211B and the input of the charging circuit
typically share one decoupling capacitor. Selection of that
capacitor is determined mainly by the requirements of the
charging circuit. When using the ISL6292 family of chargers, a
1µF, 6.3V, X5R capacitor is recommended.
Layout Recommendation
The ISL9211B uses a thermally enhanced TDFN package with an
exposed thermal pad at the bottom of the package. The layout
should include as much copper as possible beneath the exposed
pad on the component layer to improve thermal performance.
The exposed pad under the package should be connected to the
ground plane electrically as well as thermally. The vias should be
about 0.3mm to 0.33mm in diameter. Use as many vias as will fit
in the thermal pad area.
Over-shoot caused by a hot insertion is not very dependent on the
decoupling capacitance value, especially when ceramic type
capacitors are used for decoupling. In theory, over-shoot can rise
up to twice the DC output voltage of the AC adapter. Actual peak
voltage is dependent on the damping factor that is mainly
determined by parasitic resistance (R in Figure 16).
Submit Document Feedback
10
FN7861.1
November 4, 2014
ISL9211B
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make
sure you have the latest Rev.
DATE
REVISION
CHANGE
November 4, 2014
FN7861.1
Updated Note 2 for the Ordering Information on page 3.
July 8, 2011
FN7861.0
Initial release.
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products
address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks.
Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a
complete list of Intersil product families.
*For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page
on intersil.com: ISL9211B
To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff
FITs are available from our website at http://rel.intersil.com/reports/search.php
For additional products, see www.intersil.com/product_tree
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
Submit Document Feedback
11
FN7861.1
November 4, 2014
ISL9211B
Package Outline Drawing
L8.2x2B
8 LEAD MICRO THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (µTDFN) WITH E-PAD
Rev 0, 04/08
2.00
A
6
PIN #1
INDEX AREA
B
6
PIN 1
INDEX AREA
8
1
0.50
2.00
1.60±0.050
EXP. DAP
(4X)
0.15
0.10 M C A B 0.25±0.050
( 8x0.30 )
0.90±0.050
EXP. DAP
TOP VIEW
BOTTOM VIEW
SEE DETAIL "X"
( 8x0.20 )
PACKAGE
OUTLINE
0.10
C
0 . 55 MAX
( 8x0.30 )
C
BASE PLANE
SEATING PLANE
SIDE VIEW
( 6x0.50 )
1.60
C
2.00
C
( 8x0.25 )
0.08
0 . 2 REF
0.90
0 . 00 MIN.
2.00
0 . 05 MAX.
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
Submit Document Feedback
12
FN7861.1
November 4, 2014