SUP80090E Datasheet

SUP80090E
www.vishay.com
Vishay Siliconix
N-Channel 150 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
150
RDS(on) () MAX.
ID (A)
0.0094 at VGS = 10 V
128
0.0110 at VGS = 7.5 V
119
Qg (TYP.)
63 nC
• ThunderFET® power MOSFET
• Maximum 175 °C junction temperature
• 100 % Rg and UIS tested
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
TO-220AB
APPLICATIONS
D
• Power supplies:
- Uninterruptible power supplies
- AC/DC switch-mode power supplies
- Lighting
Top View
G
D
G
• Synchronous rectification
S
• DC/DC converter
• Motor drive switch
Ordering Information:
SUP80090E-GE3 (lead (Pb)-free and halogen-free)
S
• DC/AC inverter
• Solar micro inverter
N-Channel MOSFET
• Class D audio amplifier
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
Drain-Source Voltage
VDS
150
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 150 °C)
TC = 25 °C
TC = 125 °C
Pulsed Drain Current (t = 100 μs)
ID
IDM
Avalanche Current
L = 0.1 mH
Single Avalanche Energy a
TC = 25 °C
Maximum Power Dissipation a
TC = 125 °C
Operating Junction and Storage Temperature Range
V
128
74
240
IAS
60
EAS
180
PD
UNIT
375 b
125 b
A
mJ
W
TJ, Tstg
-55 to +175
°C
SYMBOL
LIMIT
UNIT
THERMAL RESISTANCE RATINGS
PARAMETER
Junction-to-Ambient (PCB Mount)
c
Junction-to-Case (Drain)
RthJA
40
RthJC
0.4
°C/W
Notes
a. Duty cycle  1 %.
b. See SOA curve for voltage derating.
c. When mounted on 1" square PCB (FR4 material).
S16-0087-Rev. A, 25-Jan-16
Document Number: 65384
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SUP80090E
www.vishay.com
Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDS
VGS = 0 V, ID = 250 μA
150
-
-
VGS(th)
VDS = VGS, ID = 250 μA
2
-
5
IGSS
VDS = 0 V, VGS = ± 20 V
-
-
± 250
VDS = 150 V, VGS = 0 V
-
-
1
VDS = 150 V, VGS = 0 V, TJ = 125 °C
-
-
100
VDS = 150 V, VGS = 0 V, TJ = 175 °C
-
-
2
mA
VDS  10 V, VGS = 10 V
90
-
-
A
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current a
Drain-Source On-State Resistance a
Forward Transconductance a
Dynamic
IDSS
ID(on)
RDS(on)
gfs
VGS = 10 V, ID = 30 A
-
0.0078
0.0094
VGS = 7.5 V, ID = 30 A
-
0.0087
0.0110
VDS = 15 V, ID = 30 A
-
52
-
-
3425
-
V
nA
μA

S
b
Input Capacitance
Ciss
Output Capacitance
Coss
-
535
-
Reverse Transfer Capacitance
Crss
-
26
-
Total Gate Charge c
Qg
-
63
95
Gate-Source Charge
c
Gate-Drain Charge c
VDS = 75 V, VGS = 10 V, ID = 60 A
-
19.5
-
-
20.5
-
f = 1 MHz
1.5
3
5
-
15
30
VDD = 75 V, RL = 1.25 
ID  60 A, VGEN = 10 V, Rg = 1 
-
114
220
-
28
56
-
8
16
Qgd
Gate Resistance
Turn-On Delay Time
Qgs
VGS = 0 V, VDS = 75 V, f = 1 MHz
Rg
c
Rise Time c
Turn-Off Delay Time c
Fall Time c
td(on)
tr
td(off)
tf
pF
nC

ns
Drain-Source Body Diode Ratings and Characteristics b (TC = 25 °C)
Pulsed Current (t = 100 μs)
ISM
Forward Voltage a
VSD
Reverse Recovery Time
Peak Reverse Recovery Charge
Reverse Recovery Charge
IF = 30 A, VGS = 0 V
trr
IRM(REC)
Qrr
IF = 30 A, di/dt = 100 A/μs
-
-
240
A
-
0.73
1.2
V
-
110
220
ns
-
10
20
A
-
0.5
1
μC
Notes
a. Pulse test; pulse width  300 μs, duty cycle  2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.


Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
S16-0087-Rev. A, 25-Jan-16
Document Number: 65384
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SUP80090E
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
Axis Title
Axis Title
250
150
10000
10000
VGS = 10 V thru 8 V
100
100
VGS = 6 V
50
1000
90
1st line
2nd line
1000
VGS = 7 V
150
2nd line
ID - Drain Current (A)
120
1st line
2nd line
60
30
TC = 125 °C
VGS = 5 V
0
2
4
6
8
10
10
0
2
Transfer Characteristics
Axis Title
1000
TC = 25 °C
45
TC = 125 °C
30
100
15
0
5.0
10.0
15.0
20.0
25.0
10000
0.010
0.008
100
0.007
VGS = 10 V
0.006
10
30.0
10
0
20
60
80
ID - Drain Current (A)
2nd line
Transconductance
On-Resistance vs. Drain Current
Axis Title
Axis Title
1st line
2nd line
1000
Ciss
Coss
100
Crss
0
10
40
60
80
100
2nd line
VGS - Gate-to-Source Voltage (V)
5600
2800
10000
ID = 60 A
8
1000
6
VDS = 50 V, 75 V, 100 V
4
100
2
0
10
0
14
28
42
56
VDS - Drain-to-Source Voltage (V)
2nd line
Qg - Total Gate Charge (nC)
2nd line
Capacitance
Gate Charge
S16-0087-Rev. A, 25-Jan-16
100
10
10000
20
40
ID - Drain Current (A)
2nd line
7000
4200
1000
VGS = 7.5 V
0.009
1st line
2nd line
TC = -55 °C
2nd line
RDS(on) - On-Resistance (Ω)
60
10
0.011
1st line
2nd line
2nd line
gfs - Transconductance (S)
8
Output Characteristics
10000
0
6
VGS - Gate-to-Source Voltage (V)
2nd line
Axis Title
1400
4
VDS - Drain-to-Source Voltage (V)
2nd line
75
0
TC = -55 °C
0
10
0
2nd line
C - Capacitance (pF)
100
TC = 25 °C
1st line
2nd line
2nd line
ID - Drain Current (A)
200
70
Document Number: 65384
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SUP80090E
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
Axis Title
Axis Title
1.0
10000
10000
ID = 30 A
0.4
1000
1.7
VGS = 7.5 V
1.3
100
2nd line
VGS(th) - Variance (V)
VGS = 10 V
0.9
1000
-0.2
ID = 5 mA
-0.8
-2.0
10
-50 -25
0
25
50
75 100 125 150 175
10
-50 -25
0
25
75 100 125 150 175
TJ - Temperature (°C)
2nd line
On-Resistance vs. Junction Temperature
Threshold Voltage
Axis Title
Axis Title
TJ = 125 °C
0.02
100
0.01
TJ = 25 °C
4
5
6
7
8
9
10
ID = 250 μA
190
1000
1st line
2nd line
1000
2nd line
VDS - Drain-to-Source Voltage (V)
0.04
0.03
10000
200
10000
1st line
2nd line
2nd line
RDS(on) - On-Resistance (Ω)
50
TJ - Junction Temperature (°C)
2nd line
0.05
180
100
170
160
10
10
-50 -25
0
25
50
75 100 125 150 175
VGS - Gate-to-Source Voltage (V)
2nd line
TJ - Temperature (°C)
2nd line
On-Resistance vs. Gate-to-Source Voltage
Drain Source Breakdown vs. Junction Temperature
Axis Title
Axis Title
100
150
10000
10
10000
TJ = 25 °C
0.1
100
0.01
1000
90
1st line
2nd line
1000
1
2nd line
ID - Drain Current (A)
120
TJ = 150 °C
1st line
2nd line
2nd line
IS - Source Current (A)
100
ID = 250 μA
-1.4
0.5
0
1st line
2nd line
2.1
1st line
2nd line
2nd line
RDS(on) - On-Resistance (Normalized)
2.5
60
100
30
0.001
10
0
0.2
0.4
0.6
0.8
1.0
1.2
0
10
0
25
50
75
100
125
VSD - Source-to-Drain Voltage (V)
2nd line
TC - Case Temperature (°C)
2nd line
Source Drain Diode Forward Voltage
Current De-Rating
S16-0087-Rev. A, 25-Jan-16
150
175
Document Number: 65384
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SUP80090E
www.vishay.com
Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
Axis Title
Axis Title
1000
10000
100
10000
100
100 μs
ID limited
25 °C
1000
10
Limited by RDS(on) (1)
10 ms
1000
150 °C
1st line
2nd line
1 ms
2nd line
IDAV (A)
1st line
2nd line
2nd line
ID - Drain Current (A)
IDM limited
100
100 ms, 1 s,
10 s, DC
1
TC = 25 °C
Single pulse
BVDSS limited
0.1
0.1
(1)
1
100
10
100
10
1000
10
0.00001
0.0001
VDS - Drain-to-Source Voltage (V)
VGS > minimum VGS at which RDS(on) is specified
10
0.01
0.001
Time (s)
2nd line
Safe Operating Area
IDAV vs. Time
Axis Title
10000
Duty Cycle = 0.5
Notes:
0.2
0.1
1000
1st line
2nd line
Normalized Effective Transient
Thermal Impedance
1
PDM
0.1
t1
0.05
t2
t
1. Duty cycle, D = t1
2
2. Per unit base = RthJA = 40 °C/W
0.02
Single pulse
3. TJM - TA = PDMZthJA
100
(t)
4. Surface mounted
0.01
0.001
0.01
0.1
1
10
100
10
1000
Square Wave Pulse Duration (s)
2nd line
Normalized Thermal Transient Impedance, Junction-to-Ambient
S16-0087-Rev. A, 25-Jan-16
Document Number: 65384
5
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SUP80090E
www.vishay.com
Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
Axis Title
10000
Duty Cycle = 0.5
0.2
1000
0.1
1st line
2nd line
Normalized Effective Transient
Thermal Impedance
1
0.05
0.1
0.02
100
Single pulse
0.01
0.0001
10
0.001
0.01
0.1
1
Square Wave Pulse Duration (s)
2nd line
Normalized Thermal Transient Impedance, Junction-to-Case
Note
• The characteristics shown in the two graphs
- Normalized Transient Thermal Impedance Junction to Ambient (25 °C)
- Normalized Transient Thermal Impedance Junction to Case (25 °C)
are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single
pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part
mounted on printed circuit board - FR4, size 1" x 1" x 0.062", double sided with 2 oz. copper, 100 % on both sides. The part capabilities
can widely vary depending on actual application parameters and operating conditions.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?65384.
S16-0087-Rev. A, 25-Jan-16
Document Number: 65384
6
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
www.vishay.com
Vishay Siliconix
TO-220AB
MILLIMETERS
A
E
F
D
H(1)
Q
ØP
3
2
L(1)
1
M*
L
b(1)
INCHES
DIM.
MIN.
MAX.
MIN.
MAX.
A
4.25
4.65
0.167
0.183
b
0.69
1.01
0.027
0.040
b(1)
1.20
1.73
0.047
0.068
c
0.36
0.61
0.014
0.024
D
14.85
15.49
0.585
0.610
D2
12.19
12.70
0.480
0.500
E
10.04
10.51
0.395
0.414
e
2.41
2.67
0.095
0.105
e(1)
4.88
5.28
0.192
0.208
F
1.14
1.40
0.045
0.055
H(1)
6.09
6.48
0.240
0.255
0.115
J(1)
2.41
2.92
0.095
L
13.35
14.02
0.526
0.552
L(1)
3.32
3.82
0.131
0.150
ØP
3.54
3.94
0.139
0.155
Q
2.60
3.00
0.102
0.118
ECN: T14-0413-Rev. P, 16-Jun-14
DWG: 5471
Note
* M = 1.32 mm to 1.62 mm (dimension including protrusion)
Heatsink hole for HVM
C
b
e
J(1)
e(1)
D2
Document Number: 71195
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Revison: 16-Jun-14
Legal Disclaimer Notice
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Vishay
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definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
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requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
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Revision: 02-Oct-12
1
Document Number: 91000