DATASHEET Radiation Hardened CMOS Dual SPDT Analog Switch HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH The HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH analog Features switches are monolithic devices fabricated using Intersil’s dielectrically isolated Radiation Hardened Silicon Gate (RSG) process technology to insure latch-up free operation. They are pinout compatible and functionally equivalent to the HS-303RH, but offer improved 300kRAD(Si) total dose capability. These switches offers low-resistance switching performance for analog voltages up to the supply rails. ON-resistance is low and stays reasonably constant over the full range of operating voltage and current. ON-resistance also stays reasonably constant when exposed to radiation. Break-before-make switching is controlled by 5V digital inputs. The HS-303ARH, HS-303AEH should be operated with nominal ±15V supplies, while the HS-303BRH, HS-303BEH should be operated with nominal ±12V supplies. • QML, per MIL-PRF-38535 Specifications • Low standby supply current . . . . . . . . . . . . . +150µA/-100µA (max, post-rad) Specifications for Rad Hard QML devices are controlled by the Defense Logistics Agency Land and Maritime (DLA). The SMD number listed in the following must be used when ordering. • Radiation performance - Total dose: 3x105 rad(Si) - SEE: For LET = 60MeV-mg/cm2 at 60° incident angle, <150pC charge transferred to the output of an off switch • No latch-up, dielectrically isolated device islands • Pinout and functionally compatible with Intersil HS-303RH and HI-303 series analog switches • Analog signal range equal to the supply voltage range • Low leakage . . . . . . . . . . . . . . . . . . . . . 100nA (max, post-rad) • Low rON . . . . . . . . . . . . . . . . . . . . . . . . . . . 70Ω (max, post-rad) Detailed Electrical Specifications for the HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH are contained in SMD 5962-95813. Functional Diagram IN N Pin Configurations HS1-303ARH, HS-303BRH (SBDIP), CDIP2-T14 TOP VIEW P D TRUTH TABLE LOGIC SW1 AND SW2 SW3 AND SW4 0 OFF ON 1 ON OFF NC 1 14 V+ S3 2 13 S4 D3 3 12 D4 D1 4 11 D2 S1 5 10 S2 IN1 6 9 IN2 GND 7 8 V- HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH (FLATPACK) CDFP3-F14 TOP VIEW NC S3 D3 D1 S1 IN1 GND March 4, 2015 FN6411.3 1 1 14 2 13 3 12 4 11 5 10 6 9 7 8 V+ S4 D4 D2 S2 IN2 V- CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2006, 2008, 2012, 2015. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH Ordering Information ORDERING NUMBER (Note 2) PART NUMBER (Note 1) TEMP. RANGE (°C) PACKAGE (RoHS Compliant) PKG. DWG. # 5962F9581304QCC HS1-303ARH-8 -55 to +125 14 LD SBDIP D14.3 5962F9581304QXC HS9-303ARH-8 -55 to +125 14 LD Flatpack K14.A 5962F9581304V9A HS0-303ARH-Q -55 to +125 Die D14.3 5962F9581306V9A HS0-303AEH-Q -55 to +125 Die D14.3 5962F9581304VCC HS1-303ARH-Q -55 to +125 14 LD SBDIP D14.3 5962F9581306VCC HS1-303AEH-Q -55 to +125 14 LD SBDIP D14.3 5962F9581304VXC HS9-303ARH-Q -55 to +125 14 LD Flatpack K14.A HS0-303ARH/SAMPLE HS0-303ARH/SAMPLE -55 to +125 Die HS1-303ARH/PROTO HS1-303ARH/PROTO -55 to +125 14 LD SBDIP D14.3 HS9-303ARH/PROTO HS9-303ARH/PROTO -55 to +125 14 LD Flatpack K14.A 5962F9581306VXC HS9-303AEH-Q -55 to +125 14 LD Flatpack K14.A 5962F9581305QCC HS1-303BRH-8 -55 to +125 14 LD SBDIP D14.3 5962F9581305QXC HS9-303BRH-8 -55 to +125 14 LD Flatpack K14.A 5962F9581305V9A HS0-303BRH-Q -55 to +125 Die D14.3 5962F9581307V9A HS0-303BEH-Q -55 to +125 Die D14.3 5962F9581305VCC HS1-303BRH-Q -55 to +125 14 LD SBDIP D14.3 5962F9581307VCC HS1-303BEH-Q -55 to +125 14 LD SBDIP D14.3 5962F9581305VXC HS9-303BRH-Q -55 to +125 14 LD Flatpack K14.A HS0-303BRH/SAMPLE HS0-303BRH/SAMPLE -55 to +125 Die HS1-303BRH/PROTO HS1-303BRH/PROTO -55 to +125 14 LD SBDIP D14.3 HS9-303BRH/PROTO HS9-303BRH/PROTO -55 to +125 14 LD Flatpack K14.A 5962F9581307VXC HS9-303BEH-Q -55 to +125 14 LD Flatpack K14.A NOTES: 1. These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. 2. Specifications for Rad Hard QML devices are controlled by the Defense Logistics Agency Land and Maritime (DLA). The SMD numbers listed in the “Ordering Information” table must be used when ordering. Submit Document Feedback 2 FN6411.3 March 4, 2015 HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH Die Characteristics Substrate: Radiation Hardened Silicon Gate, Dielectric Isolation DIE DIMENSIONS: 2690µm x 5200µm (106mils x 205mils) Thickness: 483µm ± 25.4µm (19mils ± 1mil) Backside Finish: Silicon INTERFACE MATERIALS: ASSEMBLY RELATED INFORMATION: Glassivation: Substrate Potential: Type: PSG (Phosphorous Silicon Glass) Thickness: 8.0kÅ ± 1.0kÅ Unbiased (DI) ADDITIONAL INFORMATION: Top Metallization: Type: AlSiCu Thickness: 16.0kÅ ± 2kÅ Worst Case Current Density: <2.0 x 105 A/cm2 Transistor Count: 332 Metallization Mask Layout IN2 S2 D2 D4 S4 HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH VV+ IN1 S1 D1 D3 S3 GND For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com Submit Document Feedback 3 FN6411.3 March 4, 2015 HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH Ceramic Dual-In-Line Metal Seal Packages (SBDIP) D14.3 MIL-STD-1835 CDIP2-T14 (D-1, CONFIGURATION C) 14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE LEAD FINISH c1 -A- -DBASE METAL E b1 M (b) M -Bbbb S C A - B S (c) SECTION A-A D S D BASE PLANE Q S2 -C- SEATING PLANE A L S1 eA A A b2 b e eA/2 c aaa M C A - B S D S ccc M C A - B S D S NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. 2. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. 4. Corner leads (1, N, N/2, and N/2+1) may be configured with a partial lead paddle. For this configuration dimension b3 replaces dimension b2. 5. Dimension Q shall be measured from the seating plane to the base plane. INCHES SYMBOL MIN MILLIMETERS MAX MIN MAX NOTES A - 0.200 - 5.08 - b 0.014 0.026 0.36 0.66 2 b1 0.014 0.023 0.36 0.58 3 b2 0.045 0.065 1.14 1.65 - b3 0.023 0.045 0.58 1.14 4 c 0.008 0.018 0.20 0.46 2 c1 0.008 0.015 0.20 0.38 3 D - 0.785 - 19.94 - E 0.220 0.310 5.59 7.87 - e 0.100 BSC 2.54 BSC - eA 0.300 BSC 7.62 BSC - eA/2 0.150 BSC 3.81 BSC - L 0.125 0.200 3.18 5.08 - Q 0.015 0.060 0.38 1.52 5 S1 0.005 - 0.13 - 6 S2 0.005 - 0.13 - 7 90o 105o 90o 105o - aaa - 0.015 - 0.38 - bbb - 0.030 - 0.76 - ccc - 0.010 - 0.25 - M - 0.0015 - 0.038 2 N 14 14 8 Rev. 0 4/94 6. Measure dimension S1 at all four corners. 7. Measure dimension S2 from the top of the ceramic body to the nearest metallization or lead. 8. N is the maximum number of terminal positions. 9. Braze fillets shall be concave. 10. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 11. Controlling dimension: INCH. Submit Document Feedback 4 FN6411.3 March 4, 2015 HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH Ceramic Metal Seal Flatpack Packages (Flatpack) K14.A MIL-STD-1835 CDFP3-F14 (F-2A, CONFIGURATION B) A e 14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A INCHES PIN NO. 1 ID AREA SYMBOL -A- D -B- S1 b E1 0.004 M H A-B S Q D S 0.036 M H A-B S D S C E -D- A -C- -HL E2 E3 SEATING AND BASE PLANE c1 L E3 BASE METAL (c) b1 M M (b) SECTION A-A MILLIMETERS MAX MIN MAX NOTES A 0.045 0.115 1.14 2.92 - b 0.015 0.022 0.38 0.56 - b1 0.015 0.019 0.38 0.48 - c 0.004 0.009 0.10 0.23 - c1 0.004 0.006 0.10 0.15 - D - 0.390 - 9.91 3 E 0.235 0.260 5.97 6.60 - E1 - 0.290 - 7.11 3 E2 0.125 - 3.18 - - E3 0.030 - 0.76 - 7 2 e LEAD FINISH MIN 0.050 BSC 1.27 BSC - k 0.008 0.015 0.20 0.38 L 0.270 0.370 6.86 9.40 - Q 0.026 0.045 0.66 1.14 8 S1 0.005 - 0.13 - 6 M - 0.0015 - 0.04 - N 14 14 Rev. 0 5/18/94 NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. Alternately, a tab (dimension k) may be used to identify pin one. 2. If a pin one identification mark is used in addition to a tab, the limits of dimension k do not apply. 3. This dimension allows for off-center lid, meniscus, and glass overrun. 4. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 5. N is the maximum number of terminal positions. 6. Measure dimension S1 at all four corners. 7. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 8. Dimension Q shall be measured at the point of exit (beyond the meniscus) of the lead from the body. Dimension Q minimum shall be reduced by 0.0015 inch (0.038mm) maximum when solder dip lead finish is applied. 9. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 10. Controlling dimension: INCH. Submit Document Feedback 5 FN6411.3 March 4, 2015