DATASHEET

DATASHEET
Radiation Hardened CMOS Dual SPDT Analog Switch
HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH
The HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH analog
Features
switches are monolithic devices fabricated using Intersil’s
dielectrically isolated Radiation Hardened Silicon Gate (RSG)
process technology to insure latch-up free operation. They are
pinout compatible and functionally equivalent to the
HS-303RH, but offer improved 300kRAD(Si) total dose
capability. These switches offers low-resistance switching
performance for analog voltages up to the supply rails.
ON-resistance is low and stays reasonably constant over the
full range of operating voltage and current. ON-resistance also
stays reasonably constant when exposed to radiation.
Break-before-make switching is controlled by 5V digital inputs.
The HS-303ARH, HS-303AEH should be operated with nominal
±15V supplies, while the HS-303BRH, HS-303BEH should be
operated with nominal ±12V supplies.
• QML, per MIL-PRF-38535
Specifications
• Low standby supply current . . . . . . . . . . . . . +150µA/-100µA
(max, post-rad)
Specifications for Rad Hard QML devices are controlled by the
Defense Logistics Agency Land and Maritime (DLA). The SMD
number listed in the following must be used when ordering.
• Radiation performance
- Total dose: 3x105 rad(Si)
- SEE: For LET = 60MeV-mg/cm2 at 60° incident angle,
<150pC charge transferred to the output of an off switch
• No latch-up, dielectrically isolated device islands
• Pinout and functionally compatible with Intersil HS-303RH
and HI-303 series analog switches
• Analog signal range equal to the supply voltage range
• Low leakage . . . . . . . . . . . . . . . . . . . . . 100nA (max, post-rad)
• Low rON . . . . . . . . . . . . . . . . . . . . . . . . . . . 70Ω (max, post-rad)
Detailed Electrical Specifications for the HS-303ARH,
HS-303AEH, HS-303BRH, HS-303BEH are contained in
SMD 5962-95813.
Functional Diagram
IN
N
Pin Configurations
HS1-303ARH, HS-303BRH
(SBDIP), CDIP2-T14
TOP VIEW
P
D
TRUTH TABLE
LOGIC
SW1 AND SW2
SW3 AND SW4
0
OFF
ON
1
ON
OFF
NC
1
14 V+
S3
2
13 S4
D3
3
12 D4
D1
4
11 D2
S1
5
10 S2
IN1
6
9 IN2
GND
7
8 V-
HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH
(FLATPACK) CDFP3-F14
TOP VIEW
NC
S3
D3
D1
S1
IN1
GND
March 4, 2015
FN6411.3
1
1
14
2
13
3
12
4
11
5
10
6
9
7
8
V+
S4
D4
D2
S2
IN2
V-
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2006, 2008, 2012, 2015. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH
Ordering Information
ORDERING NUMBER
(Note 2)
PART NUMBER
(Note 1)
TEMP. RANGE
(°C)
PACKAGE
(RoHS Compliant)
PKG.
DWG. #
5962F9581304QCC
HS1-303ARH-8
-55 to +125
14 LD SBDIP
D14.3
5962F9581304QXC
HS9-303ARH-8
-55 to +125
14 LD Flatpack
K14.A
5962F9581304V9A
HS0-303ARH-Q
-55 to +125
Die
D14.3
5962F9581306V9A
HS0-303AEH-Q
-55 to +125
Die
D14.3
5962F9581304VCC
HS1-303ARH-Q
-55 to +125
14 LD SBDIP
D14.3
5962F9581306VCC
HS1-303AEH-Q
-55 to +125
14 LD SBDIP
D14.3
5962F9581304VXC
HS9-303ARH-Q
-55 to +125
14 LD Flatpack
K14.A
HS0-303ARH/SAMPLE
HS0-303ARH/SAMPLE
-55 to +125
Die
HS1-303ARH/PROTO
HS1-303ARH/PROTO
-55 to +125
14 LD SBDIP
D14.3
HS9-303ARH/PROTO
HS9-303ARH/PROTO
-55 to +125
14 LD Flatpack
K14.A
5962F9581306VXC
HS9-303AEH-Q
-55 to +125
14 LD Flatpack
K14.A
5962F9581305QCC
HS1-303BRH-8
-55 to +125
14 LD SBDIP
D14.3
5962F9581305QXC
HS9-303BRH-8
-55 to +125
14 LD Flatpack
K14.A
5962F9581305V9A
HS0-303BRH-Q
-55 to +125
Die
D14.3
5962F9581307V9A
HS0-303BEH-Q
-55 to +125
Die
D14.3
5962F9581305VCC
HS1-303BRH-Q
-55 to +125
14 LD SBDIP
D14.3
5962F9581307VCC
HS1-303BEH-Q
-55 to +125
14 LD SBDIP
D14.3
5962F9581305VXC
HS9-303BRH-Q
-55 to +125
14 LD Flatpack
K14.A
HS0-303BRH/SAMPLE
HS0-303BRH/SAMPLE
-55 to +125
Die
HS1-303BRH/PROTO
HS1-303BRH/PROTO
-55 to +125
14 LD SBDIP
D14.3
HS9-303BRH/PROTO
HS9-303BRH/PROTO
-55 to +125
14 LD Flatpack
K14.A
5962F9581307VXC
HS9-303BEH-Q
-55 to +125
14 LD Flatpack
K14.A
NOTES:
1. These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both
SnPb and Pb-free soldering operations.
2. Specifications for Rad Hard QML devices are controlled by the Defense Logistics Agency Land and Maritime (DLA). The SMD numbers listed in the
“Ordering Information” table must be used when ordering.
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HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH
Die Characteristics
Substrate:
Radiation Hardened Silicon Gate,
Dielectric Isolation
DIE DIMENSIONS:
2690µm x 5200µm (106mils x 205mils)
Thickness: 483µm ± 25.4µm (19mils ± 1mil)
Backside Finish:
Silicon
INTERFACE MATERIALS:
ASSEMBLY RELATED INFORMATION:
Glassivation:
Substrate Potential:
Type: PSG (Phosphorous Silicon Glass)
Thickness: 8.0kÅ ± 1.0kÅ
Unbiased (DI)
ADDITIONAL INFORMATION:
Top Metallization:
Type: AlSiCu
Thickness: 16.0kÅ ± 2kÅ
Worst Case Current Density:
<2.0 x 105 A/cm2
Transistor Count:
332
Metallization Mask Layout
IN2
S2
D2
D4
S4
HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH
VV+
IN1
S1
D1
D3
S3
GND
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
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HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH
Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
D14.3 MIL-STD-1835 CDIP2-T14 (D-1, CONFIGURATION C)
14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE
LEAD FINISH
c1
-A-
-DBASE
METAL
E
b1
M
(b)
M
-Bbbb S C A - B S
(c)
SECTION A-A
D S
D
BASE
PLANE
Q
S2
-C-
SEATING
PLANE
A
L
S1
eA
A A
b2
b
e
eA/2
c
aaa M C A - B S D S
ccc M C A - B S D S
NOTES:
1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark.
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness.
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
5. Dimension Q shall be measured from the seating plane to the
base plane.
INCHES
SYMBOL
MIN
MILLIMETERS
MAX
MIN
MAX
NOTES
A
-
0.200
-
5.08
-
b
0.014
0.026
0.36
0.66
2
b1
0.014
0.023
0.36
0.58
3
b2
0.045
0.065
1.14
1.65
-
b3
0.023
0.045
0.58
1.14
4
c
0.008
0.018
0.20
0.46
2
c1
0.008
0.015
0.20
0.38
3
D
-
0.785
-
19.94
-
E
0.220
0.310
5.59
7.87
-
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
-
eA/2
0.150 BSC
3.81 BSC
-
L
0.125
0.200
3.18
5.08
-
Q
0.015
0.060
0.38
1.52
5
S1
0.005
-
0.13
-
6
S2
0.005
-
0.13
-
7

90o
105o
90o
105o
-
aaa
-
0.015
-
0.38
-
bbb
-
0.030
-
0.76
-
ccc
-
0.010
-
0.25
-
M
-
0.0015
-
0.038
2
N
14
14
8
Rev. 0 4/94
6. Measure dimension S1 at all four corners.
7. Measure dimension S2 from the top of the ceramic body to the
nearest metallization or lead.
8. N is the maximum number of terminal positions.
9. Braze fillets shall be concave.
10. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
11. Controlling dimension: INCH.
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HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH
Ceramic Metal Seal Flatpack Packages (Flatpack)
K14.A MIL-STD-1835 CDFP3-F14 (F-2A, CONFIGURATION B)
A
e
14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE
A
INCHES
PIN NO. 1
ID AREA
SYMBOL
-A-
D
-B-
S1
b
E1
0.004 M
H A-B S
Q
D S
0.036 M
H A-B S
D S
C
E
-D-
A
-C-
-HL
E2
E3
SEATING AND
BASE PLANE
c1
L
E3
BASE
METAL
(c)
b1
M
M
(b)
SECTION A-A
MILLIMETERS
MAX
MIN
MAX
NOTES
A
0.045
0.115
1.14
2.92
-
b
0.015
0.022
0.38
0.56
-
b1
0.015
0.019
0.38
0.48
-
c
0.004
0.009
0.10
0.23
-
c1
0.004
0.006
0.10
0.15
-
D
-
0.390
-
9.91
3
E
0.235
0.260
5.97
6.60
-
E1
-
0.290
-
7.11
3
E2
0.125
-
3.18
-
-
E3
0.030
-
0.76
-
7
2
e
LEAD FINISH
MIN
0.050 BSC
1.27 BSC
-
k
0.008
0.015
0.20
0.38
L
0.270
0.370
6.86
9.40
-
Q
0.026
0.045
0.66
1.14
8
S1
0.005
-
0.13
-
6
M
-
0.0015
-
0.04
-
N
14
14
Rev. 0 5/18/94
NOTES:
1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark. Alternately, a tab (dimension k)
may be used to identify pin one.
2. If a pin one identification mark is used in addition to a tab, the limits of dimension k do not apply.
3. This dimension allows for off-center lid, meniscus, and glass
overrun.
4. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate
lead finish is applied.
5. N is the maximum number of terminal positions.
6. Measure dimension S1 at all four corners.
7. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the
leads.
8. Dimension Q shall be measured at the point of exit (beyond the
meniscus) of the lead from the body. Dimension Q minimum
shall be reduced by 0.0015 inch (0.038mm) maximum when solder dip lead finish is applied.
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
10. Controlling dimension: INCH.
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March 4, 2015
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