DATASHEET

DATASHEET
Radiation Hardened High Frequency Half Bridge
Drivers
IS-2100ARH, IS-2100AEH
Features
The radiation hardened IS-2100ARH, IS-2100AEH are high
frequency, 130V half bridge N-Channel MOSFET driver ICs,
which are functionally similar to industry standard 2110 types.
The low-side and high-side gate drivers are independently
controlled. This gives the user maximum flexibility in dead
time selection and driver protocol.
• Electrically screened to DLA SMD # 5962-99536
In addition, the devices have on-chip error detection and
correction circuitry, which monitors the state of the high-side
latch and compares it to the HIN signal. If they disagree, a set
or reset pulse is generated to correct the high-side latch. This
feature protects the high-side latch from single event upsets
(SEUs).
Applications
• QML qualified per MIL-PRF-38535 requirements
• Radiation environment
- Maximum total dose . . . . . . . . . . . . . . . . . . . . . 300krad(Si)
- DI RSG process provides latch-up immunity
- SEU rating . . . . . . . . . . . . . . . . . . . . . . . . . . 82MeV/mg/cm2
- Vertical device architecture reduces sensitivity to low dose
rates
• Bootstrap supply maximum voltage to 150V
• Drives 1000pF load at 1MHz with rise and fall times of 30ns
(typical)
• 1.5A (typical) peak output current
• High frequency switch-mode power supplies
• Independent inputs for non-half bridge topologies
• Drivers for inductive loads
• Low DC power consumption . . . . . . . . . . . . . . 60mW (typical)
• DC motor drivers
• Operates with VDD = VCC over 12V to 20V range
Pin Configuration
• Low-side supply undervoltage protection
IS-2100ARH, IS-2100AEH
FLATPACK (CDFP4-F16)
TOP VIEW
LO
1
16
NC
COM
2
15
VSS
VCC
3
14
LIN
NC
4
13
SD
NC
5
12
HIN
VS
6
11
VDD
VB
7
10
NC
HO
8
9
NC
May 10, 2016
FN9037.3
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
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IS-2100ARH, IS-2100AEH
Ordering Information
ORDERING SMD NUMBER
(Note 2)
PART NUMBER
(Note 1)
TEMP RANGE
(°C)
PACKAGE
(RoHS Compliant)
PKG.
DWG. #
5962F9953602V9A
IS0-2100ARH-Q
-55 to +125
Die
5962F9953602VXC
IS9-2100ARH-Q
-55 to +125
16 Ld Flatpack
K16.A
5962F9953602QXC
IS9-2100ARH-8
-55 to +125
16 Ld Flatpack
K16.A
N/A
IS9-2100ARH/Proto
-55 to +125
16 Ld Flatpack
K16.A
5962F9953603VXC
IS9-2100AEH-Q
-55 to +125
16 Ld Flatpack
K16.A
5962F9953603V9A
IS0-2100AEH-Q
-55 to +125
Die
NOTES:
1. These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both
SnPb and Pb-free soldering operations.
2. Specifications for Rad Hard QML devices are controlled by the Defense Logistics Agency Land and Maritime (DLA). The SMD numbers listed in the
“Ordering Information” table must be used when ordering.
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IS-2100ARH, IS-2100AEH
Die Characteristics
DIE DIMENSIONS:
Backside Finish:
4820µm x 3300µm (190 mils x 130 mils)
Thickness: 483µm 25.4µm (19 mils 1 mil)
INTERFACE MATERIALS:
Silicon
ASSEMBLY RELATED INFORMATION:
Substrate Potential:
Glassivation:
Unbiased (DI)
Type: PSG (Phosphorous Silicon Glass)
Thickness: 8.0kÅ 1.0kÅ
ADDITIONAL INFORMATION:
Worst Case Current Density:
Top Metallization:
<2.0 x 105 A/cm2
Type: ALSiCu
Thickness: 16.0kÅ 2kÅ
Transistor Count:
542
Substrate:
Radiation Hardened Silicon Gate,
Dielectric Isolation
Metallization Mask Layout
IS-2100ARH, IS-2100AEH
SD (13)
HIN (12)
LIN (14)
VSS (15)
VDD (11)
LO (1)
HO (8)
COM (2)
VB (7)
VCC (3)
VS (6)
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IS-2100ARH, IS-2100AEH
TABLE 1. IS-2100ARH, ISL-2100AEH DIE LAYOUT X-Y COORDINATES
PAD CENTER
PAD SIZE
PAD NUMBER
PAD NAME
X
(µm)
Y
(µm)
DX
(µm)
DY
(µm)
3
VCC
296.5
270
109
280
6
VS
4561
284.5
109
280
7
VB
4561
711
109
280
8
HO
4561
1079
109
280
11
VDD
4645.5
1500
109
109
12
HIN
4627.5
2817
109
109
13
SD
302
3064.5
109
109
14
LIN
237.5
2040
109
109
15
VSS
239
1719
109
109
1
LO
296.5
1095
109
280
2
COM
296.5
697
109
280
NOTE: Origin of coordinates is the lower left corner of the die.
3500
3000
2500
2000
1500
1000
500
0
0
1000
2000
3000
4000
5000
FIGURE 1. XY PAD CENTER
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IS-2100ARH, IS-2100AEH
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted.
Please go to the web to make sure that you have the latest revision.
DATE
REVISION
May 10, 2016
FN9037.3
CHANGE
Updated Ordering information table by applying new standards and adding Notes 1 and 2.
Added Table 1 on page 4.
Added Package Outline Drawing K16.A.
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IS-2100ARH, IS-2100AEH
Package Outline Drawing
K16.A
16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE
Rev 2, 1/10
0.015 (0.38)
0.008 (0.20)
PIN NO. 1
ID OPTIONAL
1
2
0.050 (1.27 BSC)
PIN NO. 1
ID AREA
TOP VIEW
0.022 (0.56)
0.015 (0.38)
0.115 (2.92)
0.045 (1.14)
0.440 (11.18)
MAX
0.005 (0.13)
MIN
4
0.045 (1.14)
0.026 (0.66)
-C-
6
0.285 (7.24)
0.245 (6.22)
0.13 (3.30)
MIN
SEATING AND
BASE PLANE
0.009 (0.23)
0.004 (0.10)
-D-
0.370 (9.40)
0.250 (6.35)
-H-
0.03 (0.76) MIN
LEAD FINISH
SIDE VIEW
NOTES:
0.006 (0.15)
0.004 (0.10)
1. Index area: A notch or a pin one identification mark shall be located
adjacent to pin one and shall be located within the shaded area shown.
The manufacturer’s identification shall not be used as a pin one
identification mark. Alternately, a tab may be used to identify pin one.
LEAD FINISH
0.009 (0.23)
BASE
METAL
0.004 (0.10)
0.019 (0.48)
0.015 (0.38)
3. The maximum limits of lead dimensions (section A-A) shall be
measured at the centroid of the finished lead surfaces, when solder
dip or tin plate lead finish is applied.
4. Measure dimension at all four corners.
0.0015 (0.04)
MAX
5. For bottom-brazed lead packages, no organic or polymeric materials
shall be molded to the bottom of the package to cover the leads.
0.022 (0.56)
0.015 (0.38)
3
SECTION A-A
2. If a pin one identification mark is used in addition to a tab, the limits
of the tab dimension do not apply.
6. Dimension shall be measured at the point of exit (beyond the
meniscus) of the lead from the body. Dimension minimum shall
be reduced by 0.0015 inch (0.038mm) maximum when solder dip
lead finish is applied.
7. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
8. Controlling dimension: INCH.
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