EW DESIGNS ENDED FOR N NOT RECOMM T PARTS REPLACEMEN RECOMMENDED DG406, DG407 Data Sheet HI-516 April 1, 2005 16-Channel/Differential 8-Channel, CMOS High Speed Analog Multiplexer The Hl-516 is a monolithic, dielectrically isolated, highspeed, high-performance CMOS analog multiplexer. It offers unique built-in channel selection decoding plus an inhibit input for disabling all channels. The dual function of address input A3 enables the Hl-516 to be user programmed either as a single ended 16-Channel multiplexer by connecting ‘out A’ to ‘out B’ and using A3 as a digital address input, or as an 8-Channel differential multiplexer by connecting A3 to the V- supply. The substrate leakages and parasitic capacitances are reduced substantially by using the Intersil Dielectric Isolation process to achieve optimum performance in both high and low level signal applications. The low output leakage current (lD(OFF) < 100pA at 25oC) and fast settling (tSETTLE = 800ns to 0.01%) characteristics of the device make it an ideal choice for high speed data acquisition systems, precision instrumentation, and industrial process control. Features • Access Time (Typical) . . . . . . . . . . . . . . . . . . . . . . . 130ns • Settling Time . . . . . . . . . . . . . . . . . . . . . . . . 250ns (0.1%) • Low Leakage (Typical) - IS(OFF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10pA - ID(OFF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30pA • Low Capacitance (Max) - CS(OFF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10pF - CD(OFF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25pF • Off Isolation at 500kHz . . . . . . . . . . . . . . . . . . 55dB (Min) • Low Charge Injection Error . . . . . . . . . . . . . . . . . . . 20mV • Single Ended to Differential Selectable (SDS) • Logic Level Selectable (LLS) • Pb-Free Available (RoHS Compliant) Applications For MIL-STD-883 compliant parts, request the Hl-516/883 data sheet. • Data Acquisition Systems Ordering Information • Industrial Control PART NUMBER TEMP. RANGE (oC) PACKAGE PKG. DWG. # HI3-0516-5 0 to 75 28 Ld PDIP E28.6 HI3-0516-5Z (See Note) 0 to 75 28 Ld PDIP* (Pb-free) E28.6 *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. • Precision Instrumentation Pinout HI-516 (PDIP) TOP VIEW V+ 1 OUT B 2 28 OUT A 27 V- NC 3 26 IN 8/8A IN 16/8B 4 25 IN 7/7A IN 15/7B 5 24 IN 6/6A IN 14/6B 6 23 IN 5/5A IN 13/5B 7 22 IN 4/4A IN 12/4B 8 21 IN 3/3A 9 20 IN 2/2A IN 10/2B 10 19 IN 1/1A IN 11/3B IN 9/1B 11 1 FN3146.4 18 ENABLE GND 12 17 A0 VDD /LLS 13 16 A1 A3 /SDS 14 15 A2 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-352-6832 | Intersil (and design) is a registered trademark of Intersil Americas LLC. Copyright Intersil Americas LLC. 2000, 2005. All Rights Reserved All other trademarks mentioned are the property of their respective owners. HI-516 Truth Tables HI-516 USED AS A 16-CHANNEL MULTIPLEXER OR DUAL 8-CHANNEL MULTIPLEXER (NOTE 1) USE A3 AS DIGITAL ADDRESS INPUT ENABLE A2 A3 A1 A0 HI-516 USED AS A DIFFERENTIAL 8-CHANNEL MULTIPLEXER ON CHANNEL TO OUT A OUT B A3 CONNECTED TO V- SUPPLY ON CHANNEL TO ENABLE A2 A1 A0 OUT A OUT B L X X X X None None L X X X None None H L L L L 1A None H L L L 1A 1B H L L L H 2A None H L L H 2A 2B H L L H L 3A None H L H L 3A 3B H L L H H 4A None H L H H 4A 4B H L H L L 5A None H H L L 5A 5B H L H L H 6A None H H L H 6A 6B H L H H L 7A None H H H L 7A 7B H L H H H 8A None H H H H 8A 8B H H L L L None 1B H H L L H None 2B H H L H L None 3B H H L H H None 4B H H H L L None 5B H H H L H None 6B H H H H L None 7B H H H H H None 8B NOTE: 1. For 16-channel single-ended function, tie ‘out A’ to ‘out B’; for dual 8-channel function use the A3 address pin to select between MUX A and MUX B, where MUX A is selected with A3 low. 2 HI-516 Functional Block Diagram VDD /LLS IN 1A N P EN OUT A A0 DECODER A1 IN 8A A2 N A3 P Q A3 DECODER IN 1B Q N P OUT B DECODER IN 8B N INPUT BUFFER AND DECODERS MULTIPLEXER SWITCHES A3 DECODE 3 P A3 Q Q H H L L L H V- L L HI-516 Absolute Maximum Ratings Thermal Information V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33V Analog Signal. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (VIN , VOUT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (V-) -2V to (V+) +2V Digital Input Voltage: TTL Levels Selected (VDD /LLS Pin = GND or Open) VA0-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -6V to +6V VA3/SDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (V-) -2V to (V+) +2V CMOS Levels Selected (VDD /LLS Pin = VDD) VA0-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2V to (V+) +2V Thermal Resistance (Typical, Note 2) JA (oC/W) PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Maximum Junction Temperature Plastic Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. Operating Conditions Temperature Ranges HI-516-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 75oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 2. JA is measured with the component mounted on an evaluation PC board in free air. Electrical Specifications Supplies = +15V, -15V; VAH (Logic Level High) = 2.4V, VAL (Logic Level Low) = 0.8V; VDD /LLS = GND. (Note 3) Unless Otherwise Specified TEST CONDITIONS -5 TEMP (oC) MIN TYP MAX UNITS 25 - 130 175 ns Full - - 225 ns Break-Before-Make Delay, tOPEN 25 10 20 - ns Enable Delay (ON), tON(EN) 25 - 120 175 ns Enable Delay (OFF), tOFF(EN) 25 - 140 175 ns To 0.1% 25 - 250 - ns To 0.01% 25 - 800 - ns Charge Injection Error Note 6 25 - - 20 mV Off Isolation Note 7 25 55 - - dB Channel Input Capacitance, CS(OFF) 25 - - 10 pF Channel Output Capacitance, CD(OFF) 25 - - 25 pF Digital Input Capacitance, CA 25 - - 10 pF Input to Output Capacitance, CDS(OFF) 25 - 0.02 - pF PARAMETER DYNAMIC CHARACTERISTICS Access Time, tA Settling Time DIGITAL INPUT CHARACTERISTICS Input Low Threshold, VAL (TTL) Note 3 Full - - 0.8 V Input High Threshold, VAH (TTL) Note 3 Full 2.4 - - V Input Low Threshold, VAL (CMOS) Note 3 Full - - 0.3VDD V Input High Threshold, VAH (CMOS) Note 3 Full 0.7VDD - - V Full - - 1 A Input Leakage Current, IAH (High) 4 HI-516 Electrical Specifications Supplies = +15V, -15V; VAH (Logic Level High) = 2.4V, VAL (Logic Level Low) = 0.8V; VDD /LLS = GND. (Note 3) Unless Otherwise Specified (Continued) TEST CONDITIONS PARAMETER Input Leakage Current, IAL (Low) -5 TEMP (oC) MIN TYP MAX UNITS Full - - 25 A ANALOG CHANNEL CHARACTERISTICS Analog Signal Range, VIN Note 4 Full -15 - +15 V On Resistance, rON Note 5 25 - 620 750 Full - - 1,000 25 - 0.01 - nA Full - - 50 nA 25 - 0.03 - nA Full - - 100 nA 25 - 0.04 - nA Full - - 900 mW Full - - 30 mA Full - - 30 mA Off Input Leakage Current, lS(OFF) Off Output Leakage Current, ID(OFF) On Channel Leakage Current, ID(ON) POWER SUPPLY CHARACTERISTICS Power Dissipation, PD I+, Current VEN = 2.4V I-, Current NOTES: 3. VDD /LLS pin = open or grounded for TTL compatibility. VDD /LLS pin = VDD for CMOS compatibility. 4. At temperatures above 90oC, care must be taken to assure VIN remains at least 1V below the VSUPPLY for proper operation. 5. VIN = 10V, IOUT = -100A. 6. VIN = 0V, CL = 100pF, enable input pulse = 3V, f = 500kHz. 7. VEN = 0.8V, VIN = 3VRMS , f = 500kHz, CL = 40pF, RL = 1K, Pin 3 grounded. 5 HI-516 Test Circuits and Waveforms VDD /LLS = GND, Unless Otherwise Specified. IOUT 100A 0.8V EN V2 OUT A ID(OFF) IN OUT rON = VIN 10V V2 10V 10V 100A FIGURE 1. ON RESISTANCE TEST CIRCUIT FIGURE 2. ID(OFF) TEST CIRCUIT (NOTE 8) OUT OUT IS(OFF) A A ID(ON) EN EN 0.8V 10V 10V 10V 10V 2.4V FIGURE 3. IS(OFF) TEST CIRCUIT (NOTE 8) FIGURE 4. ID(ON) TEST CIRCUIT (NOTE 8) +15V ADDRESS DRIVE (VA) V+ 50% A3/SDS 0V VA +10V 50 OUTPUT 10% 2.4V -10V IN 1 A2 IN 2-15 A1 IN 16 A0 OUT A EN OUT B VDD/LLS tA 10V 3.5V V- GND -15V FIGURE 5A. MEASUREMENT POINTS FIGURE 5B. TEST CIRCUIT NOTE: 8. Two measurements per channel: 10V and 10V. (Two measurements per device for ID(OFF) 10V and 10V). FIGURE 6. ACCESS TIME 6 10V 10 k 50 pF HI-516 Test Circuits and Waveforms VDD /LLS = GND, Unless Otherwise Specified. (Continued) +15V 3.5V V+ A3 IN 2-15 ADDRESS DRIVE (VA) 0V VA A1 50 50% 50% IN 16 A0 OUTPUT S1 ON +5V IN 1 A2 EN VDD /LLS 2.4V S16 ON OUTA OUTB VOUT 800 V- 12.5pF GND tOPEN -15V FIGURE 7A. MEASUREMENT POINTS FIGURE 7B. TEST CIRCUIT FIGURE 7. BREAK-BEFORE-MAKE DELAY +15V 3.5V ENABLE DRIVE (VA) 50% 50% V+ A3 +10V IN 1 A2 0V 10% IN 2-16 A1 OUTPUT 90% A0 0V tON(EN) VA tOFF(EN) EN VDD /LLS 50 OUTA VOUT 800 V- GND 12.5pF -15V FIGURE 8A. MEASUREMENT POINTS FIGURE 8B. TEST CIRCUIT FIGURE 8. ENABLE DELAYS +15V 2.4V V+ A0 , A1 , A 2 , A3 /SDS 3.0V 0V VA OUT VO VOUT IN A OR B VOUT CL = 100pF EN VA GND VDD/LLS V- -15V FIGURE 9A. MEASUREMENT POINTS FIGURE 9B. TEST CIRCUIT VO is the measured voltage error due to charge injection. The error in coulombs is Q = CL x VO . FIGURE 9. CHARGE INJECTION 7 HI-516 Die Characteristics DIE DIMENSIONS: PASSIVATION: 2250m x 3720m x 485m Type: Nitride Over Silox Nitride Thickness: 3.5kÅ 1kÅ Silox Thickness: 12kÅ 2kÅ METALLIZATION: Type: CuAl Thickness: 16kÅ 2kÅ WORST CASE CURRENT DENSITY: 1.64 x 105 A/cm2 Metallization Mask Layout HI-516 ENABLE A0 A1 A2 A3 /SDS (17) (16) (15) (14) (18) VDD /LLS GND (13) (12) IN 1/1A (19) (10) IN 9/1B IN 2/2A (20) (9) IN 10/2B IN 3/3A (21) (8) IN 11/3B IN 4/4A (22) (7) IN 12/4B IN 5/5A (23) (6) IN 13/5B IN 6/6A (24) (5) IN 14/6B IN 7/7A (25) (4) IN 15/7B IN 8/8A (26) (3) IN 16/8B (27) (28) -V OUT A (1) +V (2) OUT B All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9001 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 8