Data Sheet

IP4233CZ6
Ultra low capacitance ESD protection for Ethernet ports
Rev. 3 — 17 June 2010
Product data sheet
1. Product profile
1.1 General description
The IP4233CZ6 is designed to protect Input/Output (I/O) ports that are sensitive to
capacitive loads, such as Ethernet, from destruction by ElectroStatic Discharge (ESD).
The IP4233CZ6 incorporates two pairs of ultra low capacitance back-to-back diodes
which protect components from ESD voltages as high as ±8 kV contact discharge
according to IEC 61000-4-2, level 4.
The back-to-back diodes prevent negative clipping of AC signals and voltages below zero.
The IP4233CZ6 is fabricated using monolithic silicon technology integrating two ultra low
capacitance back-to-back ESD protection diodes in a very small 6-lead SOT363 package.
1.2 Features and benefits
„
„
„
„
Pb-free and Restriction of Hazardous Substances (RoHS) compliant
ESD protection compliant to IEC 61000-4-2 level 4, ±8 kV contact discharge
Two low input capacitance (0.9 pF typical) back-to-back ESD protection diodes
Very small 6-lead SOT363 package
1.3 Applications
„ ESD protection high-frequency AC-coupled Ethernet ports
1.4 Quick reference data
Table 1.
Quick reference data
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VESD
electrostatic
discharge voltage
all pins; IEC 61000-4-2,
level 4; contact discharge
-
-
±8
kV
-
0.9
1.3
pF
C(I/O-GND) input/output to
ground capacitance
[1]
Guaranteed by design.
[2]
Pins 2 to 6 and pins 3 to 5.
VI = 0 V; f = 1 MHz
[1][2]
IP4233CZ6
NXP Semiconductors
Ultra low capacitance ESD protection for Ethernet ports
2. Pinning information
Table 2.
Pinning
Pin
Description
Simplified outline
1
not connected
2
ESD protection I/O channel 1
3
ESD protection I/O channel 2
4
not connected
5
ESD protection I/O channel 2
6
ESD protection I/O channel 1
6
1
5
Graphic symbol
4
2
1
6
2
5
3
4
3
018aaa013
3. Ordering information
Table 3.
Ordering information
Type number
Package
IP4233CZ6
Name
Description
Version
SC-88
plastic surface-mounted package; 6 leads
SOT363
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VI
input voltage
-
±5.5
V
VESD
electrostatic discharge
voltage
-
±8
kV
Tstg
storage temperature
−55
+125
°C
Tamb
ambient temperature
−40
+85
°C
all pins; IEC 61000-4-2,
level 4; contact discharge
5. Characteristics
Table 5.
Characteristics
Tamb = 25 °C unless otherwise specified.
IP4233CZ6
Product data sheet
Symbol
Parameter
Conditions
C(I/O-GND)
input/output to
ground capacitance
VI = 0 V; f = 1 MHz
IRM
reverse leakage current VI = 3.0 V
VBR
breakdown voltage
[1]
Guaranteed by design.
[2]
Pins 2 to 6 and pins 3 to 5.
back-to-back diode;
I = 5 mA
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 17 June 2010
Min
Typ
Max
Unit
[1][2]
-
0.9
1.3
pF
[2]
-
-
100
nA
6
-
9.5
V
© NXP B.V. 2010. All rights reserved.
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IP4233CZ6
NXP Semiconductors
Ultra low capacitance ESD protection for Ethernet ports
6. Application information
A typical application for protecting a 10/100 Mbit/s Ethernet transceiver against ESD is
shown in Figure 1.
not used
not used
PTC
TX+
TX+
PTC
TX−
1
6
2
5
3
4
TX−
10/100
BASE-T
ETHERNET
IP4233CZ6
Primary-Secondary
Coordinating
Elements (Opt)
RJ45
PTC
RX+
RX+
PTC
RX−
not used
RX−
not used
REMI
VCC
REMI
REMI
REMI
VCC
GND
018aaa014
Fig 1.
IP4233CZ6
Product data sheet
Typical application for ESD protection of a 10/100 Mbit/s Ethernet transceiver
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 17 June 2010
© NXP B.V. 2010. All rights reserved.
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IP4233CZ6
NXP Semiconductors
Ultra low capacitance ESD protection for Ethernet ports
7. Package outline
Plastic surface-mounted package; 6 leads
SOT363
D
E
B
y
X
A
HE
6
5
v M A
4
Q
pin 1
index
A
A1
1
2
e1
3
bp
c
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30
0.20
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.25
0.15
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT363
Fig 2.
JEITA
SC-88
EUROPEAN
PROJECTION
ISSUE DATE
04-11-08
06-03-16
Package outline SOT363 (SC-88)
IP4233CZ6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 17 June 2010
© NXP B.V. 2010. All rights reserved.
4 of 11
IP4233CZ6
NXP Semiconductors
Ultra low capacitance ESD protection for Ethernet ports
8. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
8.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
8.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
8.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
IP4233CZ6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 17 June 2010
© NXP B.V. 2010. All rights reserved.
5 of 11
IP4233CZ6
NXP Semiconductors
Ultra low capacitance ESD protection for Ethernet ports
8.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 3) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 6 and 7
Table 6.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 7.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 3.
IP4233CZ6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 17 June 2010
© NXP B.V. 2010. All rights reserved.
6 of 11
IP4233CZ6
NXP Semiconductors
Ultra low capacitance ESD protection for Ethernet ports
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 3.
Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
IP4233CZ6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 17 June 2010
© NXP B.V. 2010. All rights reserved.
7 of 11
IP4233CZ6
NXP Semiconductors
Ultra low capacitance ESD protection for Ethernet ports
9. Revision history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
IP4233CZ6 v.3
20100617
Product data sheet
-
IP4233CZ6 v.2
Modifications:
•
•
Figure 1: corrected
Section 10 “Legal information”: updated
IP4233CZ6 v.2
20100506
Preliminary data sheet
-
IP4233CZ6_1
IP4233CZ6_1
20090330
Objective data sheet
-
-
IP4233CZ6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 17 June 2010
© NXP B.V. 2010. All rights reserved.
8 of 11
IP4233CZ6
NXP Semiconductors
Ultra low capacitance ESD protection for Ethernet ports
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
10.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
IP4233CZ6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 17 June 2010
© NXP B.V. 2010. All rights reserved.
9 of 11
IP4233CZ6
NXP Semiconductors
Ultra low capacitance ESD protection for Ethernet ports
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
IP4233CZ6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 17 June 2010
© NXP B.V. 2010. All rights reserved.
10 of 11
IP4233CZ6
NXP Semiconductors
Ultra low capacitance ESD protection for Ethernet ports
12. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
8.2
8.3
8.4
9
10
10.1
10.2
10.3
10.4
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Application information. . . . . . . . . . . . . . . . . . . 3
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4
Soldering of SMD packages . . . . . . . . . . . . . . . 5
Introduction to soldering . . . . . . . . . . . . . . . . . . 5
Wave and reflow soldering . . . . . . . . . . . . . . . . 5
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . . 5
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . 6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Contact information. . . . . . . . . . . . . . . . . . . . . 10
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 17 June 2010
Document identifier: IP4233CZ6
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