Data Sheet

IP4264CZ8-10/20/40-TTL
Integrated (U)SIM card passive filter array with ESD protection
Rev. 2 — 12 October 2011
Product data sheet
1. Product profile
1.1 General description
The IP4264CZ8-10-TTL, IP4264CZ8-20-TTL and IP4264CZ8-40-TTL are 3-channel
RC low-pass filter arrays. They are designed to provide filtering of undesired RF signals in
the 800 MHz-to-3000 MHz frequency band. They incorporate diodes to provide protection
to downstream components from ElectroStatic Discharge (ESD) voltages up to 25 kV
contact and higher than 25 kV air discharge, far exceeding IEC 61000-4-2, level 4.
The devices support ESD protection of the USB data pins of a Universal Subscriber
Identity Module (USIM) interface, as well as the digital standard SIM interface
ESD protection and ElectroMagnetic Interface (EMI) filtering.
The devices are fabricated using monolithic silicon technology. They integrate three
resistors and eight high-level ESD protection diodes in a 0.4 mm pitch Quad Flat-pack
No-leads (QFN) plastic package with a height of only 0.5 mm. These features make all
three devices ideal for use in applications requiring component miniaturization, such as
mobile phone handsets, cordless telephones and personal digital devices.
Similar products are available in Wafer Level Chip-Size Package (WLCSP).
IP4365CX11/P (0.4 mm pitch, 11-ball WLCSP11) is designed for USIM interfaces.
IP4364CX8 (0.4 mm pitch, 8-ball WLCSP8) and
IP4064CX8 (0.5 mm pitch, 8-ball WLCSP8) are designed for SIM interfaces.
1.2 Features and benefits
 Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen
and antimony (Dark Green compliant)
 3-channel SIM card interface integrated RC-filter array and SIM voltage
ESD protection
 2 USIM (USB 1.1) compliant ESD protection diodes with 20 pF channel capacitance
 Integrated 100 /100 /47  series channel resistors
 Total channel capacitance of 10 pF (IP4264CZ8-10-TTL), 20 pF (IP4264CZ8-20-TTL)
or 40 pF (IP4264CZ8-40-TTL)
 Downstream ESD protection up to 25 kV (contact) according to IEC 61000-4-2
 Micropak (QFN compatible) plastic package with 0.4 mm pitch
1.3 Applications
 SIM interfaces in for example, cellular phone and Personal Communication
System (PCS) mobile handsets
IP4264CZ8-10/20/40-TTL
NXP Semiconductors
Integrated (U)SIM card passive filter array with ESD protection
2. Pinning information
Table 1.
Pinning
Pin
Description
1 and 8
filter channel 1
2 and 7
filter channel 2
3 and 6
filter channel 3
4 and 5
ESD protection
GND
ground
Simplified outline
8
Graphic symbol
5
R1
1
8
100 Ω
R2
1
4
Transparent
top view
2
7
47 Ω
R3
3
6
100 Ω
4
5
018aaa015
3. Ordering information
Table 2.
Ordering information
Type number
IP4264CZ8-10-TTL
Package
Name
Description
Version
HUSON8
plastic thermal enhanced extremely thin small outline package;
no leads; 8 terminals; body 1.35  1.7  0.55 mm
SOT1166-1
IP4264CZ8-20-TTL
IP4264CZ8-40-TTL
4. Marking
Table 3.
IP4264CZ8-10_20_40-TTL
Product data sheet
Marking codes
Type number
Marking code
IP4264CZ8-10-TTL
N1
IP4264CZ8-20-TTL
N2
IP4264CZ8-40-TTL
N4
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Integrated (U)SIM card passive filter array with ESD protection
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
10
+10
kV
15
+15
kV
contact discharge
8
+8
kV
air discharge
15
+15
kV
contact discharge
15
+15
kV
air discharge
15
+15
kV
contact discharge
15
+15
kV
air discharge
15
+15
kV
contact discharge
25
+25
kV
air discharge
25
+25
kV
contact discharge
8
+8
kV
air discharge
15
+15
kV
IP4264CZ8-10-TTL
VESD
electrostatic discharge
voltage
pins 1, 2 and 3 to ground
[1]
contact discharge
air discharge
pins 6, 7 and 8 to ground
pins 5 and 6 to ground
[1]
[1]
IP4264CZ8-20-TTL
VESD
electrostatic discharge
voltage
all pins to ground
[1]
IP4264CZ8-40-TTL
VESD
electrostatic discharge
voltage
all pins to ground
[1]
IP4264CZ8-10-TTL, IP4264CZ8-20-TTL and IP4264CZ8-40-TTL
VESD
electrostatic discharge
voltage
VI
input voltage
at I/O pins
0.5
+5.5
V
Pch
channel power
dissipation
Tamb = 70 C
-
60
mW
Ptot
total power dissipation
Tamb = 70 C
-
180
mW
Tstg
storage temperature
55
+150
C
-
260
C
30
+85
C
Treflow(peak) peak reflow
temperature
Tamb
[1]
IP4264CZ8-10_20_40-TTL
Product data sheet
IEC 61000-4-2, level 4;
all pins to ground
tp  10 s
ambient temperature
All devices are qualified using 1000 contact discharges of 8 kV (IP4264CZ8-10-TTL and
IP4264CZ8-20-TTL) or 25 kV (IP4264CZ8-40-TTL) using the IEC 61000-4-2 model, far exceeding the
specified IEC 61000-4-2, level 4 (8 kV contact discharge).
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 October 2011
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Integrated (U)SIM card passive filter array with ESD protection
6. Characteristics
Table 5.
Channel resistance
Tamb = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rs(ch)
channel series
resistance
R1, R3
85
100
115

R2
40
47
54

Table 6.
Channel characteristics
Tamb = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IRM
reverse leakage
current
VI = 3 V
-
-
50
nA
VBR
breakdown voltage
Itest = 1 mA
6
-
10
V
8
10
12
pF
4
6
8
pF
IP4264CZ8-10-TTL
Cch
channel capacitance f = 1 MHz
[1][2]
Vbias(DC) = 0 V
Vbias(DC) = 2.5 V
Cd
diode capacitance
f = 1 MHz
[1][3]
Vbias(DC) = 0 V
8
10
12
pF
Vbias(DC) = 2.5 V
4
6
8
pF
IP4264CZ8-20-TTL
Cch
channel capacitance f = 1 MHz
[1][2]
Vbias(DC) = 0 V
-
17
20
pF
Vbias(DC) = 2.5 V
-
11
15
pF
IP4264CZ8-40-TTL
Cch
channel capacitance f = 1 MHz
[1][2]
Vbias(DC) = 0 V
-
35
40
pF
Vbias(DC) = 2.5 V
-
23
28
pF
IP4264CZ8-20-TTL and IP4264CZ8-40-TTL
Cd
IP4264CZ8-10_20_40-TTL
Product data sheet
diode capacitance
f = 1 MHz
[3]
Vbias(DC) = 0 V
12
16
20
pF
Vbias(DC) = 2.5 V
8
11
14
pF
[1]
Guaranteed by design.
[2]
Total line capacitance including diode capacitance, per channel.
[3]
Pins 4 and 5 to ground.
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Integrated (U)SIM card passive filter array with ESD protection
7. Application information
7.1 Insertion loss
The devices are designed as EMI/Radio Frequency Interference (RFI) filters for SIM card
interfaces. The setup for measuring return loss is shown in Figure 1.
The insertion loss in a 50  system for all three channels of
IP4264CZ8-10-TTL (Cch = 10 pF) is shown in Figure 2. The same measurements for
IP4264CZ8-20-TTL (Cch = 20 pF) are shown in Figure 3. The insertion loss for
IP4264CZ8-40-TTL (Cch = 10 pF) is shown in Figure 4.
018aaa145
0
S21
(dB)
(1)
–10
–20
IN
DUT
OUT
(2)
–30
50 Ω
TEST BOARD
50 Ω
(3)
Vgen
–40
10–1
1
018aaa016
10
102
103
104
f (MHz)
Cch = 10 pF
(1) Pin 2 to 7
(2) Pin 1 to 8
(3) Pin 3 to 6
Fig 1.
Frequency response setup
IP4264CZ8-10_20_40-TTL
Product data sheet
Fig 2.
IP4264CZ8-10-TTL: Frequency response
curves
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Integrated (U)SIM card passive filter array with ESD protection
018aaa017
0
S21
(dB)
018aaa018
0
S21
(dB)
(1)
(1)
−10
−10
−20
−20
(2)
−30
(2)
−30
(3)
(3)
−40
10−1
1
10
102
103
104
f (MHz)
−40
10−1
Cch = 20 pF
1
(1) Pin 2 to 7
(2) Pin 1 to 8
(2) Pin 1 to 8
(3) Pin 3 to 6
(3) Pin 3 to 6
IP4264CZ8-20-TTL: Frequency response
curves
IP4264CZ8-10_20_40-TTL
Product data sheet
102
103
104
f (MHz)
Cch = 40 pF
(1) Pin 2 to 7
Fig 3.
10
Fig 4.
IP4264CZ8-40-TTL: Frequency response
curves
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Integrated (U)SIM card passive filter array with ESD protection
7.2 Crosstalk
The setup for measuring crosstalk between channels in a 50  system is shown in
Figure 5. The crosstalk for IP4264CZ8-10-TTL is shown in Figure 6, for
IP4264CZ8-20-TTL in Figure 7 and for IP4264CZ8-40-TTL in Figure 8. Unused channels
are terminated with a 50  resistor to ground.
The crosstalk between any pin and pin 4 and pin 5 is similar to the crosstalk between the
channels.
018aaa146
0
S21
(dB)
–30
(1)
IN1
DUT
OUT2
–60
(3)
50 Ω
IN2
(2)
50 Ω
OUT1
TEST BOARD
Vgen
50 Ω
50 Ω
–90
10–1
1
018aaa019
10
102
103
104
f (MHz)
Cch = 10 pF
(1) Pin 1 to 7
(2) Pin 2 to 6
(3) Pin 3 to 8
Fig 5.
Crosstalk measurement setup
IP4264CZ8-10_20_40-TTL
Product data sheet
Fig 6.
IP4264CZ8-10-TTL: Crosstalk behavior
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Integrated (U)SIM card passive filter array with ESD protection
018aaa020
0
S21
(dB)
018aaa021
0
S21
(dB)
−20
−20
(1)
(1)
(2)
(3)
−40
−40
−60
−60
−80
−80
−100
10−1
1
10
102
103
104
f (MHz)
(2)
(3)
−100
10−1
Cch = 20 pF
1
(1) Pin 1 to 7
(2) Pin 2 to 6
(2) Pin 2 to 6
(3) Pin 3 to 8
(3) Pin 3 to 8
IP4264CZ8-20-TTL: Crosstalk behavior
IP4264CZ8-10_20_40-TTL
Product data sheet
102
103
104
f (MHz)
Cch = 40 pF
(1) Pin 1 to 7
Fig 7.
10
Fig 8.
IP4264CZ8-40-TTL: Crosstalk behavior
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Integrated (U)SIM card passive filter array with ESD protection
7.3 USIM and SIM interface application schematic
The application schematic diagram depicted in Figure 9 demonstrates how the three
NXP SIM card EMI filter and ESD protection devices are used in a typical USIM interface
application.
For example, in case a standard SIM interface without USB 1.1 is used, the two single
diodes (pins 4 and 5) can protect the VSIM line.
It is only one example dependent on layout constraints. For example, channels 1 to 8 can
be swapped with channels 3 to 6.
Also, the USB interface ESD protection pins 4 and 5 can be exchanged. Due to both sides
of the devices containing identical protection diodes, baseband and SIM card side can be
swapped, too (pin 1 with pin 8, pin 2 with pin 7 etc.).
A standard SIM interface application is depicted in Figure 10. In this case, both
ESD protection diodes (pins 1 and 8) are used to protect VSIM.
VSIM
VSIM
protection
diode
RST
R3
1
8
VCC
GND
RST
SPU
CLK
I/O
100 Ω
R2
2
CLK
I/O
7
47 Ω
3
R1
6
100 Ω
5
D+
AUX 1 AUX 2
USB
D–
4
SIM CARD
BASEBAND
CENTER GROUND PAD
018aaa147
Fig 9.
IP4264CZ8-10_20_40-TTL
Product data sheet
USIM application schematic
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Integrated (U)SIM card passive filter array with ESD protection
VSIM
4
RST
5
R3
1
8
VCC
GND
RST
SPU
CLK
I/O
100 Ω
R2
2
7
CLK
47 Ω
R1
3
6
I/O
AUX 1 AUX 2
100 Ω
SIM CARD
BASEBAND
CENTER GROUND PAD
018aaa148
Fig 10. SIM application schematic
7.4 Compatible devices in WLCSP
The IP4264CZ8-10-TTL and IP4264CZ8-20-TTL are optimized for SIM and USIM
interfaces. Comparable devices are also available in WLCSP:
•
•
•
•
IP4264CZ8-10_20_40-TTL
Product data sheet
IP4064CX8, 0.5 mm pitch SIM interface device compatible with IP4264CZ8-20-TTL
IP4364CX8, 0.4 mm pitch SIM interface device compatible with IP4264CZ8-20-TTL
IP4366CX8/P, 0.4 mm pitch SIM interface device compatible with IP4264CZ8-10-TTL
IP4365CX11/P, 0.4 mm pitch USIM interface device compatible with
IP4264CZ8-10-TTL
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 October 2011
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Integrated (U)SIM card passive filter array with ESD protection
8. Package outline
HUSON8: plastic, thermal enhanced ultra thin small outline package; no leads;
8 terminals; body 1.35 x 1.7 x 0.55 mm
SOT1166-1
X
A
B
D
E
A
A1
c
terminal 1
index area
detail X
e1
terminal 1
index area
e
1
4
C
C A B
C
v
w
b
y1 C
y
L
k
Eh
8
5
Dh
tiebars are indicated on
arbitrary location and size
0
1
scale
Dimensions
Unit(1)
mm
2 mm
A
A1
b
c
D
1.8
max 0.55 0.05 0.25
0.20 0.127 1.7
nom
1.6
min
0.00 0.15
Dh
1.3
1.2
1.1
E
Eh
1.45 0.45
1.35 0.40
1.25 0.35
e
e1
0.4
k
L
v
0.1
0.2
0.30
0.25
0.20
1.2
w
y
y1
0.05 0.05 0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
References
Outline
version
IEC
JEDEC
JEITA
SOT1166-1
---
---
---
sot1166-1_po
European
projection
Issue date
10-03-18
10-03-22
Fig 11. Package outline SOT1166-1 (HUSON8)
IP4264CZ8-10_20_40-TTL
Product data sheet
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9. Revision history
Table 7.
Revision history
Document ID
Release date
IP4264CZ8-10_20_40-TTL v.2 20111012
Modifications:
•
•
Product data sheet
Change notice Supersedes
Product data sheet
-
IP4264CZ8-10_20_40-TTL v.1
Figure 2: corrected title
Section 10 “Legal information”: updated
IP4264CZ8-10_20_40-TTL v.1 20110708
IP4264CZ8-10_20_40-TTL
Data sheet status
Product data sheet
-
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Rev. 2 — 12 October 2011
-
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10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
10.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
IP4264CZ8-10_20_40-TTL
Product data sheet
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Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
IP4264CZ8-10_20_40-TTL
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 October 2011
© NXP B.V. 2011. All rights reserved.
14 of 15
IP4264CZ8-10/20/40-TTL
NXP Semiconductors
Integrated (U)SIM card passive filter array with ESD protection
12. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
7.1
7.2
7.3
7.4
8
9
10
10.1
10.2
10.3
10.4
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 5
Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
USIM and SIM interface application
schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Compatible devices in WLCSP. . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Contact information. . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 12 October 2011
Document identifier: IP4264CZ8-10_20_40-TTL
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