418AJ

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
D2PAK−3 (TO−263, 3−LEAD)
CASE 418AJ
ISSUE B
SCALE 1:1
B
E2
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. CHAMFER OPTIONAL
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH. MOLD FLASH SHALL NOT EXCEED 0.005
PER SIDE. THESE DIMENSIONS ARE MEASURED
AT THE OUTERMOST EXTREMES OF THE
PLASTIC BODY AT DATUM H.
5. THERMAL PAD CONTOUR IS OPTIONAL WITHIN
DIMENSIONS E, L1, D1 AND E1.
6. OPTIONAL MOLD FEATURE
A
A
E
DATE 08 OCT 2013
L1
c2
NOTE 3
A
D1
L1
D
H
DETAIL C
E1
0.10
L2
e
2X
TOP VIEW
b
0.10
B A
B
SEATING
PLANE
M
A
c
NOTE 6
M
VIEW A−A
SIDE VIEW
M
B A
M
H
GAUGE
PLANE
L3
A1
L
M
DETAIL C
DIM
A
A1
b
c
c2
D
D1
E
E1
e
H
L
L1
L2
L3
M
INCHES
MIN
MAX
0.160 0.190
0.000 0.010
0.020 0.039
0.012 0.029
0.045 0.065
0.330 0.380
0.260
−−−−
0.380 0.420
0.245
−−−−
0.100 BSC
0.575 0.625
0.070
0.110
−−−− 0.066
−−−− 0.070
0.010 BSC
0°
8°
MILLIMETERS
MIN
MAX
4.06
4.83
0.00
0.25
0.51
0.99
0.30
0.74
1.14
1.65
8.38
9.65
6.60
−−−−
9.65 10.67
6.22
−−−−
2.54 BSC
14.60 15.88
1.78
2.79
−−−−
1.68
−−−−
1.78
0.25 BSC
0°
8°
GENERIC MARKING DIAGRAMS*
VIEW A−A
OPTIONAL CONSTRUCTIONS
RECOMMENDED
SOLDERING FOOTPRINT*
0.436
XX
XXXXXXXXX
AWLYWWG
XXXXXXXXG
AYWW
AYWW
XXXXXXXXG
AKA
XXXXXX
XXYMW
IC
Standard
Rectifier
SSG
0.366
0.653
2X
0.169
2X
0.063
0.100
PITCH
DIMENSIONS: INCHES
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
98AON56370E
ON SEMICONDUCTOR STANDARD
http://onsemi.com
D2PAK−3 (TO−263, 3−LEAD) 1
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
XXXXXX = Specific Device Code
A
= Assembly Location
WL
= Wafer Lot
Y
= Year
WW
= Work Week
W
= Week Code (SSG)
M
= Month Code (SSG)
G
= Pb−Free Package
AKA
= Polarity Indicator
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON56370E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
04 APR 2011
A
CORRECTED PITCH ON SOLDER FOOTPRINT TO BE FROM CENTER LINE TO
LEAD. REQ. BY D. TRUHITTE.
25 JUL 2011
B
ADDED GENERIC MARKING DIAGRAM FOR SSG. REQ. BY I. CAMBALIZA.
08 OCT 2013
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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© Semiconductor Components Industries, LLC, 2013
October, 2013 − Rev. B
Case Outline Number:
418AJ
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