Data Sheet

PCA9553
4-bit I2C-bus LED driver with programmable blink rates
Rev. 06 — 29 December 2008
Product data sheet
1. General description
The PCA9553 LED blinker blinks LEDs in I2C-bus and SMBus applications where it is
necessary to limit bus traffic or free up the I2C-bus master's (MCU, MPU, DSP, chip set,
etc.) timer. The uniqueness of this device is the internal oscillator with two programmable
blink rates. To blink LEDs using normal I/O expanders like the PCF8574 or PCA9554, the
bus master must send repeated commands to turn the LED on and off. This greatly
increases the amount of traffic on the I2C-bus and uses up one of the master's timers. The
PCA9553 LED blinker instead requires only the initial set-up command to program
BLINK RATE 1 and BLINK RATE 2 (i.e., the frequency and duty cycle). From then on, only
one command from the bus master is required to turn each individual open-drain output
ON, OFF, or to cycle at BLINK RATE 1 or BLINK RATE 2. Maximum output sink current is
25 mA per bit and 100 mA per package.
Any bits not used for controlling the LEDs can be used for General Purpose Parallel
Input/Output (GPIO) expansion.
Power-On Reset (POR) initializes the registers to their default state, all zeroes, causing
the bits to be set HIGH (LED off).
Due to pin limitations, the PCA9553 is not featured with hardware address pins. The
PCA9553/01 and the PCA9553/02 have different fixed I2C-bus addresses allowing
operation of both on the same bus.
2. Features
n 4 LED drivers (on, off, flashing at a programmable rate)
n 2 selectable, fully programmable blink rates (frequency and duty cycle) between
0.172 Hz and 44 Hz (5.82 seconds and 0.023 seconds)
n Input/outputs not used as LED drivers can be used as regular GPIOs
n Internal oscillator requires no external components
n I2C-bus interface logic compatible with SMBus
n Internal power-on reset
n Noise filter on SCL/SDA inputs
n 4 open-drain outputs directly drive LEDs to 25 mA
n Controlled edge rates to minimize ground bounce
n No glitch on power-up
n Supports hot insertion
n Low standby current
n Operating power supply voltage range of 2.3 V to 5.5 V
n 0 Hz to 400 kHz clock frequency
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
n ESD protection exceeds 2000 V HBM per JESD22-A114, 150 V MM per
JESD22-A115 and 1000 V CDM per JESD22-C101
n Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
n Packages offered: SO8, TSSOP8 (MSOP8), HVSON8
3. Ordering information
Table 1.
Ordering information
Type number
PCA9553D/01
Package
Name
Description
Version
SO8
plastic small outline package; 8 leads;
body width 3.9 mm
SOT96-1
PCA9553D/02
PCA9553DP/02
TSSOP8[1] plastic thin shrink small outline package; 8 leads;
body width 3 mm
PCA9553TK[2]
HVSON8
PCA9553DP/01
PCA9553TK/02
SOT505-1
plastic thermal enhanced very thin small outline
SOT908-1
package; no leads; 8 terminals; body 3 × 3 × 0.85 mm
[1]
Also known as MSOP8.
[2]
PCA9553TK uses version /01 address.
4. Marking
Table 2.
Marking codes
Type number
Marking code
PCA9553D/01
9553/1
PCA9553D/02
9553/2
PCA9553DP/01
P53/1
PCA9553DP/02
P53/2
PCA9553TK
P53/1
PCA9553TK/02
P53/2
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
2 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
5. Block diagram
PCA9553
SCL
INPUT
REGISTER
INPUT
FILTERS
SDA
I2C-BUS
CONTROL
LED SELECT (LSn)
REGISTER
0
1
POWER-ON
RESET
VDD
OSCILLATOR
PRESCALER 0
REGISTER
PWM0
REGISTER
BLINK0
PRESCALER 1
REGISTER
PWM1
REGISTER
BLINK1
LEDn
VSS
002aad745
Only one I/O shown for clarity.
Fig 1.
Block diagram
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
3 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
6. Pinning information
6.1 Pinning
LED0
1
8
VDD
LED1
2 PCA9553D/01 7
SDA
LED2
3 PCA9553D/02 6
SCL
VSS
5
4
LED0
1
8
LED1
2
7
VSS
4
5
SDA
PCA9553DP/01
PCA9553DP/02
6 SCL
LED2 3
LED3
LED3
002aad679
002aad678
Fig 2.
VDD
Pin configuration for SO8
Fig 3.
Pin configuration for TSSOP8
PCA9553TK
PCA9553TK/02
terminal 1
index area
LED0
1
8
VDD
LED1
2
7
SDA
LED2
3
6
SCL
VSS
4
5
LED3
002aad680
Transparent top view
Fig 4.
Pin configuration for HVSON8
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
LED0
1
LED driver 0
LED1
2
LED driver 1
LED2
3
LED driver 2
VSS
4[1]
supply ground
LED3
5
LED driver 3
SCL
6
serial clock line
SDA
7
serial data line
VDD
8
supply voltage
[1]
HVSON8 package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must
be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board
level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad
on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the
PCB in the thermal pad region.
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
4 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
7. Functional description
Refer to Figure 1 “Block diagram”.
7.1 Device address
Following a START condition the bus master must output the address of the slave it is
accessing. The address of the PCA9553/01 is shown in Figure 5 and PCA9553/02 in
Figure 6.
PCA9553TK uses the version /01 address.
slave address
1
1
0
0
0
slave address
1
0
R/W
1
1
002aad742
Fig 5.
0
0
0
1
1
R/W
002aad743
PCA9553/01 slave address
Fig 6.
PCA9553/02 slave address
The last bit of the address byte defines the operation to be performed. When set to logic 1
a read is selected, while a logic 0 selects a write operation.
7.2 Control register
Following the successful acknowledgement of the slave address, the bus master will send
a byte to the PCA9553 which will be stored in the Control register.
0
0
0
AI
0
Auto-Increment
flag
B2
B1
B0
register address
002aad744
Reset state: 00h
Fig 7.
Control register
The lowest 3 bits are used as a pointer to determine which register will be accessed.
If the Auto-Increment flag is set, the three low order bits of the Control register are
automatically incremented after a read or write. This allows the user to program the
registers sequentially. The contents of these bits will rollover to ‘000’ after the last register
is accessed.
When the Auto-Increment flag is set (AI = 1) and a read sequence is initiated, the
sequence must start by reading a register different from ‘0’ (B2 B1 B0 ≠ 0 0 0).
Only the 3 least significant bits are affected by the AI flag.
Unused bits must be programmed with zeroes.
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
5 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
Table 4.
Control register definition
B2
B1
B0
Register name
Type
Register function
0
0
0
INPUT
read
input register
0
0
1
PSC0
read/write
frequency prescaler 0
0
1
0
PWM0
read/write
PWM register 0
0
1
1
PSC1
read/write
frequency prescaler 1
1
0
0
PWM1
read/write
PWM register 1
1
0
1
LS0
read/write
LED selector
7.3 Register descriptions
7.3.1 INPUT - Input register
The INPUT register reflects the state of the device pins. Writes to this register will be
acknowledged but will have no effect.
Table 5.
Bit
INPUT - Input register description
7
6
5
4
3
2
1
0
Symbol
INPUT[7]
INPUT[6]
INPUT[5]
INPUT[4]
LED3
LED2
LED1
LED0
Default
0
0
0
0
X
X
X
X
Remark: The default value ‘X’ is determined by the externally applied logic level (normally
logic 1) when used for directly driving LED with pull-up to VDD.
7.3.2 PSC0 - Frequency Prescaler 0
PSC0 is used to program the period of the PWM output.
The period of BLINK0 = (PSC0 + 1) / 44.
Table 6.
Bit
PSC0 - Frequency Prescaler 0 register description
7
6
5
4
3
2
1
0
Symbol
PSC0[7]
PSC0[6]
PSC0[5]
PSC0[4]
PSC0[3]
PSC0[2]
PSC0[1]
PSC0[0]
Default
1
1
1
1
1
1
1
1
7.3.3 PWM0 - Pulse Width Modulation 0
The PWM0 register determines the duty cycle of BLINK0. The outputs are LOW (LED off)
when the count is less than the value in PWM0 and HIGH when it is greater. If PWM0 is
programmed with 00h, then the PWM0 output is always LOW.
The duty cycle of BLINK0 = (256 − PWM0) / 256.
Table 7.
Bit
PWM0 - Pulse Width Modulation 0 register description
7
6
5
4
3
2
1
0
Symbol
PWM0
[7]
PWM0
[6]
PWM0
[5]
PWM0
[4]
PWM0
[3]
PWM0
[2]
PWM0
[1]
PWM0
[0]
Default
1
0
0
0
0
0
0
0
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
6 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
7.3.4 PSC1 - Frequency Prescaler 1
PSC1 is used to program the period of the PWM output.
The period of BLINK1 = (PSC1 + 1) / 44.
Table 8.
Bit
PSC1 - Frequency Prescaler 1 register description
7
6
5
4
3
2
1
0
Symbol
PSC1[7]
PSC1[6]
PSC1[5]
PSC1[4]
PSC1[3]
PSC1[2]
PSC1[1]
PSC1[0]
Default
1
1
1
1
1
1
1
1
7.3.5 PWM1 - Pulse Width Modulation 1
The PWM1 register determines the duty cycle of BLINK1. The outputs are LOW (LED off)
when the count is less than the value in PWM1 and HIGH when it is greater. If PWM1 is
programmed with 00h, then the PWM1 output is always LOW.
The duty cycle of BLINK1 = (256 − PWM1) / 256.
Table 9.
Bit
PWM1 - Pulse Width Modulation 1 register description
7
6
5
4
3
2
1
0
Symbol
PWM1
[7]
PWM1
[6]
PWM1
[5]
PWM1
[4]
PWM1
[3]
PWM1
[2]
PWM1
[1]
PWM1
[0]
Default
1
0
0
0
0
0
0
0
7.3.6 LS0 - LED selector register
The LS0 LED select register determines the source of the LED data.
00 = output is set LOW (LED on)
01 = output is set high-impedance (LED off; default)
10 = output blinks at PWM0 rate
11 = output blinks at PWM1 rate
Table 10. LS0 - LED selector register bit description
Legend: * default value.
Register
Bit
Value
Description
LS0 - LED0 to LED3 selector
LS0
7:6
01*
LED3 selected
5:4
01*
LED2 selected
3:2
01*
LED1 selected
1:0
01*
LED0 selected
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
7 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
7.4 Pins used as general purpose I/Os
LED pins not used to control LEDs can be used as general purpose I/Os.
For use as input: Set LEDn to high-impedance (01) and then read the pin state via the
Input register.
For use as output: Connect external pull-up resistor to the pin and size it according to the
DC recommended operating characteristics. LED output pin is HIGH when the output is
programmed as high-impedance, and LOW when the output is programmed LOW through
the ‘LED selector’ register. The output can be pulse-width controlled when PWM0 or
PWM1 are used.
7.5 Power-on reset
When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9553 in
a reset condition until VDD has reached VPOR. At that point, the reset condition is released
and the PCA9553 registers are initialized to their default states, with all outputs in the OFF
state. Thereafter, VDD must be lowered below 0.2 V to reset the device.
8. Characteristics of the I2C-bus
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two
lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be
connected to a positive supply via a pull-up resistor when connected to the output stages
of a device. Data transfer may be initiated only when the bus is not busy.
8.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the HIGH period of the clock pulse as changes in the data line at this time
will be interpreted as control signals (see Figure 8).
SDA
SCL
data line
stable;
data valid
Fig 8.
change
of data
allowed
mba607
Bit transfer
8.1.1 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW
transition of the data line while the clock is HIGH is defined as the START condition (S). A
LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP
condition (P) (see Figure 9).
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
8 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
SDA
SDA
SCL
SCL
S
P
START condition
STOP condition
mba608
Fig 9.
Definition of START and STOP conditions
8.2 System configuration
A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The
device that controls the message is the ‘master’ and the devices which are controlled by
the master are the ‘slaves’ (see Figure 10).
SDA
SCL
MASTER
TRANSMITTER/
RECEIVER
SLAVE
RECEIVER
SLAVE
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER
MASTER
TRANSMITTER/
RECEIVER
I2C-BUS
MULTIPLEXER
SLAVE
002aaa966
Fig 10. System configuration
8.3 Acknowledge
The number of data bytes transferred between the START and the STOP conditions from
transmitter to receiver is not limited. Each byte of eight bits is followed by one
acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,
whereas the master generates an extra acknowledge related clock pulse.
A slave receiver which is addressed must generate an acknowledge after the reception of
each byte. Also a master must generate an acknowledge after the reception of each byte
that has been clocked out of the slave transmitter. The device that acknowledges has to
pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable
LOW during the HIGH period of the acknowledge related clock pulse; set-up time and hold
time must be taken into account.
A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
9 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
data output
by transmitter
not acknowledge
data output
by receiver
acknowledge
SCL from master
1
2
8
S
9
clock pulse for
acknowledgement
START
condition
002aaa987
Fig 11. Acknowledgement on the I2C-bus
8.4 Bus transactions
SCL
1
2
3
4
5
6
7
8
9
slave address
1
SDA S
1
0
0
0
data to register
command byte
1
0
START condition
0
A
R/W
0
0
0
AI
0 B2 B1 B0 A
DATA 1
A
acknowledge
from slave
acknowledge
from slave
acknowledge
from slave
write to register
tv(Q)
data out from port
DATA 1 VALID
002aad746
Fig 12. Write to register
slave address
SDA S
1
1
0
0
0
command byte
1
0
START condition
0
0
A
1
1
0
0
(repeated)
START condition
0
1
0
1
0
AI
0 B2 B1 B0 A
(cont.)
acknowledge
from slave
R/W
acknowledge
from slave
slave address
(cont.) S
0
data from register
A
R/W
acknowledge
from slave
DATA (first byte)
Auto-Increment
register address
if AI = 1
data from register
A
acknowledge
from master
DATA (last byte)
NA P
no acknowledge
from master
at this moment master-transmitter becomes master-receiver
and slave-receiver becomes slave-transmitter
STOP
condition
002aad747
Fig 13. Read from register
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
10 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
no acknowledge
from master
slave address
SDA S
1
1
0
0
0
data from port
1
0
START condition
1
R/W
data from port
DATA 1
A
A
DATA 4
STOP
condition
acknowledge
from master
acknowledge
from slave
NA P
read from
port
th(D)
data into
port
tsu(D)
DATA 2
DATA 3
DATA 4
002aad748
This figure assumes the command byte has previously been programmed with 00h.
PCA9553/01 shown.
Fig 14. Read input port register
9. Application design-in information
5V
5V
I2C-BUS/SMBus
MASTER
SDA
SCL
10 kΩ
10 kΩ
VDD
SDA
LED0
SCL
LED1
LED2
LED3
PCA9553
VSS
002aad749
Fig 15. Typical application
9.1 Minimizing IDD when the I/Os are used to control LEDs
When the I/Os are used to control LEDs, they are normally connected to VDD through a
resistor as shown in Figure 15. Since the LED acts as a diode, when the LED is off the I/O
VI is about 1.2 V less than VDD. The supply current, IDD, increases as VI becomes lower
than VDD and is specified as ∆IDD in Table 13 “Static characteristics”.
Designs needing to minimize current consumption, such as battery power applications,
should consider maintaining the I/O pins greater than or equal to VDD when the LED is off.
Figure 16 shows a high value resistor in parallel with the LED. Figure 17 shows VDD less
than the LED supply voltage by at least 1.2 V. Both of these methods maintain the I/O VI at
or above VDD and prevents additional supply current consumption when the LED is off.
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
11 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
3.3 V
VDD
VDD
LED
5V
VDD
100 kΩ
LEDn
LED
LEDn
002aac189
Fig 16. High value resistor in parallel with
the LED
002aac190
Fig 17. Device supplied by a lower voltage
9.2 Programming example
The following example shows how to set LED0 and LED1 off. It will then set LED2 to blink
at 1 Hz, 50 % duty cycle. LED3 will be set to blink at 4 Hz, 25 % duty cycle. PCA9553/01
is used in this example.
Table 11.
Programming PCA9553
Program sequence
I2C-bus
START
S
PCA9553 address
C4h
PSC0 subaddress + Auto-Increment
11h
Set prescaler PSC0 to achieve a period of 1 second:
2Bh
PSC0 + 1
Blink period = 1 = -----------------------44
PSC0 = 43
Set PWM0 duty cycle to 50 %:
80h
256 – PWM0
-------------------------------- = 0.5
256
PWM0 = 128
Set prescaler PSC1 to achieve a period of 0.25 seconds:
0Ah
PSC1 + 1
Blink period = 0.25 = -----------------------44
PSC1 = 10
Set PWM1 output duty cycle to 25 %:
C0h
256 – PWM1
-------------------------------- = 0.25
256
PWM1 = 192
Set LED0 on, LED1 off, LED2 set to blink at PSC0, PWM0, LED3 set to blink at
PSC1, PWM1
E4h
STOP
P
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
12 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
10. Limiting values
Table 12. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDD
Conditions
Min
Max
Unit
supply voltage
−0.5
+6.0
V
VI/O
voltage on an input/output pin
VSS − 0.5
5.5
V
IO(LEDn)
output current on pin LEDn
-
±25
mA
ISS
ground supply current
-
100
mA
Ptot
total power dissipation
-
400
mW
Tstg
storage temperature
−65
+150
°C
Tamb
ambient temperature
−40
+85
°C
operating
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
13 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
11. Static characteristics
Table 13. Static characteristics
VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
Supplies
VDD
supply voltage
2.3
-
5.5
V
IDD
supply current
operating mode; VDD = 5.5 V; no load;
VI = VDD or VSS; fSCL = 100 kHz
-
350
500
µA
Istb
standby current
Standby mode; VDD = 5.5 V; no load;
VI = VDD or VSS; fSCL = 100 kHz
-
1.9
3.0
µA
∆IDD
additional quiescent
supply current
Standby mode; VDD = 5.5 V;
every LED I/O at VI = 4.3 V;
fSCL = 0 kHz
-
-
325
µA
VPOR
power-on reset voltage
no load; VI = VDD or VSS
-
1.7
2.2
V
[2]
Input SCL; input/output SDA
VIL
LOW-level input voltage
−0.5
-
+0.3VDD
V
VIH
HIGH-level input voltage
0.7VDD
-
5.5
V
IOL
LOW-level output current
VOL = 0.4 V
3
6.5
-
mA
IL
leakage current
VI = VDD = VSS
−1
-
+1
µA
Ci
input capacitance
VI = VSS
-
3.7
5
pF
I/Os
VIL
LOW-level input voltage
−0.5
-
+0.8
V
VIH
HIGH-level input voltage
2.0
-
5.5
V
IOL
LOW-level output current
VOL = 0.4 V
VDD = 2.3 V
[3]
9
-
-
mA
VDD = 3.0 V
[3]
12
-
-
mA
VDD = 5.0 V
[3]
15
-
-
mA
VDD = 2.3 V
[3]
15
-
-
mA
VDD = 3.0 V
[3]
20
-
-
mA
VDD = 5.0 V
[3]
25
-
-
mA
−1
-
+1
µA
-
2.1
5
pF
VOL = 0.7 V
ILI
input leakage current
Cio
input/output capacitance
VDD = 3.6 V; VI = 0 V or VDD
[1]
Typical limits at VDD = 3.3 V, Tamb = 25 °C.
[2]
VDD must be lowered to 0.2 V in order to reset part.
[3]
Each I/O must be externally limited to a maximum of 25 mA and the device must be limited to a maximum current of 100 mA.
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
14 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
20 %
002aac191
(1)
percent
variation
20 %
002aac192
(1)
percent
variation
0%
0%
(2)
−20 %
(3)
(2)
−20 %
(3)
−40 %
−40
−20
0
20
40
60
100
Tamb (°C)
80
−40 %
−40
−20
(1) maximum
(1) maximum
(2) average
(2) average
(3) minimum
(3) minimum
Fig 18. Typical frequency variation over process at
VDD = 2.3 V to 3.0 V
20
40
60
100
80
Tamb (°C)
Fig 19. Typical frequency variation over process at
VDD = 3.0 V to 5.5 V
PCA9553_6
Product data sheet
0
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
15 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
12. Dynamic characteristics
Table 14.
Dynamic characteristics
Symbol
Parameter
Conditions
Standard-mode
I2C-bus
Min
Max
Fast-mode I2C-bus
Min
Max
Unit
fSCL
SCL clock frequency
0
100
0
400
tBUF
bus free time between a STOP and
START condition
4.7
-
1.3
-
µs
tHD;STA
hold time (repeated) START condition
4.0
-
0.6
-
µs
tSU;STA
set-up time for a repeated START
condition
4.7
-
0.6
-
µs
tSU;STO
set-up time for STOP condition
4.0
-
0.6
-
µs
tHD;DAT
data hold time
tVD;ACK
data valid acknowledge time
tVD;DAT
data valid time
kHz
0
-
0
-
ns
[1]
-
600
-
600
ns
LOW-level
[2]
-
600
-
600
ns
HIGH-level
[2]
-
1500
-
600
ns
tSU;DAT
data set-up time
250
-
100
-
ns
tLOW
LOW period of the SCL clock
4.7
-
1.3
-
µs
tHIGH
HIGH period of the SCL clock
4.0
-
0.6
-
µs
20 +
0.1Cb[3]
300
ns
20 +
0.1Cb[3]
300
ns
rise time of both SDA and SCL signals
tr
-
1000
tf
fall time of both SDA and SCL signals
-
300
tSP
pulse width of spikes that must be
suppressed by the input filter
-
50
-
50
ns
tv(Q)
data output valid time
-
200
-
200
ns
tsu(D)
data input set-up time
100
-
100
-
ns
th(D)
data input hold time
1
-
1
-
µs
Port timing
[1]
tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA (out) LOW.
[2]
tVD;DAT = minimum time for SDA data output to be valid following SCL LOW.
[3]
Cb = total capacitance of one bus line in pF.
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
16 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
SDA
tr
tBUF
tf
tHD;STA
tSP
tLOW
SCL
tHD;STA
P
tSU;STA
tHD;DAT
S
tHIGH
tSU;DAT
tSU;STO
Sr
P
002aaa986
Fig 20. Definition of timing
protocol
START
condition
(S)
bit 7
MSB
(A7)
tSU;STA
tLOW
bit 6
(A6)
tHIGH
bit 1
(D1)
bit 0
(D0)
acknowledge
(A)
STOP
condition
(P)
1 / fSCL
SCL
tBUF
tr
tf
SDA
tHD;STA
tSU;DAT
tVD;ACK
tVD;DAT
tHD;DAT
tSU;STO
002aab285
Rise and fall times refer to VIL and VIH.
Fig 21. I2C-bus timing diagram
13. Test information
VDD
PULSE
GENERATOR
VI
VO
RL
500 Ω
VDD
open
VSS
DUT
RT
CL
50 pF
002aab880
RL = load resistor for LEDn. RL for SDA and SCL > 1 kΩ (3 mA or less current).
CL = load capacitance includes jig and probe capacitance.
RT = termination resistance should be equal to the output impedance Zo of the pulse generators.
Fig 22. Test circuitry for switching times
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
17 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
14. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
HE
v M A
Z
5
8
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
inches
0.069
0.010 0.057
0.004 0.049
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
0.05
0.01
0.01
0.004
0.028
0.012
0.244
0.039 0.028
0.041
0.228
0.016 0.024
θ
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 23. Package outline SOT96-1 (SO8)
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
18 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
D
E
SOT505-1
A
X
c
y
HE
v M A
Z
5
8
A2
pin 1 index
(A3)
A1
A
θ
Lp
L
1
4
detail X
e
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(2)
e
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
0.65
5.1
4.7
0.94
0.7
0.4
0.1
0.1
0.1
0.70
0.35
6°
0°
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-04-09
03-02-18
SOT505-1
Fig 24. Package outline SOT505-1 (TSSOP8)
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
19 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
HVSON8: plastic thermal enhanced very thin small outline package; no leads;
8 terminals; body 3 x 3 x 0.85 mm
SOT908-1
0
1
2 mm
scale
X
B
D
A
E
A
A1
c
detail X
terminal 1
index area
e1
terminal 1
index area
e
v
w
b
1
4
M
M
C
C A B
C
y1 C
y
L
exposed tie bar (4×)
Eh
exposed tie bar (4×)
8
5
Dh
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max.
A1
b
c
D(1)
Dh
E(1)
Eh
e
e1
L
v
w
y
y1
mm
1
0.05
0.00
0.3
0.2
0.2
3.1
2.9
2.25
1.95
3.1
2.9
1.65
1.35
0.5
1.5
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
OUTLINE
VERSION
SOT908-1
REFERENCES
IEC
JEDEC
JEITA
MO-229
EUROPEAN
PROJECTION
ISSUE DATE
05-09-26
05-10-05
Fig 25. Package outline SOT908-1 (HVSON8)
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
20 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
15. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
21 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 26) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 15 and 16
Table 15.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 16.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 26.
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
22 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 26. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
17. Abbreviations
Table 17.
Abbreviations
Acronym
Description
AI
Auto-Increment
CDM
Charged-Device Model
DSP
Digital Signal Processor
ESD
ElectroStatic Discharge
GPIO
General Purpose Input/Output
HBM
Human Body Model
I2C-bus
Inter-Integrated Circuit bus
I/O
Input/Output
LED
Light Emitting Diode
MCU
MicroController Unit
MM
Machine Model
MPU
MicroProcessor Unit
PCB
Printed-Circuit Board
POR
Power-On Reset
PWM
Pulse Width Modulation
SMBus
System Management Bus
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
23 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
18. Revision history
Table 18.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCA9553_6
20081229
Product data sheet
-
PCA9553_5
Modifications:
•
Table 2 “Marking codes”:
– marking code for type number PCA9553D/01 changed from “P9553/1” to “9553/1”
– marking code for type number PCA9553D/02 changed from “P9553/2” to “9553/2”
– marking code for type number PCA9553TK changed from “P53” to “P53/1”
PCA9553_5
20080422
Product data sheet
-
PCA9553_4
PCA9553_4
20060818
Product data sheet
-
PCA9553_3
PCA9553_3
(9397 750 13728)
20041001
Product data sheet
-
PCA9553_2
PCA9553_2
(9397 750 11464)
20030502
Product data
ECN 853-2397 29856
dated 2003 Apr 24
PCA9553_1
PCA9553_1
(9397 750 10859)
20021213
Product data
ECN 853-2397 29264
dated 2002 Dec 09
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
24 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
19. Legal information
19.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
19.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PCA9553_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 29 December 2008
25 of 26
PCA9553
NXP Semiconductors
4-bit I2C-bus LED driver with programmable blink rates
21. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.3.1
7.3.2
7.3.3
7.3.4
7.3.5
7.3.6
7.4
7.5
8
8.1
8.1.1
8.2
8.3
8.4
9
9.1
9.2
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
19
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Device address . . . . . . . . . . . . . . . . . . . . . . . . . 5
Control register . . . . . . . . . . . . . . . . . . . . . . . . . 5
Register descriptions . . . . . . . . . . . . . . . . . . . . 6
INPUT - Input register. . . . . . . . . . . . . . . . . . . . 6
PSC0 - Frequency Prescaler 0 . . . . . . . . . . . . . 6
PWM0 - Pulse Width Modulation 0 . . . . . . . . . . 6
PSC1 - Frequency Prescaler 1 . . . . . . . . . . . . . 7
PWM1 - Pulse Width Modulation 1 . . . . . . . . . . 7
LS0 - LED selector register. . . . . . . . . . . . . . . . 7
Pins used as general purpose I/Os . . . . . . . . . 8
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 8
Characteristics of the I2C-bus. . . . . . . . . . . . . . 8
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
START and STOP conditions . . . . . . . . . . . . . . 8
System configuration . . . . . . . . . . . . . . . . . . . . 9
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 10
Application design-in information . . . . . . . . . 11
Minimizing IDD when the I/Os are used to
control LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Programming example . . . . . . . . . . . . . . . . . . 12
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13
Static characteristics. . . . . . . . . . . . . . . . . . . . 14
Dynamic characteristics . . . . . . . . . . . . . . . . . 16
Test information . . . . . . . . . . . . . . . . . . . . . . . . 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
Handling information. . . . . . . . . . . . . . . . . . . . 21
Soldering of SMD packages . . . . . . . . . . . . . . 21
Introduction to soldering . . . . . . . . . . . . . . . . . 21
Wave and reflow soldering . . . . . . . . . . . . . . . 21
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 24
Legal information. . . . . . . . . . . . . . . . . . . . . . . 25
19.1
19.2
19.3
19.4
20
21
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 29 December 2008
Document identifier: PCA9553_6
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