Package Outline Dimensions SO-8DEP D2 D2a E2 E1 1 Exposed Pad b E 9° ( A ll sid es) Q 45° N 7° c A e D 4°±3° A1 L E0 Gauge Plane Seating Plane SO-8DEP Dim Min Max Typ A 1.40 1.50 1.45 A1 0.00 0.13 -b 0.30 0.50 0.40 c 0.15 0.25 0.20 D 4.85 4.95 4.90 D2 --2.053 D2a --1.147 E 3.80 3.90 3.85 E0 3.85 3.95 3.90 E1 5.90 6.10 6.00 E2 --2.15 e --1.27 L 0.62 0.82 0.72 N --0.35 Q 0.60 0.70 0.65 All Dimensions in mm Suggested Pad Layout SO-8DEP X3 Dimensions G1 G Y2 Y1 X1 X2 Y C C G G1 X X1 X2 X3 Y Y1 Y1 Value (in mm) 1.270 0.200 0.650 0.800 2.053 1.147 4.610 1.525 2.150 6.500 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. 2015-09-01 1 of 1 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated