EClamp2374K Datasheet

EClamp2374K
ESD/EMI Protection
for Color LCD Interfaces
PRELIMINARY
PROTECTION PRODUCTS - EMIClampTM
Description
Features
The EClampTM2374K is a low pass filter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solidstate silicon-avalanche technology for superior clamping performance and DC electrical characteristics.
They have been optimized for protection of color
LCD panels in cellular phones and other portable
electronics.
‹ Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
‹ ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
‹ Filter performance: 30dB minimum attenuation
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The device consists of four identical circuits comprised
of TVS diodes for ESD protection, and a resistor capacitor network for EMI/RFI filtering. A series
resistor value of 100Ω and a capacitance value of 10pF
are used to achieve 30dB minimum attenuation from
1.8GHz to 2.5GHz. The TVS diodes provide effective
suppression of ESD voltages in excess of ±15kV (air
discharge) and ±8kV (contact discharge) per IEC 610004-2, level 4.
1.8GHz to 2.5GHz
TVS working voltage: 5V
Resistor: 100Ω +/− 15%
Typical Capacitance: 20pF (VR = 0V)
Protection and filtering for four lines
Solid-state technology
Mechanical Characteristics
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The EClamp2374K is in a 8-pin, RoHS/WEEE compliant,
SLP1713P8 package. It measures 1.7 x 1.3 x
0.50mm. The leads are spaced at a pitch of 0.4mm
and are finished with lead-free NiPdAu. The small
package makes it ideal for use in portable electronics
such as cell phones, digital still cameras, and PDAs.
SLP1713P8 8-pin package
RoHS/WEEE Compliant
Nominal Dimensions: 1.7 x 1.3 x 0.50 mm
Lead Pitch: 0.4mm
Lead finish: NiPdAu
Marking : Marking Code
Packaging : Tape and Reel
Applications
‹ Color LCD Protection
‹ Cell Phone CCD Camera Lines
‹ Clamshell Cell Phones
Package Configuration
Circuit Diagram (Each Line)
1.70
1 2
100 Ω
IN
OUT
10pF
1.30
10pF
0.40 BSC
GND
0.50
8 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
Device Schematic (4X)
Revision 1/30/2008
1
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EClamp2374K
PRELIMINARY
PROTECTION PRODUCTS
Maximum Ratings
R ating
Symbol
Value
Units
VESD
+/- 17
+/- 12
kV
Junction Temp erature
TJ
125
o
Op erating Temp erature
Top
-40 to +85
o
Storage Temp erature
TSTG
-55 to +150
o
ESD p er IEC 61000-4-2 (Air)
ESD p er IEC 61000-4-2 (Contact)
C
C
C
Electrical Characteristics (T = 25oC)
P a r a met er
Symb ol
C on d i t i on s
Mi n i mu m
Ty p i c a l
M a xi m u m
Un i ts
5
V
10
V
0.5
μA
T VS Reverse Stand-Of f Voltage
VRWM
T VS Reverse Breakdown Voltage
VBR
It = 1mA
T VS Reverse Leakage Current
IR
VRWM = 3.0V
Total Series Resistance
R
Each Line
85
100
115
Ohms
Total Capacitance
C in
Input to Gnd,
Each Line
VR = 0V, f = 1MHz
16
20
24
pF
Total Capacitance
C in
Input to Gnd,
Each Line
VR = 2.5V, f = 1MHz
9
11
13
pF
© 2008 Semtech Corp.
2
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EClamp2374K
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics
Typical Insertion Loss S21 (Each Line)
CH1 S21
LOG
Analog Crosstalk (Each Line)
6 dB / REF 0 dB
CH1 S21
LOG
20 dB /REF 0 dB
1: -9.1473 dB
297.671 MHz
2: -19.559 dB
900 MHz
0 dB
3: -30.645 dB
1.8 GHz
-6 dB
1
-12 dB
4: -34.705 dB
2.5 GHz
-18 dB
2
-24 dB
-30 dB
3
4
-36 dB
-42 dB
-48 dB
1
MHz
100
MHz
10
MHz
1
3
GHz GHz
START. 030 MHz
STOP 3000. 000000 MHz
STOP 3000. 000000 MHz
START. 030 MHz
ESD Clamping (+8kV Contact)
ESD Clamping (-8kV Contact)
Capacitance vs. Reverse Voltage
(Normalized to 0 volts)
1.1
1
0.9
CJ(VR) / CJ(VR=0)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
f = 1 MHz
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Reverse Voltage - VR (V)
© 2008 Semtech Corp.
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EClamp2374K
PRELIMINARY
PROTECTION PRODUCTS
Device Connection
Figure 1 - Pin Identification and Configuration
(Top Side View)
The EClamp2374K is comprised of four identical
circuits each consisting of a low pass filter for EMI/RFI
suppression and dual TVS diodes for ESD protection.
The device is in a 8-pin SLP package. Electrical connection is made to the 8 pins located at the bottom of
the device. A center tab serves as the ground connection. The device has a flow through design for easy
layout. Pin connections are noted in Figure 1. All path
lengths should be kept as short as possible to minimize
the effects of parasitic inductance in the board traces.
Recommendations for the ground connection are given
below.
In 1
1
In 2
In 3
In 4
Ground Connection Recommendation
Parasitic inductance present in the board layout will
affect the filtering performance of the device. As
frequency increases, the effect of the inductance
becomes more dominant. This effect is given by
Equation 1.
8
Gnd
4
5
Out 1
Out 2
Out 3
Out 4
Pin
Identification
1-4
Inp ut Lines
5-8
Outp ut Lines
Center Tab
Ground
Equation 1: The Impedance of an Inductor at
Frequency XLF
Figure 2 - Inductance of Rectangular Wire Loops
XLF(L, f ) = 2 * π * f * L
Ground
Via 1
Where:
L= Inductance (H)
f = Frequency (Hz)
d
Signal Layer
x
Via connections to the ground plane form rectangular
wire loops or ground loop inductance as shown in
Figure 2. Ground loop inductance can be reduced by
using multiple vias to make the connection to the
ground plane. Bringing the ground plane closer to the
signal layer (preferably the next layer) also reduces
ground loop inductance. Multiple vias in the device
ground pad will result in a lower inductive ground loop
over two exterior vias. Vias with a diameter d are
separated by a distance y run between layers separated by a distance x. The inductance of the loop path
is given by Equation 2. Thus, decreasing distance x
and y will reduce the loop inductance and result in
better high frequency filter characteristics.
© 2008 Semtech Corp.
Ground
Via 2
Ground Layer
Layer
y
Equation 2: Inductance of Rectangular Wire Loop
[
LRECT(d, x , y) = 10.16 *10 −9 * x * ln
[ ] + y * ln[ ]]
2*y
d
2*x
d
Where:
d = Diameter of the wire (in)
x = Length of wire loop (in)
y = Breath of wire loop (in)
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EClamp2374K
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Figure 3 shows the recommended device layout. The
ground pad vias have a diameter of 0.008 inches
(0.20 mm) while the two external vias have a diameter
of 0.010 inches (0.250mm). The internal vias are
spaced approximately evenly from the center of the
pad. The designer may choose to use more vias with a
smaller diameter (such as 0.005 inches or 0.125mm)
since changing the diameter of the via will result in
little change in inductance (i.e. the log function in
Equation 2 in highly insensitive to parameter d) .
Figure 4 shows a typical insertion loss (S21) plot for
the device using Semtech’s filter evaluation board with
50 Ohm traces and the recommended via configuration. Figure 5 shows a typical insertion loss (S21) plot
using a similar board without the internal ground pad
vias. The result is a more inductive ground loop. Note
the “hump” at a frequency of 2.5GHz. This is the
resonant frequency of the higher ground loop inductance.
Figure 4 - Filter Characteristics Using Recommended
Layout with Internal Vias
Figure 3 - Recommended Layout Using Ground Vias
Figure 5 - Filter Characteristics Using Layout without
Internal Ground Vias
CH1 S21
LOG
6 dB / REF 0 dB
1: -9.1473 dB
297.671 MHz
2: -19.559 dB
900 MHz
0 dB
3: -30.645 dB
1.8 GHz
-6 dB
1
-12 dB
4: -34.705 dB
2.5 GHz
-18 dB
2
-24 dB
-30 dB
3
4
-36 dB
-42 dB
-48 dB
1
MHz
10
MHz
100
MHz
STOP 3000. 000000 MHz
START . 030 MHz
CH1 S21
LOG
3
1
GHz GHz
6 dB / REF 0 dB
1: -8.9400 dB
288.002 MHz
2: -20.032 dB
900 MHz
3: -23.761 dB
1.8 GHz
0 dB
4: -16.085 dB
2.5 GHz
-6 dB
1
-12 dB
4
-18 dB
2
-24 dB
3
-30 dB
-36 dB
1
MHz
START . 030 MHz
© 2008 Semtech Corp.
5
10
MHz
100
MHz
3
1
GHz GHz
STOP 3000. 000000 MHz
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EClamp2374K
PRELIMINARY
PROTECTION PRODUCTS
Applications Information - Spice Model
Line In
0.5nH
0.5nH
Line Out
EClamp2374K Spice Model
EClamp2374K Spice Parameters
© 2008 Semtech Corp.
Parameter
Unit
D1 (T VS)
D2 (T VS)
IS
Amp
2E-15
2E-15
BV
Volt
7.42
7.42
VJ
Volt
0.775
0.775
RS
Ohm
1.00
1.00
IB V
Amp
1E-3
1E-3
CJO
Farad
9.8E-12
9.8E-12
TT
sec
2.541E-9
2.541E-9
M
--
0.246
0.246
N
--
1.1
1.1
EG
eV
1.11
1.11
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EClamp2374K
PRELIMINARY
PROTECTION PRODUCTS
Outline Drawing - SLP1713P8
A
D
B
DIM
PIN 1
INDICATOR
(LASER MARK)
E
A
SEATING
PLANE
aaa C
A2
C
A1
A
A1
A2
b
D
D1
E
E1
e
L
N
aaa
bbb
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.018 .020 .022
.000 .001 .002
(.005)
.006 .008 .010
.065 .067 .070
.047 .051 .055
.049 .051 .054
.008 .012 .016
.016 BSC
.008 .010 .012
8
.003
.004
0.45 0.50 0.55
0.00 0.02 0.05
(0.13)
0.15 0.20 0.25
1.65 1.70 1.775
1.20 1.30 1.40
1.25 1.30 1.375
0.20 0.30 0.40
0.40 BSC
0.20 0.25 0.30
8
0.08
0.10
D1
1
2
LxN
E/2
E1
N
bxN
e/2
bbb
C A B
e
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP1713P8
P
X
Z
G
DIM
C
G
H
K
P
X
Y
Z
H (C)
Y
DIMENSIONS
INCHES
MILLIMETERS
(.050)
(1.27)
.027
0.69
0.30
.012
.055
1.40
.016
0.40
.008
0.20
.023
0.58
.073
1.85
K
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET
© 2008 Semtech Corp.
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EClamp2374K
PRELIMINARY
PROTECTION PRODUCTS
Marking
Ordering Information
2374K
PIN 1
INDICATOR
YYWW
Part Number
Qty per
Reel
R eel Size
EClamp 2374K.TCT
3000
7 Inch
EMIClamp and EClamp are marks of Semtech Corporation
Note: YYWW = Date Code
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
A0
1.51 +/-0.10 mm
B0
K0
1.91 +/-0.10 mm
0.66 +/-0.10 mm
Tape
Width
B, (Max)
D
D1
8 mm
4.2 mm
(.165)
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
0.8 mm
±0.05
(.031)
E
1.750±.10
mm
(.069±.004)
F
K
(MAX)
P
P0
P2
T(MAX)
W
3.5±0.05
mm
(.138±.002)
2.4 mm
(.094)
4.0±0.1
mm
(.157±.004)
4.0±0.1
mm
(.157±.004)
2.0±0.05mm
(.079±.002)
0.4 mm
(.016)
8.0 mm
+ 0.3 mm
- 0.1 mm
(.312±.012)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2008 Semtech Corp.
8
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