Process Change Notice #1106071 ____________________________________________________________________________________________________ Register today to create your account on Silabs.com. Your personalized profile allows you to receive technical document updates, new product announcements, “how-to” and design documents, product change notices (PCN) and other valuable content available only to registered users. http://www.silabs.com/profile PCN Date: 07June2011 Effective Date: 07June2011 Title: Si53x Datasheet Revision from 1.1 to 1.2 Originator: Jason Rock Phone: 512-532-5997 Dept: WL Timing Marketing Customer Contact: Kathy Haggar Phone: 512-532-5261 Dept: Sales PCN Type: Assembly Discontinuance Package Datasheet Fabrication Product Revision Packing Labeling Location Test Other Last Order Date: N/A PCN Details Description of Change: Silicon Labs is pleased to announce rev 1.2 for the Si530, Si531, Si532, Si533, Si534 devices. Please refer to Appendix A for a list of document changes and access to these datasheets online. Reason for Change: To ensure datasheets are consistent with the functionality of the Si53x devices Impact on Form, Fit, Function, Quality, Reliability: There is no impact on form, fit, function, quality or reliability Product Identification: Si530, Si531, Si532, Si533, Si534 Last Date of Unchanged Product: N/A Qualification Samples: N/A Customer Early Acceptance Sign Off: Customers may approve early PCN acceptance by completing the information below: Early Acceptance Date: Name: Company: Email your early Acceptance approval to: [email protected] Qualification Data: N/A W7206F1 Process Change Notice Form rev AA The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 1 Process Change Notice #1106071 ____________________________________________________________________________________________________ Appendix A: Si530/31 datasheet revision 1.1 to v1.2 changes: Updated 2.5 V/3.3 V and 1.8 V CML output level specifications for Table 3 on page 3. footnotes clarifying max offset frequency test conditions for Table 4 on page 4. Added CMOS phase jitter specs to Table 4 on page 4. Removed the words "Differential Modes: LVPECL/LVDS/CML" in footnote referring to AN256 in Table 4 on page 4. Separated 1.8 V, 2.5 V/3.3 V supply voltage specifications in Table 8 on page 5. Updated and clarified Table 8 on page 5 to include the "Moisture Sensitivity Level" and "Contact Pads" rows. Updated Figure 3 on page 9 and Table 12 on page 9 to reflect specific marking information. Previously, Figure 3 was generic. Added Si532 datasheet revision 1.1 to v1.2 changes: Updated 2.5 V/3.3 V and 1.8 V CML output level specifications for Table 3 on page 3. footnotes clarifying max offset frequency test conditions for Table 4 on page 4. Removed the words "Differential Modes: LVPECL/LVDS/CML" in footnote referring to AN256 in Table 4 on page 4. Added CMOS phase jitter specs to Table 4 on page 4. Updated Table 8 on page 5 to include the "Moisture Sensitivity Level" and "Contact Pads" rows. Updated Figure 3 and Table 11 on page 9 to reflect specific marking information. Previously, Figure 3 was generic. Added Si533 datasheet revision 1.1 to v1.2 changes: Updated 2.5 V/3.3 V and 1.8 V CML output level specifications for Table 3 on page 3. footnotes clarifying max offset frequency test conditions for Table 4 on page 4. Removed the words "Differential Modes: LVPECL/LVDS/CML" in footnote referring to AN256 in Table 4 on page 4. Added CMOS phase jitter specs to Table 4 on page 4. Updated Table 8 on page 5 to include the "Moisture Sensitivity Level" and "Contact Pads" rows. Updated Figure 3 and Table 10 on page 9 to reflect specific marking information. Previously, Figure 3 was generic. Updated contact information on page 12. Added Si533 datasheet revision 1.1 to v1.2 changes: Updated 2.5 V/3.3 V and 1.8 V CML output level specifications for Table 3 on page 3. footnotes clarifying max offset frequency test conditions for Table 4 on page 4. Removed the words "Differential Modes: LVPECL/LVDS/CML" in footnote referring to AN256 in Table 4 on page 4. Added CMOS phase jitter specs to Table 4 on page 4. Updated ESD HBM sensitivity rating in Table 7 on page 5. Updated Table 8 on page 5 to include the "Moisture Sensitivity Level" and "Contact Pads" rows. Updated package diagram to include crystal impedance pin in Figure 2 on page 8. Updated Figure 3 and Table 11 on page 9 to reflect specific marking information. Previously, Figure 3 was generic. Added Access to online datasheets: Si530/31 Datasheet v1.2 can be found here: http://www.silabs.com/Support%20Documents/TechnicalDocs/si530.pdf Si532 Datasheet v1.2 can be found here: http://www.silabs.com/Support%20Documents/TechnicalDocs/si532.pdf Si533 Datasheet v1.2 can be found here: http://www.silabs.com/Support%20Documents/TechnicalDocs/si533.pdf Si534 Datasheet v1.2 can be found here: http://www.silabs.com/Support%20Documents/TechnicalDocs/si534.pdf W7206F1 Process Change Notice Form rev AA The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 2