1106071 Si53x Datasheet version 1.2 std

Process Change Notice #1106071
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PCN Date: 07June2011
Effective Date: 07June2011
Title: Si53x Datasheet Revision from 1.1 to 1.2
Originator: Jason Rock
Phone: 512-532-5997
Dept: WL Timing Marketing
Customer Contact: Kathy Haggar
Phone: 512-532-5261
Dept: Sales
PCN Type:
Assembly
Discontinuance
Package
Datasheet
Fabrication
Product Revision
Packing
Labeling
Location
Test
Other
Last Order Date: N/A
PCN Details
Description of Change:
Silicon Labs is pleased to announce rev 1.2 for the Si530, Si531, Si532, Si533, Si534 devices. Please
refer to Appendix A for a list of document changes and access to these datasheets online.
Reason for Change: To ensure datasheets are consistent with the functionality of the Si53x devices
Impact on Form, Fit, Function, Quality, Reliability: There is no impact on form, fit, function,
quality or reliability
Product Identification: Si530, Si531, Si532, Si533, Si534
Last Date of Unchanged Product: N/A
Qualification Samples: N/A
Customer Early Acceptance Sign Off:
Customers may approve early PCN acceptance by completing the information below:
Early Acceptance Date:
Name:
Company:
Email your early Acceptance approval to: [email protected]
Qualification Data: N/A
W7206F1 Process Change Notice Form rev AA
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 1
Process Change Notice #1106071
____________________________________________________________________________________________________
Appendix A:
Si530/31 datasheet revision 1.1 to v1.2 changes:
 Updated
2.5 V/3.3 V and 1.8 V CML output level specifications for Table 3 on page 3.
footnotes clarifying max offset frequency test conditions for Table 4 on page 4.
 Added CMOS phase jitter specs to Table 4 on page 4.
 Removed the words "Differential Modes: LVPECL/LVDS/CML" in footnote referring to AN256 in Table 4 on page 4.
 Separated 1.8 V, 2.5 V/3.3 V supply voltage specifications in Table 8 on page 5.
 Updated and clarified Table 8 on page 5 to include the "Moisture Sensitivity Level" and "Contact Pads" rows.
 Updated Figure 3 on page 9 and Table 12 on page 9 to reflect specific marking information. Previously, Figure 3
was generic.
 Added
Si532 datasheet revision 1.1 to v1.2 changes:
 Updated
2.5 V/3.3 V and 1.8 V CML output level specifications for Table 3 on page 3.
footnotes clarifying max offset frequency test conditions for Table 4 on page 4.
 Removed the words "Differential Modes: LVPECL/LVDS/CML" in footnote referring to AN256 in Table 4 on page 4.
 Added CMOS phase jitter specs to Table 4 on page 4.
 Updated Table 8 on page 5 to include the "Moisture Sensitivity Level" and "Contact Pads" rows.
 Updated Figure 3 and Table 11 on page 9 to reflect specific marking information. Previously, Figure 3 was generic.
 Added
Si533 datasheet revision 1.1 to v1.2 changes:
 Updated
2.5 V/3.3 V and 1.8 V CML output level specifications for Table 3 on page 3.
footnotes clarifying max offset frequency test conditions for Table 4 on page 4.
 Removed the words "Differential Modes: LVPECL/LVDS/CML" in footnote referring to AN256 in Table 4 on page 4.
 Added CMOS phase jitter specs to Table 4 on page 4.
 Updated Table 8 on page 5 to include the "Moisture Sensitivity Level" and "Contact Pads" rows.
 Updated Figure 3 and Table 10 on page 9 to reflect specific marking information. Previously, Figure 3 was generic.
 Updated contact information on page 12.
 Added
Si533 datasheet revision 1.1 to v1.2 changes:
 Updated
2.5 V/3.3 V and 1.8 V CML output level specifications for Table 3 on page 3.
footnotes clarifying max offset frequency test conditions for Table 4 on page 4.
 Removed the words "Differential Modes: LVPECL/LVDS/CML" in footnote referring to AN256 in Table 4 on page 4.
 Added CMOS phase jitter specs to Table 4 on page 4.
 Updated ESD HBM sensitivity rating in Table 7 on page 5.
 Updated Table 8 on page 5 to include the "Moisture Sensitivity Level" and "Contact Pads" rows.
 Updated package diagram to include crystal impedance pin in Figure 2 on page 8.
 Updated Figure 3 and Table 11 on page 9 to reflect specific marking information. Previously, Figure 3 was generic.
 Added
Access to online datasheets:
Si530/31 Datasheet v1.2 can be found here:
http://www.silabs.com/Support%20Documents/TechnicalDocs/si530.pdf
Si532 Datasheet v1.2 can be found here:
http://www.silabs.com/Support%20Documents/TechnicalDocs/si532.pdf
Si533 Datasheet v1.2 can be found here:
http://www.silabs.com/Support%20Documents/TechnicalDocs/si533.pdf
Si534 Datasheet v1.2 can be found here:
http://www.silabs.com/Support%20Documents/TechnicalDocs/si534.pdf
W7206F1 Process Change Notice Form rev AA
The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in
part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 2
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