PIC16(L)F1508/1509 Family Silicon Errata and Data Sheet Clarification

PIC16(L)F1508/1509
PIC16(L)F1508/1509 Family
Silicon Errata and Data Sheet Clarification
The PIC16(L)F1508/1509 family devices that you have
received conform functionally to the current Device
Data Sheet (DS41609A), except for the anomalies
described in this document.
For example, to identify the silicon revision level
using MPLAB IDE in conjunction with a hardware
debugger:
1.
The silicon issues discussed in the following pages are
for silicon revisions with the Device and Revision IDs
listed in Table 1. The silicon issues are summarized in
Table 2.
2.
3.
The errata described in this document will be addressed
in future revisions of the PIC16(L)F1508/1509 silicon.
4.
Note:
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated in the last column of
Table 2 apply to the current silicon
revision (A2).
Using the appropriate interface, connect the
device to the hardware debugger.
Open an MPLAB IDE project.
Configure the MPLAB IDE project for the
appropriate device and hardware debugger.
Based on the version of MPLAB IDE you are
using, do one of the following:
a) For MPLAB IDE 8, select Programmer >
Reconnect.
b) For MPLAB X IDE, select Window >
Dashboard and click the Refresh Debug
Tool Status icon (
).
Depending on the development tool used, the
part number and Device Revision ID value
appear in the Output window.
5.
Data Sheet clarifications and corrections start on page
5, following the discussion of silicon issues.
The silicon revision level can be identified using the
current version of MPLAB® IDE and Microchip’s
programmers, debuggers, and emulation tools, which
are available at the Microchip corporate web site
(www.microchip.com).
TABLE 1:
Note:
If you are unable to extract the silicon
revision level, please contact your local
Microchip sales office for assistance.
The DEVREV values for the various PIC16(L)F1508/
1509 silicon revisions are shown in Table 1.
SILICON DEVREV VALUES
Device ID<13:0>
Part Number
Device ID<8:0>(1)
REV<4:0> Silicon Revision(2)
A0
A2
PIC16F1508
10 1101 001
0 0000
0 0010
PIC16LF1508
10 1101 111
0 0000
0 0010
PIC16F1509
10 1101 010
0 0000
0 0010
PIC16LF1509
10 1110 000
0 0000
0 0010
Note 1:
2:
The Device ID is located in the configuration memory at address 8006h.
Refer to the “PIC12(L)F1501/PIC16(L)F150X Memory Programming Specification” (DS41573) for detailed
information on Device and Revision IDs for your specific device.
 2012-2013 Microchip Technology Inc.
DS80536D-page 1
PIC16(L)F1508/1509
TABLE 2:
SILICON ISSUE SUMMARY
Module
Feature
Item
Number
Issue Summary
Affected
Revisions(1)
A0
Oscillator
HFINTOSC Ready/Stable bit
1.1
Bits remained set to ‘1’ after
initial trigger.
Oscillator
Clock Switching
1.2
Clock switching fails.
X
Oscillator
Oscillator Start-up Timer
(OST) bit
1.3
OST bit remains set.
X
Low-Dropout (LDO) Voltage
Regulator
Low-Power Sleep mode
2.1
Unexpected Resets may
occur at ambient
temperatures below 0C.
X
Fixed Voltage Reference
(FVR)
Gain Amplifier Output
3.1
Use of FVR module can
cause device Reset.
X
Note 1:
A2
X
X
Only those issues indicated in the last column apply to the current silicon revision.
DS80536D-page 2
 2012-2013 Microchip Technology Inc.
PIC16(L)F1508/1509
Silicon Errata Issues
Note:
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated by the shaded column in
the following tables apply to the current
silicon revision (A2).
1. Module: Oscillator
1.1 OSCSTAT bits: HFIOFR and HFIOFS
When HFINTOSC is selected, the HFIOFR and
HFIOFS bits will become set when the oscillator
becomes ready and stable. Once these bits are set
they become “stuck”, indicating that HFINTOSC is
always ready and stable. If the HFINTOSC is
disabled, the bits fail to be cleared.
1.3 Oscillator Start-up Timer (OST) bit
During the Two-Speed Start-up sequence, the
OST is enabled to count 1024 clock cycles. After
the count is reached, the OSTS bit is set, the
system clock is held low until the next falling edge
of the external crystal (LP, XT or HS mode), before
switching to the external clock source.
When an external oscillator is configured as the
primary clock and Fail-Safe Clock mode is enabled
(FCMEN = 1), any of the following conditions will
result in the Oscillator Start-up Timer (OST) failing
to restart:
• MCLR Reset
• Wake from Sleep
• Clock change from INTOSC to Primary Clock
Work around
This anomaly will manifest itself as a clock failure
condition for external oscillators which take longer
than the clock failure time-out period to start.
None.
Work around
Affected Silicon Revisions
A0
A2
Affected Silicon Revisions
A0
X
1.2 Clock Switching
When switching clock sources between an
INTOSC clock source and an external clock
source, one corrupted instruction may be
executed after the switch occurs.
This issue affects Two-Speed Start-up and Fail-Safe
Clock Monitor operation.
Work around
When clock switching from an external oscillator
clock source, first switch to 16 MHz HFINTOSC.
Once running at 16 MHz HFINTOSC, configure
IRCF to run at desired frequency.
When clock switching from an INTOSC to an
external oscillator clock source, first switch from
desired INTOSC frequency to HFINTOSC
High-Power mode (8 MHz or 16 MHz). Once
running from HFINTOSC, switch to the external
oscillator clock source.
Affected Silicon Revisions
A0
None.
A2
X
 2012-2013 Microchip Technology Inc.
A2
X
2. Module: Low-Dropout (LDO) Voltage
Regulator
2.1 Low-Power Sleep mode
Temperatures Below 0C
at
Ambient
Under the following conditions:
• ambient temperatures below 0C
• while in Sleep mode
• VREGCON configured for Low-Power Sleep
mode (VREGPM = 1)
On very rare occasions, the LDO voltage will drop
below the minimum VDD, causing unexpected
device Resets.
Work around
For applications that operate at ambient
temperatures below 0C, use the LDO voltage
regulator in Normal-Power mode (VREGPM = 0).
Affected Silicon Revisions
A0
A2
X
X
DS80536D-page 3
PIC16(L)F1508/1509
3. Module: Fixed Voltage Reference (FVR)
3.1 Gain Amplifier Output
When using the FVR module, if the gain amplifier
outputs are set via the CDAFVR or ADFVR bits in
FVRCON while the module is disabled (FVREN =
0), the internal oscillator frequency may shift,
device current consumption can increase, and a
Brown-out Reset may occur.
Work around
Set the FVREN bit of FVRCON to enable the
module prior to adjusting the amplifier output
selections with the CDAFVR and ADFVR bits. If
switching from the 4x output setting to the 1x
output setting, select the 2x output setting as an
intermediary step. Always set the amplifier output
selections to off (’00’) before disabling the FVR
module.
Affected Silicon Revisions
A0
A2
X
DS80536D-page 4
 2012-2013 Microchip Technology Inc.
PIC16(L)F1508/1509
Data Sheet Clarifications
The following typographic corrections and clarifications
are to be noted for the latest version of the device data
sheet (DS41609A):
Note:
Corrections are shown in bold. Where
possible, the original bold text formatting
has been removed for clarity.
1. Module: Oscillator
5.5 Fail-Safe Clock Monitor
5.5.3
FAIL-SAFE CONDITION CLEARING
The Fail-Safe condition is cleared after a Reset,
executing a SLEEP instruction or changing the
SCS bits of the OSCCON register. When the SCS
bits are changed, the OST is restarted. While the
OST is running, the device continues to operate
from the INTOSC selected in OSCCON. When the
OST times out, the Fail-Safe condition is cleared
after successfully switching to the external
clock source. The OSFIF bit should be cleared
prior to switching to the external clock source.
If the Fail-Safe condition still exists, the OSFIF
flag will again become set by hardware.
2. Module: Electrical Specifications
29.8 AC Characteristics: PIC16(L)F1508/9
TABLE 29-2:
OSCILLATOR PARAMETERS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature
-40°C TA +125°C
Param.
No.
OS08
Sym.
Characteristic
Freq.
Tolerance
Min.
Typ†
Max.
Units
—
MHz
VDD = 3.0V at 25°C (Note 2)
(Note 3)
HFOSC
Internal Calibrated HFINTOSC
Frequency(1)
±2%
—
16.0
OS09
LFOSC
Internal LFINTOSC Frequency
—
—
31
—
kHz
OS10*
TIOSC ST HFINTOSC
Wake-up from Sleep Start-up Time
—
—
5
15
s
Conditions
*
†
These parameters are characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as
possible. 0.1 F and 0.01 F values in parallel are recommended.
2: See Figure 29-3, HFINTOSC Frequency Accuracy over Device VDD and Temperature, Figure 30-73, HFINTOSC
Accuracy Over Temperature, VDD = 1.8V, PIC16LF1508/9 Only, and Figure 30-74, HFINTOSC Accuracy Over
Temperature, 2.3V  VDD 5.5V.
3: See Figure 30-71, LFINTOSC Frequency over VDD and Temperature, PIC16LF1508/9 Only, and Figure 30-72,
LFINTOSC Frequency over VDD and Temperature, PIC16F1508/9.
Figure 29-3 and Figures 30-71 through 30-74 were
added for Table 29-2 reference.
 2012-2013 Microchip Technology Inc.
DS80536D-page 5
PIC16(L)F1508/1509
FIGURE 29-3:
HFINTOSC FREQUENCY ACCURACY OVER DEVICE VDD AND TEMPERATURE
125
±12%
85
Temperature (°C)
-4.5% to +7%
60
±4.5%
25
0
±12%
-40
1.8
2.0
2.3 2.5
3.0
3.5
4.0
4.5
5.0
5.5
VDD (V)
DS80536D-page 6
 2012-2013 Microchip Technology Inc.
PIC16(L)F1508/1509
30.0 DC and AC Characteristics Graphs and Charts
FIGURE 30-71:
LFINTOSC FREQUENCY OVER VDD AND TEMPERATURE,
PIC16LF1508/1509 ONLY
36
34
Max.
Frequency (kHz)
32
30
Typical
28
Min.
26
24
Max: Typical + 3 (-40°C to +125°C)
Typical: statistical mean @ 25°C
Min: Typical - 3 (-40°C to +125°C)
22
20
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
VDD (V)
FIGURE 30-72:
LFINTOSC FREQUENCY OVER VDD AND TEMPERATURE,
PIC16F1508/1509 ONLY
36
34
Max.
Frequency (kHz)
32
30
Typical
28
26
Min.
24
Max: Typical + 3 (-40°C to +125°C)
Typical: statistical mean @ 25°C
Min: Typical - 3 (-40°C to +125°C)
22
20
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (V)
 2012-2013 Microchip Technology Inc.
DS80536D-page 7
PIC16(L)F1508/1509
FIGURE 30-73:
HFINTOSC ACCURACY OVER TEMPERATURE, VDD = 1.8V
PIC16LF1508/1509 ONLY
8%
6%
Max: Typical + 3
Typical: statistical mean
Min: Typical - 3
Accuracy (%)
4%
Max.
2%
0%
Typical
-2%
-4%
Min.
-6%
-8%
-10%
-60
-40
-20
0
20
40
60
80
100
120
140
Temperature (°C)
FIGURE 30-74:
HFINTOSC ACCURACY OVER TEMPERATURE, 2.3V  VDD 5.5V
8%
6%
Max: Typical + 3
Typical: statistical mean
Min: Typical - 3
Accuracy (%)
4%
Max.
2%
Typical
0%
-2%
Min.
-4%
-6%
-8%
-10%
-60
-40
-20
0
20
40
60
80
100
120
140
Temperature (°C)
DS80536D-page 8
 2012-2013 Microchip Technology Inc.
PIC16(L)F1508/1509
APPENDIX A:
DOCUMENT
REVISION HISTORY
Rev A Document (02/2012)
Initial release of this document.
Rev B Document (06/2012)
Added MPLAB X IDE; Updated Module 1.2.
Data Sheet Clarifications:
Added Module 2: Electrical Specifications/
AC Characteristics.
Rev C Document (07/2012)
Added Modules 2 and 3.
Rev D Document (01/2013)
Added Silicon Revision A2.
Data Sheet Clarifications:
Updated Module 2, Electrical Specifications.
 2012-2013 Microchip Technology Inc.
DS80536D-page 9
PIC16(L)F1508/1509
NOTES:
DS80536D-page 10
 2012-2013 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
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OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
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conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
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ISBN: 9781620769829
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DS80536D-page 11
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DS80536D-page 12
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