17 215 Y2C P9Q2S1B0E 3T AM

SMD B
17-215-Y2C-P9Q2S1B0E-3T-AM
Features
•RoHS compliant
•Chip LED package.
•Colorless clear resin.
•Wide viewing angle 130°.
•Brightness: 90 to 224 mcd at 20mA.
•Qualification according to AEC-Q101.
•Precondition: Bases on JEDEC J-STD 020 Level 3.
•Automotive reflow profile (IR reflow or wave soldering)
Applications
•Automotive backlighting or indicator: Dashboard, switch, audio and video equipments…etc.
•Backlight: LCD, switches, symbol, mobile phone and illuminated advertising.
•Display for indoor and outdoor application.
•Ideal for coupling into light guides.
•Substitution of traditional light.
•Optical indicator.
•General applications.
1
Copyright © 2010, Everlight All Rights Reserved. Release Date :May.28.2013. Issue No: DSE-0005984
Rev.2
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DATASHEET
SMD B
17-215-Y2C-P9Q2S1B0E-3T-AM
Device Selection Guide
Chip
Materials
AlGaInP
Emitted Color
Resin Color
Brilliant Yellow
Water Clear
Absolute Maximum Ratings (Ta=25℃
℃)
Parameter
Symbol
Rating
Unit
Reverse Voltage
VR
12
V
Forward Current
IF
25
mA
IFP
60
mA
Power Dissipation
Pd
60
mW
Junction Temperature
Tj
125
Operating Temperature
Topr
-40 ~ +100
Storage Temperature
Tstg
-40 ~ +110
Rth J-A
800
K/W
Rth J-S
450
K/W
ESD
ESDHBM
2000
V
(Classification acc. AEC Q101)
ESDMM
200
V
Soldering Temperature
Tsol
Peak Forward Current
(Duty 1/10 @1KHz)
Thermal Resistance
2
℃
℃
℃
℃ for 30 sec.
Hand Soldering : 350 ℃ for 3 sec.
Reflow Soldering : 260
Copyright © 2010, Everlight All Rights Reserved. Release Date :May.28.2013. Issue No: DSE-0005984
Rev.2
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DATASHEET
SMD B
17-215-Y2C-P9Q2S1B0E-3T-AM
Electro-Optical Characteristics (Ta=25℃
℃)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Luminous Intensity
Iv
90
-----
224
mcd
IF=20mA
Viewing Angle
2θ1/2
-----
130
-----
deg
IF=20mA
Peak Wavelength
λp
-----
591
-----
nm
IF=20mA
Dominant Wavelength
λd
584
----
596
nm
IF=20mA
Spectrum Radiation Bandwidth
∆λ
-----
15
-----
nm
IF=20mA
Forward Voltage
VF
1.75
----
2.35
V
IF=20mA
Reverse Current
IR
-----
-----
10
µA
VR=12V
Temperature coefficient of λp
TCλp
-----
0.06
-----
nm/K
IF=20mA
Temperature coefficient of λd
TCλd
-----
0.4
-----
nm/K
IF=20mA
Temperature coefficient of VF
TCV
-----
-2.3
-----
mV/K
IF=20mA
Note:
1. Tolerance of Luminous Intensity: ±11%
2. Tolerance of Dominant Wavelength: ±1nm
3. Tolerance of Forward Voltage: ±0.1V
Bin Range of Luminous Intensity
Bin Code
Min.
Max.
Unit
Condition
Q2
R1
R2
S1
90
112
140
180
112
140
180
224
mcd
IF =20mA
Note:
Tolerance of Luminous Intensity: ±11%
Bin Range of Dominant Wavelength
Bin Code
Min.
Max.
Unit
Condition
1
2
3
584
588
592
588
592
596
nm
IF =20mA
Note:
Tolerance of Dominant Wavelength: ±1nm
C
3
Copyright © 2010, Everlight All Rights Reserved. Release Date :May.28.2013. Issue No: DSE-0005984
Rev.2
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DATASHEET
SMD B
17-215-Y2C-P9Q2S1B0E-3T-AM
Typical Electro-Optical Characteristics Curves
Relative Intensity (%)
Typical Curve of Spectral Distribution
λp (nm)
Note: V(λ)=Standard eye response curve; IF =20mA
Diagram Characteristics of Radiation
20
30
60
70
80
90
10
o
0
o
1 .0
o
o
0 .8
o
0 .6
o
0 .4
o
0 .2
o
o
1 .0
Relative Intensity
50
View Angle
Relative Intensity (%)
40
o
0 .8
0 .6
0 .4
0 .2
0
20
R e la t iv e I n t e n s ity
o
o
60
40
V ie w A n g le
o
80
o
0
Relative Intensity
4
Copyright © 2010, Everlight All Rights Reserved. Release Date :May.28.2013. Issue No: DSE-0005984
Rev.2
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DATASHEET
SMD B
17-215-Y2C-P9Q2S1B0E-3T-AM
Dominant Wavelength vs. Forward Current
(Ta=25℃)
Forward Current (mA)
Dominant Wavelength (nm)
Forward Current vs. Forward Voltage
(Ta=25℃)
Forward Voltage (V)
Forward Current (mA)
Relative Luminous Intensity vs. Forward
Current (Ta=25℃)
Max. Permissible Forward Current
(Ta=25℃)
Forward Current (mA)
Relative Luminous Intensity
10.00
1.00
0.10
1
10
Forward Current (mA)
5
100
Temperature (
Copyright © 2010, Everlight All Rights Reserved. Release Date :May.28.2013. Issue No: DSE-0005984
Rev.2
℃)
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DATASHEET
SMD B
17-215-Y2C-P9Q2S1B0E-3T-AM
Relative Luminous Intensity vs.
Junction Temperature
Relative Forward Voltage
Relative Luminous Intensity
Relative Forward Voltage vs.
Junction Temperature
Junction Temperature (
℃)
Note: f(Tj) = Iv / Iv(25℃); IF =20mA
6
Junction Temperature (
℃)
Note: △VF = VF -VF(25 ℃) = f(Tj); IF =20mA
Copyright © 2010, Everlight All Rights Reserved. Release Date :May.28.2013. Issue No: DSE-0005984
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DATASHEET
SMD B
17-215-Y2C-P9Q2S1B0E-3T-AM
Package Dimension
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
7
Copyright © 2010, Everlight All Rights Reserved. Release Date :May.28.2013. Issue No: DSE-0005984
Rev.2
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DATASHEET
SMD B
17-215-Y2C-P9Q2S1B0E-3T-AM
Moisture Resistant Packing Materials
Label Explanation
Label Explanation
․CPN: Customer’s Product Number
․P/N: Product Number
․QTY: Packing Quantity
․CAT: Luminous Intensity Rank
․HUE: Dom. Wavelength Rank
․REF: Forward Voltage Rank
․LOT No: Lot Number
Reel Dimensions
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
8
Copyright © 2010, Everlight All Rights Reserved. Release Date :May.28.2013. Issue No: DSE-0005984
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DATASHEET
SMD B
17-215-Y2C-P9Q2S1B0E-3T-AM
Carrier Tape Dimensions: Loaded Quantity 3000 pcs Per Reel
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
Moisture Resistant Packing Process
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
9
Copyright © 2010, Everlight All Rights Reserved. Release Date :May.28.2013. Issue No: DSE-0005984
Rev.2
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DATASHEET
SMD B
17-215-Y2C-P9Q2S1B0E-3T-AM
Precautions for Use
1. Soldering
Condition (Reference: IPC/JEDEC J-STD-020D)
(A)IR reflow
300
℃
℃
℃
Temperature(℃)
℃
200
℃
max. 260
245
255
240
217
250
max. 30s
150
max. 100s
max. 120s
100
50
max. Ramp Up 3
℃ /s
max. Ramp Down 6
℃ /s
0
0
50
100
150
200
250
300
Times(s)
(B) Recommend soldering pad
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
10
Copyright © 2010, Everlight All Rights Reserved. Release Date :May.28.2013. Issue No: DSE-0005984
Rev.2
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DATASHEET
SMD B
17-215-Y2C-P9Q2S1B0E-3T-AM
2. Current limiting
A resistor should be used to limit current spikes that can be caused by voltage fluctuations. Otherwise
damage could occur.
3. Storage
3.1 Moisture proof bag should only be opened immediately prior to usage.
3.2 Environment should be less than 30℃ and 60% RH when moisture proof bag is opened.
3.3 After opening the package MSL Conditions stated on page 1 of this spec should not be exceeded.
3.4 If the moisture sensitivity card indicates higher than acceptable moisture, the component should be baked
at min. 60deg +/-5deg for 24 hours.
4. Iron Soldering
Hand soldering is not recommended for regular production. These guidelines are for rework only. Soldering
iron tip should contact each terminal no more than 3 sec at 350℃, using soldering iron with nominal power
less than 25W. Allow min. 2 sec. between soldering intervals.
5. Usage
Do not exceed the values given in this specification.
Application Restrictions
1. High reliability applications such as military/aerospace, automotive safety/security systems, and medical
equipment may require different product. If you have any concerns, please contact Everlight before using
this product in your application. This specification guarantees the quality and performance of the product as
an individual component. Do not use this product beyond the specification described in this document.
Revision History:
Rev.
Modified date
File modified contents
1
2011/11/8
New Spec
2
2013/5/28
Change Release
11
Copyright © 2010, Everlight All Rights Reserved. Release Date :May.28.2013. Issue No: DSE-0005984
Rev.2
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