EVERLIGHT 15-21-Y2C-A0P1Q2B0E-2T-AM

Technical Data Sheet
1206 Package Chip LED
Preliminary
15-21-Y2C-A0P1Q2B0E-2T-AM
Lead (Pb) Free Product - RoHS Compliant
Feature
‧
‧
‧
‧
‧
‧
‧
‧
RoHS compliant.
Chip LED package.
Colorless clear resin.
Wide viewing angle 130o.
Brightness: 45 to 112 mcd at 20mA.
Qualification according to AEC-Q101.
Precondition: Bases on JEDEC J-STD 020 Level 3.
Automotive reflow profile (IR reflow or wave soldering))
This is a preliminary specification
intended for design purposes and
subject to change without prior
notice.
Applications
‧
‧
‧
‧
‧
‧
‧
Automotive backlighting or indicator: Dashboard, switch, audio and video equipments… etc.
Backlight: LCD, switches, symbol, mobile phone and illuminated advertising.
Display for indoor and outdoor application.
Ideal for coupling into light guides.
Substitution of traditional light.
Optical indicator.
General applications.
Device Selection Guide
Chip
Emitted Color
Resin Color
Brilliant Yellow
Water Clear
Material
AlGaInP
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DeviceNo.:DSE-0001969
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Expired Period: 3 Months
Technical Data Sheet
1206 Package Chip LED
Preliminary
15-21-Y2C-A0P1Q2B0E-2T-AM
Absolute Maximum Ratings (Ta=25℃)
Unit
Parameter
Symbol
Rating
Reverse Voltage
VR
12
V
Forward Current
IF
30
mA
Peak Forward Current
(Duty 1/10 @1KHz)
IFP
60
mA
Power Dissipation
Pd
60
mW
Junction Temperature
Tj
125
℃
Operating Temperature
Topr
-40 ~ +100
℃
Storage Temperature
Tstg
-40 ~ +110
℃
Rth J-A
800
K/W
Rth J-S
450
K/W
Thermal resistance
Soldering Temperature
ESD
(Classification acc. AEC Q101)
Everlight Electronics Co., Ltd.
Tsol
Reflow Soldering : 260 ℃ for 30 sec.
Hand Soldering : 350 ℃ for 3 sec.
ESDHBM
2000
V
ESDMM
200
V
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Technical Data Sheet
1206 Package Chip LED
Preliminary
15-21-Y2C-A0P1Q2B0E-2T-AM
Electro-Optical Characteristics (Ta=25℃)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Luminous Intensity
Iv
45
-----
112
mcd
IF=20mA
Viewing Angle
2θ1/2
-----
130
-----
deg
IF=20mA
Peak Wavelength
λp
-----
591
-----
nm
IF=20mA
Dominant Wavelength
λd
585.5
----
594.5
nm
IF=20mA
Spectrum Radiation Bandwidth
Δλ
-----
15
-----
nm
IF=20mA
Forward Voltage
VF
1.75
----
2.35
V
IF=20mA
Reverse Current
IR
-----
-----
10
μA
VR=12V
Temperature coefficient of λp
TCλp
-----
0.06
-----
nm/K
IF=20mA
Temperature coefficient of λd
TCλd
-----
0.4
-----
nm/K
IF=20mA
Temperature coefficient of VF
TCV
-----
-2.3
-----
mV/K
IF=20mA
Note:
Tolerance of Luminous Intensity: ±11%
Tolerance of Dominant Wavelength: ±1nm
Tolerance of Forward Voltage: ±0.1V
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Technical Data Sheet
1206 Package Chip LED
Preliminary
15-21-Y2C-A0P1Q2B0E-2T-AM
Bin Range of Luminous Intensity
Bin Code
Min.
Max.
P1
45
56
P2
56
71
Q1
71
90
Q2
90
112
Unit
Condition
mcd
IF=20mA
Unit
Condition
nm
IF=20mA
Note
Tolerance of Luminous Intensity:±11%
Bin Range of Dominant Wavelength
Bin Code
Min.
Max.
D3
585.5
588.5
D4
588.5
591.5
D5
591.5
594.5
Note:
Tolerance of Dominant Wavelength: ±1nm
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Technical Data Sheet
1206 Package Chip LED
Preliminary
15-21-Y2C-A0P1Q2B0E-2T-AM
Typical Electro-Optical Characteristics Curves
Relative Intensity (%)
Typical curve of spectral distribution:
λp(nm)
Note: V(λ)=Standard eye response curve
Diagram characteristics of radiation
20
30
50
View Angle
60
70
80
90
10
o
0
o
1.0
o
o
0.8
o
0.6
o
0.4
o
Relative Intensity
40
o
0.2
o
o
0
1.0
0.8
0.6
0.4
0.2
0
20
o
40
o
60
o
80
o
Relative Intensity
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Technical Data Sheet
1206 Package Chip LED
Preliminary
15-21-Y2C-A0P1Q2B0E-2T-AM
Dominant Wavelength vs. Forward Current
(Ta=25℃)
Forward Current (mA)
Dominant Wavelength (nm)
Forward Current vs. Forward Voltage
(Ta=25℃)
Forward Voltage (V)
Forward Current (mA)
Relative Luminous Intensity vs.Forward
Current (Ta=25℃)
Forward current vs. Ambient and Solder
Temperature
40.0
10.00
Forward Current (mA)
Relative Luminous Intensity
35.0
1.00
0.10
30.0
TS
25.0
TA
20.0
15.0
10.0
5.0
0.0
0.0
0.01
1
10
100
Forward Current (mA)
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20.0 40.0 60.0 80.0 100.
0
Temperature (℃)
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DeviceNo.:DSE-0001969
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Technical Data Sheet
1206 Package Chip LED
Preliminary
15-21-Y2C-A0P1Q2B0E-2T-AM
Relative Luminous Intensity vs.
Relative Forward Voltage vs.
Junction Temperature
Relative Forward Voltage
Relative Luminous Intensity
Junction Temperature
Junction Temperature (℃)
Note: f(Tj) = Iv - Iv(25℃); IF =20mA
Everlight Electronics Co., Ltd.
Junction Temperature (℃)
Note: △VF = VF /VF(25 ℃) = f(Tj); IF =20mA
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Technical Data Sheet
1206 Package Chip LED
Preliminary
15-21-Y2C-A0P1Q2B0E-2T-AM
1.4
Package Dimension
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
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Technical Data Sheet
1206 Package Chip LED
Preliminary
15-21-Y2C-A0P1Q2B0E-2T-AM
Carrier Tape Dimensions: Loaded Quantity 2000 pcs Per Reel
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
Label Explanation
․CPN: Customer’s Product Number
․P/N: Product Number
․QTY: Packing Quantity
․CAT: Luminous Intensity Rank
․HUE: Dom. Wavelength Rank
․REF: Forward Voltage Rank
․LOT No: Lot Number
Pb
EVERLIGHT
CPN :
P N : XXXXXXXXXXXXX
RoHS
XXXXXXXXXXXXX
CAT : XXX
HUE : XXX
REF : XXX
QTY : XXX
LOT NO : XXXXXXXXXX
Reference : XXXXXXXX
MADE IN TAIWAN
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Technical Data Sheet
1206 Package Chip LED
Preliminary
15-21-Y2C-A0P1Q2B0E-2T-AM
Reel Dimensions
Label
Note: Unit = mm
Moisture Resistant Packaging Process and Materials
Label
Aluminum moisture-proof bag
Everlight Electronics Co., Ltd.
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Desiccant
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Technical Data Sheet
1206 Package Chip LED
Preliminary
15-21-Y2C-A0P1Q2B0E-2T-AM
Precautions for Use
1. Soldering Condition (Reference: IPC/JEDEC J-STD-020D)
a. IR reflow
300
Temperature(℃)
max. 260℃
245℃
255℃
240℃
217℃
250
200
max. 30s
150
max. 100s
max. 120s
100
50
max. Ramp Up 3 ℃ /s
max. Ramp Down 6 ℃ /s
0
0
50
100
150
200
250
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Rev.:
300
Times(s)
b. Wave soldering reflow
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Technical Data Sheet
1206 Package Chip LED
Preliminary
15-21-Y2C-A0P1Q2B0E-2T-AM
1.4
(B) Recommend soldering pad
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
2. Current limiting
A resistor should be used to limit current spikes that can be caused by voltage fluctuations.
Otherwise damage could occur.
3. Storage
3.1 Moisture proof bag should only be opened immediately prior to usage.
3.2 Environment should be less than 30℃ and 60% RH when moisture proof bag is opened.
3.3 After opening the package MSL Conditions stated on page 1 of this spec should not be
exceeded.
3.4 If the moisture sensitivity card indicates higher than acceptable moisture, the component should
be baked at min. 60deg +/-5deg for 24 hours.
4. Iron Soldering
Hand soldering is not recommended for regular production. These guidelines are for rework only.
Soldering iron tip should contact each terminal no more than 3 sec at 350℃, using soldering iron
with nominal power less than 25W. Allow min. 2 sec. between soldering intervals.
5. Usage
Do not exceed the values given in this specification.
Application Restrictions
1. High reliability applications such as military/aerospace, automotive safety/security systems, and
medical equipment may require different product. If you have any concerns, please contact
Everlight before using this product in your application. This specification guarantees the quality
and performance of the product as an individual component. Do not use this product beyond the
specification described in this document.
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DeviceNo.:DSE-0001969
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Release Date:2009-08-06 16:47:37.0
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Technical Data Sheet
1206 Package Chip LED
Preliminary
15-21-Y2C-A0P1Q2B0E-2T-AM
Revision History:
Rev.
Modified date
File modified contents
1
2009/8/3
New Spec
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