CONSTITUTION MATERIALS LIST Datasheet The RoHS directive, REACH regulation, and other laws and regulations related to the management of environmentally hazardous substances come into effect. When developing products, the global environmental load must be considered. ROHM pursues green procurement and endeavors to increase the detection accuracy of chemicals contained in parts and procured materials while at the same time placing great importance on the internal chemical management system that was built to ensure that no prohibited substances are procured, used, or shipped in order to provide a steady supply of worry-free products. TR-MPT3-JE_Rev.5 Type Part No. Package JEDEC (JEITA) Mass (mg) MPT3 SOT-89 (SC-62) 55.0000 Transistor Part Name № 1 Mold compound Weight (mg) 25.0470 CAS № Weight (mg) Portion vs. Products Portion vs. Part Name Silica (crystalline) 14808-60-7 18.2529 33.19% 72.87% Epoxy resin 29690-82-2 3.8027 6.91% 15.18% Phenol-formaldehyde resin 9003-35-4 1.9013 3.46% 7.59% Epoxy resin bromide 68541-56-0 0.5070 0.92% 2.02% Antimony trioxide 1309-64-4 0.5070 0.92% 2.02% - 0.0761 0.14% 0.30% Substance Name Organic phosphorus compounds Subtotal 2 Lead frame (Base material) 27.9450 25.0470 7440-50-8 27.3023 49.64% 97.70% Iron (Fe) 7439-89-6 0.6427 1.17% 2.30% 3 Lead frame (Surface treatment) 0.2400 Silver (Ag) 4 External plating 0.7640 27.9450 Tin (Sn) 7440-31-5 0.7487 1.36% 98.00% Copper (Cu) 7440-50-8 0.0153 0.03% 2.00% Silicon (Si) 7440-21-3 0.6329 1.15% 98.58% Nickel (Ni) 7440-02-0 0.0050 0.01% 0.79% Silver (Ag) 7440-22-4 0.0030 0.01% 0.47% 7440-57-5 0.0010 0.00% 0.16% 0.2400 Gold (Au) 0.7640 Subtotal 6 Die attach 0.3120 0.6420 Bonding wire 0.0500 100.00% 0.44% 100% 1.39% 100% 1.17% 100% Lead (Pb) *1 7439-92-1 0.2980 0.54% 95.50% Tin (Sn) 7440-31-5 0.0062 0.01% 2.00% Silver (Ag) 7440-22-4 0.0078 0.01% 2.50% Subtotal 7 0.44% 100% 0.2400 Subtotal 0.6420 50.81% 7440-22-4 Subtotal Die 100% Copper (Cu) Subtotal 5 45.54% 0.3120 7440-57-5 Gold (Au) Subtotal Total - 0.0500 0.57% 0.09% 0.0500 0.09% 55.0000 100% 100% 100.00% 100% - Note *1 : It is exempted from the RoHS, because of the high melting point solder. Disclaimer ・All information in this document is furnished for exploratory or indicative purposes only. ・This information provides estimates of the average weights and content of component materials. and does not include impurities or metals diffused in the silicon. ・ROHM strives for the accuracy of the information, however, ROHM does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. ・ROHM may make changes to information published in this document at any time and without notice. www.rohm.com ©2014 ROHM Co., Ltd. All rights reserved 2014.4 - Rev.A