488AQ

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WQFN10, 1.4x1.8, 0.4P
CASE 488AQ-01
ISSUE C
DATE 19 JUN 2007
1
SCALE 5:1
D
ÉÉ
ÉÉ
ÉÉ
PIN 1 REFERENCE
2X
2X
0.15 C
M1
E
DETAIL A
Bottom View
(Optional)
0.15 C
B
EXPOSED Cu
A
0.10 C
0.08 C
A1
A1
A3
3
9X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
5. EXPOSED PADS CONNECTED TO DIE FLAG.
USED AS TEST CONTACTS.
EDGE OF PACKAGE
A
5
C
SEATING
PLANE
ÉÉÉ
ÉÉÉ
DIM
A
A1
A3
b
D
E
e
L
L1
M1
MOLD CMPD
A3
DETAIL B
Side View
(Optional)
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.050
0.20 REF
0.15
0.25
1.40 BSC
1.80 BSC
0.40 BSC
0.30
0.50
0.40
0.60
0.00
0.05
e/2
MOUNTING FOOTPRINT
e
1.700
0.0669
L
6
1
9X
0.563
0.0221
0.663
0.0261
10
L1
10 X
b
0.10 C A B
0.05 C
0.200
0.0079
1
NOTE 3
2.100
0.0827
0.400
0.0157
PITCH
10 X
0.225
0.0089
DOCUMENT NUMBER:
STATUS:
98AON20791D
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 - Rev. 0
http://onsemi.com
WQFN10, 1.4 X 1.8, 0.4P
1
SCALE 20:1
mm Ǔ
ǒinches
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON20791D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY EDWIN SOTO.
18 MAY 2005
A
CORRECTED DEVICE TITLE. REQ. BY EDWIN SOTO.
30 AUG 2005
B
CORRECTED SOLDERING FOOTPRINT DIMENSIONS. REQ. BY EDWIN SOTO.
17 MAR 2006
C
ADDED DETAILS A & B AND ADDED DIMENSION M1. REQ. BY EDWIN SOTO.
19 JUN 2007
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2007
June, 2007 - Rev. 01C
Case Outline Number:
488AQ
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