UTC2000 DATA SHEET (08/17/2015) DOWNLOAD

UTC2000
Basic USB Type-C Controller
TM
Highlights
Key Benefits
• Transition any existing USB Type-A design to a
USB Type-C Downstream Facing Port or any
existing Type-B design to a USB Type-C
Upstream Facing Port
• Leverage the USB Type-C reversible cable and
compact form factor
• For use with USB 2.0, USB 3.0 or USB 3.1
• Supports legacy, 1.5A, & 3.0A USB Type-C
charging profiles
• Compact 3 x 3mm 16-pin QFN package
• Commercial, industrial, and automotive extended
temperature support
• Requires minimal design effort
TM
Target Applications
•
•
•
•
•
•
•
Laptops
Desktop PCs
Monitors
USB Hubs
USB Wall Chargers
Industrial
Automotive
 2015 Microchip Technology Inc.
• USB Type-C cable connection and orientation
detection
• Orientation detection indicator for optional USB
switch control
• Powered cable detection with VCONN powered
cable supply control
• CFG_SEL pin configurable charging profiles:
- 5V Legacy DFP mode (500mA for USB 2.0,
900mA for USB 3.0/USB 3.1)
- 5V @ 1.5A DFP mode
- 5V @ 3.0A DFP mode
- UFP mode
• ENABLE pin for host/hub port control
• VMON pin monitors VBUS overvoltage conditions
• USB Type-C Audio Adapter detection and control
• OCS# fault input pin
• FAULT_IND fault indicator output pin
• Operating Voltage Range:
- 4.5V to 5.5V
• Package
- 16-pin QFN (3 x 3 x 0.9mm)
• Environmental
- Commercial temperature range
(0°C to +70°C)
- Industrial temperature range
(-40°C to +85°C)
- Extended temperature range
(-40°C to +125°C)
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UTC2000
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of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using.
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DS00001957C-page 2
 2015 Microchip Technology Inc.
UTC2000
Table of Contents
1.0 Introduction ..................................................................................................................................................................................... 4
2.0 Pin Descriptions .............................................................................................................................................................................. 7
3.0 Functional Description .................................................................................................................................................................. 11
4.0 Operational Characteristics ........................................................................................................................................................... 19
5.0 UTC2000 System Application ....................................................................................................................................................... 23
6.0 Packaging Information .................................................................................................................................................................. 33
Appendix A: Data Sheet Revision History ........................................................................................................................................... 37
The Microchip Web Site ...................................................................................................................................................................... 39
Customer Change Notification Service ............................................................................................................................................... 39
Customer Support ............................................................................................................................................................................... 39
Product Identification System ............................................................................................................................................................. 40
 2015 Microchip Technology Inc.
DS00001957C-page 3
UTC2000
1.0
INTRODUCTION
1.1
General Description
The USB Type-CTM Specification was introduced in August 2014 and substantially expands the capabilities of USB. The
key new features include:
• New Connector
- Smaller Form Factor
- 24 Pins
- Reversible Insertion
• Simplified Current Capability Marking
- Resistor-divider implementation instead of DP/DM “handshake”
The Microchip UTC2000 USB Type-C controller targets designers who wish to gain the benefits of the small, reversible
form factor and elevated charging current abilities of a USB Type-C solution while minimally impacting the overall cost
per port.
The UTC2000 USB Type-C controller is a cost-effective, simple solution that facilitates rapid migration of legacy USB
2.0/3.0 designs to the USB Type-C connector. The UTC2000 controller is designed for USB 2.0/3.0 Downstream Facing
Port (DFP) and Upstream Facing Port (UFP) applications and performs all of the necessary detection and control
required for implementing a basic USB Type-C connector. The UTC2000 features ADCs that monitor the CC1 and CC2
pins of the USB Type-C receptacle to detect various connection events.
In a DFP application, passive cables, powered cables, and USB audio adapters can all be detected. Controls for
enabling a USB +5V port power switch, VCONN 5V active cable supply, and audio adapter enable are all included. Additional features include host enable control and overcurrent detection.
In a UFP application, the UTC2000 detects a valid USB Type-C connection, the plug orientation, and the charging capability of the DFP. The UTC2000 also monitors VBUS to ensure a valid VBUS range and detected overcurrent.
The UTC2000 can operate from a single 4.5V-5.5V supply and is available in commercial, industrial and extended temperature range options.
1.2
USB Type-CTM Downstream Facing Port (DFP) Implementation Overview
A UTC2000 Implementation of a DFP minimally requires 5 major components/circuitry blocks:
•
•
•
•
Microchip UTC2000
A USB 2.0 downstream port (USB 3.0/USB 3.1 may optionally be implemented based upon system requirements)
A USB Type-C Receptacle
A 5V Port Power Controller capable of supplying the advertised current capability
(advertised with the value of Rp and the pull-up voltage)
• CC Pin Circuitry:
- Rp Pull-Up Resistors
- VCONN Control/Switching
Note:
A High-Speed or Super Speed USB switch is also recommended but optional. For USB 2.0 applications,
this component may be omitted. For USB 3.0/USB 3.1 applications, this component may only be omitted
if two USB 3.0/USB 3.1 downstream ports are dedicated for use on the USB Type-C port.
A system diagram utilizing the UTC2000 in a DFP application is shown in Figure 1-1.
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 2015 Microchip Technology Inc.
UTC2000
FIGURE 1-1:
TYPICAL DFP APPLICATION BLOCK DIAGRAM
PPC_EN
OCS#
USB
Host
5V Port
Power
Controller
USB
VBUS
USB
USB
Mux/
Switch
USB
PLUG_ORIENTATION#
ENABLE
VCONN
VCONN1_OUT#
5V
VCONN2_OUT#
Microchip
UTC2000
(DFP Mode)
Rp
Rp
CC1
CC2
1.3
Type-C Upstream Facing Port (UFP) Implementation Overview
A UTC2000 Implementation of a UFP minimally requires 4 major components/circuitry blocks:
•
•
•
•
Microchip UTC2000
A USB 2.0 upstream port (USB 3.0/USB 3.1 may optionally be implemented based upon system requirements)
A USB Type-C Receptacle
CC Pin Circuitry:
- Rd Pull-Up Resistors
Note:
A High-Speed or Super Speed USB switch is also recommended but optional. For USB 2.0 applications,
this component may be omitted. For USB 3.0/USB 3.1 applications, this component may not be omitted
unless a Microchip Hub with FlexConnect is utilized. Refer to the Microchip USB5734 USB Type-C Evaluation Board for details on implementation.
A system diagram utilizing the UTC2000 in a UFP application is shown in Figure 1-2.
 2015 Microchip Technology Inc.
DS00001957C-page 5
UTC2000
FIGURE 1-2:
TYPICAL UFP APPLICATION BLOCK DIAGRAM
Optional Protection
From OV,OC
VBUS
System Power
Current
Sense
USB
Mux/
Switch
USB
USB
USB
USB
Device
PLUG_ORIENTATION#
OCS#
CONNECTED#
VMON
LEGACY_IND#
CC1
ADC input resistors limit
leakage when unpowered
CC2
Rd
1.4
Microchip
UTC2000
(UFP Mode)
1.5A_IND#
Rd
3.0A_IND#
Glossary of Terms
TABLE 1-1:
GLOSSARY OF TERMS
Term
Definition
ADC
Analog to Digital Converter
AFE
Analog Front End
CC
Generic reference to USB Type-CTM Cable / Connector CC1/CC2 pins
DFP
Downstream Facing Port (USB Type-C Cable and Connector Specification definition)
DRP
Dual Role Port (USB Type-C Cable and Connector Specification definition)
Microchip
Microchip Technology Incorporated
POR
Power-On Reset
USB Type-C
USB Type-C Cable / Connector
UFP
Upstream Facing Port (USB Type-C Cable and Connector Specification definition)
1.5
References
• USB Type-CTM Cable and Connector Specification: http://www.usb.org/developers/docs/
Note:
USB Type-CTM and USB-CTM are trademarks of USB Implementers Forum.
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 2015 Microchip Technology Inc.
UTC2000
2.0
PIN DESCRIPTIONS
The UTC2000 pin diagram can be seen in Figure 2-1. Table 2-1 provides a pin assignment table. Pin descriptions are
provided in Section 2.2 “Pin Descriptions”.
Pin Assignments
NC
VSS
PIN ASSIGNMENTS
VDD
FIGURE 2-1:
NC
2.1
16 15 14 13
TABLE 2-1:
ENABLE
3
FAULT_IND
4
UTC2000
5
6
7
11
PLUG_ORIENTATION#
10
PPC_EN/3.0A_IND#
9
VCONN1_OUT#/1.5A_IND#
8
VCONN2_OUT#/LEGACY_IND#
2
CC1
CFG_SEL
12 VMON
CC2
1
AUDIO_ADAPTER/CONNECTED#
OCS#
PIN ASSIGNMENTS
Pin Number
Pin Name
1
OCS#
2
CFG_SEL
3
ENABLE
4
FAULT_IND
5
AUDIO_ADAPTER/CONNECTED#
6
CC2
7
CC1
8
VCONN2_OUT#/LEGACY_IND#
9
VCONN1_OUT#/1.5A_IND#
10
PPC_EN/3.0A_IND#
11
PLUG_ORIENTATION#
12
VMON
13
VSS
14
NC
15
NC
VDD
16
Note 1:
The exposed pad should be connected to VSS.
 2015 Microchip Technology Inc.
DS00001957C-page 7
UTC2000
2.2
Pin Descriptions
TABLE 2-2:
PIN DESCRIPTIONS
Name
Symbol
Buffer
Type
Description
Digital Inputs
Controller
Enable
ENABLE
IS
Active high enable signal. The UTC2000 will remain in its
default, inactive state unless this pin is asserted high.
If unused, tie this pin to VDD through a 10kΩ pull-up resistor.
Fault Input
OCS#
IS
(PU)
This active low signal is asserted by the +5V VBUS power supplying device to notify the UTC2000 when a system fault condition has occurred. Typically, this signal is used for overcurrent
or overvoltage conditions, but it can be used for any system
related failure.
All digital control outputs will revert to their default, deasserted
state when this pin is asserted. Normal operation will resume
after deassertion of this pin.
After any OCS# assertion, a fault flag will be set and the
FAULT_IND pin will assert. This flag is only cleared after a
device reset or power cycle.
If unused, this pin can be left floating.
Analog Inputs
Configuration
Selection
CFG_SEL
ADC
This analog to digital converter pin is sampled at power-on at
Vcfg_samp to place the UTC2000 in either DFP or UFP mode.
Once in UFP mode, the UTC2000 will always remain in UFP
mode and can only switch to DFP mode after a power-on reset.
Once in DFP mode, the UTC2000 can actively switch between
3.0A, 1.5A, or the default legacy (500mA USB 2.0, 900mA USB
3.0/USB 3.1) DFP modes without power cycling. When switching between DFP modes, the voltage thresholds and ranges for
connection detection on the CC1/CC2 pins are modified
accordingly.
Refer to Table 3-1 for additional details.
VBUS Voltage
Monitor
VMON
ADC
This analog to digital converter pin monitors the input voltage
on the VBUS pin of the USB receptacle.
The UTC2000 will enter the fault state and deassert all outputs
if the voltage exceeds 0.8V on the VMON pin (>6.4V on
VBUS).
A fault flag will be set and the FAULT_IND will assert after any
overvoltage occurrence. This flag is only cleared after a device
reset or power cycle.
This pin is required for UFP Modes. If unused in DFP Modes,
tie this pin to GND through a 10kΩ pull-down resistor.
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UTC2000
TABLE 2-2:
PIN DESCRIPTIONS (CONTINUED)
Name
Symbol
Buffer
Type
CC1 Monitor
CC1
ADC
Description
This analog to digital converter input pin monitors the USB
Type-CTM CC1 signal to detect various USB Type-C connections.
Refer to Table 3-1for additional details.
CC2 Monitor
CC2
ADC
This analog to digital converter input pin monitors the USB
Type-C CC2 signal to detect various USB Type-C connections.
See Table 3-1 for additional details.
Digital Outputs
+5V VBUS
Power Supply
Enable
PPC_EN
O25
DFP Modes Only. Active high output which controls the 5V
supply to VBUS. This pin only asserts when a valid USB TypeC connection is detected.
Plug
Orientation
Indicator
PLUG_ORIENTATION#
OD25
This active low output pin indicates the USB Type-C cable plug
orientation.
This pin remains high in the default unconnected state or when
an Rd pull-down resistor is detected on CC1.
The pin will assert low when an Rd pull-down resistor is
detected on CC2.
CC1 VCONN
Supply Control
VCONN1_OUT#
OD25
DFP Modes Only. Open drain, active low VCONN supply control to CC1 for supplying 5V to active cable circuitry. See
Section 3.4 “VCONN Supply Control (DFP Modes Only)” for
additional details.
CC2 VCONN
Supply Control
VCONN2_OUT#
OD25
DFP Modes Only. Open drain, active low VCONN supply control to CC2 for supplying 5V to active cable circuitry. See
Section 3.4 “VCONN Supply Control (DFP Modes Only)” for
additional details.
Audio Adapter
Indicator and
Control
AUDIO_ADAPTER
O25
DFP Modes Only. Active high pin which indicates the detection
of a USB audio adapter device. This pin is intended to control a
high speed USB and audio switch which toggles between standard USB 2.0 DP/DM Signaling and audio signaling.
Fault Indicator
FAULT_IND
O25
Active high fault indicator output. Output is asserted after an
overcurrent event on OCS# is detected. Output is deasserted
after toggling the ENABLE input pin or after a power-on reset.
Connected
State Indicator
CONNECTED#
OD25
UFP Mode Only. Open drain pin which asserts when a valid
USB Type-C connection is detected on the CC pin, and when
VBUS is within the valid voltage range.
Legacy
Charging Indicator
LEGACY_IND#
OD25
UFP Mode Only. Open drain pin which asserts low when a
valid USB Type-C connection is detected and Legacy 500mA/
900mA charging capability is detected.
1.5A Charging
Indicator
1.5A_IND#
OD25
UFP Mode Only. Open drain pin which asserts low when a
valid USB Type-C connection is detected and 1.5A USB TypeC charging capability is detected.
3.0A Charging
Indicator
3.0A_IND#
OD25
UFP Mode Only. Open drain pin which asserts low when a
valid USB Type-C connection is detected and 3.0A USB TypeC charging capability is detected.
 2015 Microchip Technology Inc.
DS00001957C-page 9
UTC2000
TABLE 2-2:
PIN DESCRIPTIONS (CONTINUED)
Name
Symbol
Buffer
Type
Power
VDD
P
Description
Power and Ground
5.0V Power Input. A minimum of one 0.1uF bypass capacitor
placed close to the pin is recommended.
The “high” level of all digital outputs will be equivalent to the
VDD supply voltage.
Ground
2.3
VSS
P
Ground. The exposed pad must also be connected to VSS/
ground.
Buffer Types
TABLE 2-3:
BUFFER TYPES
Buffer Type
Description
ADC
Analog to digital input
IS
Schmitt-triggered input
O25
OD25
P
PU
Output with 25mA sink and 25mA source
Open-drain output with 25mA sink and 25mA source
Power
100 µA (typical) internal pull-up.
Note:
Note:
Internal pull-up resistors prevent unconnected inputs from floating. Do not rely on
internal resistors to drive signals external to the device. When connected to a
load that must be pulled high, an external resistor must be added.
Refer to Section 4.3, DC Characteristics for electrical characteristics.
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UTC2000
3.0
FUNCTIONAL DESCRIPTION
This chapter describes the functional descriptions for the following device sub-systems.
•
•
•
•
•
•
•
Section 3.1, Configuration Selection
Section 3.2, DFP Modes Functional State Machine
Section 3.3, UFP Mode Functional State Machine
Section 3.4, VCONN Supply Control (DFP Modes Only)
Section 3.5, USB Audio Adapter (DFP Modes Only)
Section 3.6, UFP Mode Connection and Charging Capability Detection Indicator
Section 3.7, Connection and Disconnection Detection Debounce
3.1
Configuration Selection
The CFG_SEL pin is sampled at power-on at Vcfg_samp and the UTC2000 is placed in either UFP or DFP modes of
operation.
If the CFG_SEL pin is within one of the DFP mode ranges upon power-on, it will operate in DFP mode. While in DFP
mode, the CFG_SEL pin is constantly monitored and can be placed in any of the DFP modes at any time by the system
controller. Switching from DFP to UFP modes cannot be achieved without a power-on reset. Table 3-1 displays the voltage ranges for the DFP profile.
If the CFG_SEL pin is within the UFP mode range upon power-on, it will operate in UFP mode. For UFP designs, it is
recommended to tie CFG_SEL to VDD through a pull-up resistor to ensure that UFP mode is entered when VDD
crosses the POR threshold. Switching from UFP to DFP modes cannot be achieved without a power-on reset. Table 32 displays the voltage ranges for the UFP profile.
TABLE 3-1:
CFG_SEL
Voltage
DFP CONFIGURATION SELECTION VOLTAGE MONITORING THRESHOLDS
Profile
CC1/CC2 No
Connection Voltage
Range
CC1/CC2 Rd
Detection Voltage
Range
CC1/CC2 Ra
Detection Voltage
Range
1.2V - 1.3V
3A Capable DFP
5.0V - 2.75V
2.60V - 0.85V
0.80V - 0.00V
0.7V - 0.8V
1.5A Capable DFP
5.0V - 1.65V
1.60V - 0.45V
0.40V - 0.00V
0.0V - 0.30V
Default Legacy USB
Capable DFP
5.0V - 1.65V
1.60V - 0.25V
0.20V - 0.00V
TABLE 3-2:
UFP CONFIGURATION SELECTION VOLTAGE MONITORING THRESHOLDS
CFG_SEL
Voltage
No Connection
Voltage Range
1.75V - VDD
0.0V - 0.25V
 2015 Microchip Technology Inc.
CC1/CC2 Legacy
CC1/CC2 1.5A
CC1/CC2 3.0A
Charging Connection Charging Connection Charging Connection
Voltage Range
Voltage Range
Voltage Range
0.25V - 0.70V
0.70V-1.31V
> 1.31V
DS00001957C-page 11
UTC2000
3.2
DFP Modes Functional State Machine
A visual representation of the UTC2000 DFP state machine behavior is shown in Figure 3-1. The various states are
detailed in the following sub-sections.
FIGURE 3-1:
DFP MODES STATE MACHINE DIAGRAM
DFP Mode
Connection States
Unflipped Passive Cable
CFG_SEL = 0.0V – 0.3V (Legacy Profile)
or
CFG_SEL = 0.7V – 0.8V (1.5A Profile)
or
CFG_SEL = 1.2V –1.3V (1.5A Profile)
CC1 detects Rd
CC2 detects NC
PPC_EN = High
PLUG_ORIENTATION# = High
VCONN1_OUT# = High
VCONN2_OUT# = High
AUDIO ADAPTER = Low
Unflipped Powered Cable
CC1 detects Rd
CC2 detects Ra
Disabled Idle
PPC_EN = Low
PLUG_ORIENTATION# = High
VCONN1_OUT# = High
VCONN2_OUT# =High
AUDIO ADAPTER = Low
ENABLE
Low > High
Enabled Idle
Connection
Detected
(No Connection Detected)
ENABLE
High > Low
PPC_EN = Low
PLUG_ORIENTATION# = High
VCONN1_OUT# = High
VCONN2_OUT# =High
AUDIO ADAPTER = Low
(100ms-200ms debounce)
Connection
Lost
PPC_EN = High
PLUG_ORIENTATION# = High
VCONN1_OUT# = High
VCONN2_OUT# = Low
AUDIO ADAPTER = Low
Flipped Passive Cable
CC1 detects NC
CC2 detects Rd
(10-20ms debounce)
PPC_EN = High
PLUG_ORIENTATION# = Low
VCONN1_OUT# = High
VCONN2_OUT# = High
AUDIO ADAPTER = Low
10-20ms
debounce
change
detected,
transition
to new
state
Flipped Powered Cable
OCS# De-asserted
and/or
VMON < 0.8V
CC1 detects Ra
CC2 detects Rd
Fault
Deassert all outputs
PPC_EN = High
PLUG_ORIENTATION# = Low
VCONN1_OUT# = Low
VCONN2_OUT# = High
AUDIO ADAPTER = Low
Set FAULT_IND High
OCS# Asserted
or
VMON > 0.8V
(no debounce)
3.2.1
USB Audio Adapter
CC1 detects Ra
CC2 detects Ra
PPC_EN = Low
PLUG_ORIENTATION# = High
VCONN1_OUT# = High
VCONN2_OUT# = High
AUDIO ADAPTER = High
DISABLED IDLE
The UTC2000 will remain in a disabled, inactive state if ENABLE is asserted low, or the voltage on CFG_SEL is not
within a valid configuration range.
While in this state, the state of the digital outputs are as follows:
•
•
•
•
•
PPC_EN: Low
PLUG_ORIENTATION#: High
VCONN1_OUT#: High
VCONN2_OUT#: High
AUDIO_ADAPTER: Low
3.2.2
ENABLED IDLE
If both ENABLE is asserted high and CFG_SEL is in a valid configuration range, the UTC2000 will actively monitor the
CC1 and CC2 pins for a connect event.
While in this state, the state of the digital outputs are as follows:
•
•
•
•
•
PPC_EN: Low
PLUG_ORIENTATION#: High
VCONN1_OUT#: High
VCONN2_OUT#: High
AUDIO_ADAPTER: Low
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UTC2000
3.2.3
CONNECTED (UNFLIPPED PASSIVE CABLE)
If both ENABLE is asserted high and CFG_SEL is in a valid configuration range and an Rd pull-down resistor is sensed
on the CC1 pin, the UTC2000 will enter the “CONNECTED (UNFLIPPED PASSIVE CABLE)” state.
While in this state, the state of the digital outputs are as follows:
•
•
•
•
•
PPC_EN: High
PLUG_ORIENTATION#: High
VCONN1_OUT#: High
VCONN2_OUT#: High
AUDIO_ADAPTER: Low
3.2.4
CONNECTED (UNFLIPPED ACTIVE CABLE)
If ENABLE is asserted high, CFG_SEL is in a valid configuration range, an Rd pull-down resistor is sensed on the CC1
pin, and an Ra pull-down resistor is sensed on the CC2 pin, the UTC2000 will enter the “CONNECTED (UNFLIPPED
ACTIVE CABLE)” state.
While in this state, the state of the digital outputs are as follows:
•
•
•
•
•
PPC_EN: High
PLUG_ORIENTATION#: High
VCONN1_OUT#: High
VCONN2_OUT#: Low
AUDIO_ADAPTER: Low
3.2.5
CONNECTED (FLIPPED PASSIVE CABLE)
If both ENABLE is asserted high and CFG_SEL is in a valid configuration range and an Rd pull-down resistor is sensed
on the CC2 pin, the UTC2000 will enter the “CONNECTED (FLIPPED PASSIVE CABLE)” state.
While in this state, the state of the digital outputs are as follows:
•
•
•
•
•
PPC_EN: High
PLUG_ORIENTATION#: Low
VCONN1_OUT#: High
VCONN2_OUT#: High
AUDIO_ADAPTER: Low
3.2.6
CONNECTED (FLIPPED ACTIVE CABLE)
If ENABLE is asserted high, CFG_SEL is in a valid configuration range, an Rd pull-down resistor is sensed on the CC2
pin, and an Ra pull-down resistor is sensed on the CC1 pin, the UTC2000 will enter the “CONNECTED (UNFLIPPED
ACTIVE CABLE)” state.
While in this state, the state of the digital outputs are as follows:
•
•
•
•
•
PPC_EN: High
PLUG_ORIENTATION#: Low
VCONN1_OUT#: Low
VCONN2_OUT#: High
AUDIO_ADAPTER: Low
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DS00001957C-page 13
UTC2000
3.2.7
CONNECTED (USB AUDIO ADAPTER)
If ENABLE is asserted high, CFG_SEL is in a valid configuration range, and Ra pull-down resistors are sensed on both
CC1 and CC2 pins the UTC2000 will enter the “CONNECTED (UNFLIPPED ACTIVE CABLE)” state.
Note:
A typical USB audio adapter device will simply short CC1 and CC2 to ground. This implementation is functionally equivalent to using two Ra resistors.
While in this state, the state of the digital outs are as follows:
•
•
•
•
•
PPC_EN: Low
PLUG_ORIENTATION#: High
VCONN1_OUT#: High
VCONN2_OUT#: High
AUDIO_ADAPTER: High
3.2.8
FAULT (OVERCURRENT OR OVERVOLTAGE)
If OCS# is asserted low while in any state, the UTC2000 will set all of its outputs to the default state and will transition
into the fault state. An internal overcurrent flag will be set and FAULT_IND will drive high. Normal operation will resume
after OCS# is deasserted. The FAULT_IND pin will continue to drive low until a power cycle occurs.
If VMON exceeds 0.8V at any state, the UTC2000 will set all of its outputs to the default state and will transition into the
fault state. An internal overvoltage flag will be set and FAULT_IND will drive high. Normal operation will resume after
VMON is deasserted. The FAULT_IND pin will continue to drive low until a power cycle occurs.
DS00001957C-page 14
 2015 Microchip Technology Inc.
UTC2000
3.3
UFP Mode Functional State Machine
A visual representation of the UTC2000 UFP state machine behavior is shown in Figure 3-2. The various states are
detailed in the following sub-sections.
FIGURE 3-2:
UFP MODE STATE MACHINE DIAGRAM
UFP Mode
Connection States
0.5 < VMON < 0.6875V
CFG_SEL = 1.75V – VDD
(4.0 < VBUS < 5.5V)
Unflipped Legacy Connection
CC1 detects Legacy
CC2 detects NC
CONNECTED# = Low
PLUG_ORIENTATION# = High
LEGACY_IND# = Low
1.5A_IND# = High
3.0A_IND# = High
Unflipped 1.5A Connection
CC1 detects 1.5A
CC2 detects NC
CONNECTED# = Low
PLUG_ORIENTATION# = High
LEGACY_IND# = High
1.5A_IND# = Low
3.0A_IND# = High
Unflipped 3.0A Connection
Idle
(No Connection Detected)
CONNECTED# = High
PLUG_ORIENTATION# = High
LEGACY_IND# = High
1.5A_IND# = High
3.0A_IND# = High
Connection
Detected
(100-150ms debounce)
CC1 detects 3.0A
CC2 detects NC
Connection
Lost
(10-20ms debouce)
CONNECTED# = Low
PLUG_ORIENTATION# = High
LEGACY_IND# = High
1.5A_IND# = High
3.0A_IND# = Low
10-20ms
debounce
Flipped Legacy Connection
OCS# De-asserted
and/or
VMON < 0.8V
CC1 detects NC
CC2 detects Legacy
Fault
Deassert all outputs
Set FAULT_IND High
change
detected,
transition
to new
state
CONNECTED# = Low
PLUG_ORIENTATION# = Low
LEGACY_IND# = Low
1.5A_IND# = High
3.0A_IND# = High
Fllipped 1.5A Connection
OCS# Asserted
or
VMON > 0.8V
CC1 detects NC
CC2 detects 1.5A
(no debounce)
CONNECTED# = Low
PLUG_ORIENTATION# = Low
LEGACY_IND# = High
1.5A_IND# = Low
3.0A_IND# = High
Fllipped 3.0A Connection
CC1 detects NC
CC2 detects 3.0A
3.3.1
CONNECTED# = Low
PLUG_ORIENTATION# = Low
LEGACY_IND# = High
1.5A_IND# = High
3.0A_IND# = Low
IDLE
The UTC2000 will remain in a disabled, inactive state if ENABLE is asserted low, or the voltage on CFG_SEL is not
within a valid configuration range.
While in this state, the state of the digital outputs are as follows:
•
•
•
•
•
CONNECTED#: High (Not Asserted)
PLUG_ORIENTATION#: High (Not Asserted)
LEGACY_IND#: High (Not Asserted)
1.5A_IND#: High (Not Asserted)
3.0A_IND#: High (Not Asserted)
 2015 Microchip Technology Inc.
DS00001957C-page 15
UTC2000
3.3.2
CONNECTED (UNFLIPPED LEGACY CONNECTION)
If VBUS is in a valid range (4.5V-5.5V) and a Legacy Rp pull-up resistor is sensed on the CC1 pin (and no connection
detected on the CC2 pin) the UTC2000 will enter the “CONNECTED (UNFLIPPED LEGACY CONNECTION)” state.
While in this state, the state of the digital outputs are as follows:
•
•
•
•
•
CONNECTED#: Low (Asserted)
PLUG_ORIENTATION#: High (Not Asserted)
LEGACY_IND#: Low (Asserted)
1.5A_IND#: High (Not Asserted)
3.0A_IND#: High (Not Asserted)
3.3.3
CONNECTED (UNFLIPPED 1.5A CONNECTION)
If VBUS is in a valid range (4.5V-5.5V) and a 1.5A Rp pull-up resistor is sensed on the CC1 pin (and no connection
detected on the CC2 pin) the UTC2000 will enter the “CONNECTED (UNFLIPPED 1.5A CONNECTION)” state.
While in this state, the state of the digital outputs are as follows:
•
•
•
•
•
CONNECTED#: Low (Asserted)
PLUG_ORIENTATION#: High (Not Asserted)
LEGACY_IND#: High (Not Asserted)
1.5A_IND#: Low (Asserted)
3.0A_IND#: High (Not Asserted)
3.3.4
CONNECTED (UNFLIPPED 3.0A CONNECTION)
If VBUS is in a valid range (4.5V-5.5V) and a 3.0A Rp pull-up resistor is sensed on the CC1 pin (and no connection
detected on the CC2 pin) the UTC2000 will enter the “CONNECTED (UNFLIPPED 3.0A CONNECTION)” state.
While in this state, the state of the digital outputs are as follows:
•
•
•
•
•
CONNECTED#: Low (Asserted)
PLUG_ORIENTATION#: High (Not Asserted)
LEGACY_IND#: High (Not Asserted)
1.5A_IND#: High (Not Asserted)
3.0A_IND#: Low (Asserted)
3.3.5
CONNECTED (FLIPPED LEGACY CONNECTION)
If VBUS is in a valid range (4.5V-5.5V) and a Legacy Rp pull-up resistor is sensed on the CC2 pin (and no connection
detected on the CC1 pin) the UTC2000 will enter the “CONNECTED (FLIPPED LEGACY CONNECTION)” state.
While in this state, the state of the digital outputs are as follows:
•
•
•
•
•
CONNECTED#: Low (Asserted)
PLUG_ORIENTATION#: Low (Asserted)
LEGACY_IND#: High (Asserted)
1.5A_IND#: High (Not Asserted)
3.0A_IND#: High (Not Asserted)
DS00001957C-page 16
 2015 Microchip Technology Inc.
UTC2000
3.3.6
CONNECTED (FLIPPED L1.5A CONNECTION)
If VBUS is in a valid range (4.5V-5.5V) and a 1.5A Rp pull-up resistor is sensed on the CC2 pin (and no connection
detected on the CC1 pin) the UTC2000 will enter the “CONNECTED (FLIPPED 1.5A CONNECTION)” state.
While in this state, the state of the digital outputs are as follows:
•
•
•
•
•
CONNECTED#: Low (Asserted)
PLUG_ORIENTATION#: Low (Asserted)
LEGACY_IND#: High (Not Asserted)
1.5A_IND#: Low (Asserted)
3.0A_IND#: High (Not Asserted)
3.3.7
CONNECTED (FLIPPED 3.0A CONNECTION)
If VBUS is in a valid range (4.5V-5.5V) and a 3.0A Rp pull-up resistor is sensed on the CC2 pin (and no connection
detected on the CC1 pin) the UTC2000 will enter the “CONNECTED (FLIPPED 3.0A CONNECTION)” state.
While in this state, the state of the digital outputs are as follows:
•
•
•
•
•
CONNECTED#: Low (Asserted)
PLUG_ORIENTATION#: Low (Asserted)
LEGACY_IND#: High (Not Asserted)
1.5A_IND#: High (Not Asserted)
3.0A_IND#: Low (Asserted)
3.3.8
FAULT (OVERCURRENT OR OVERVOLTAGE)
If OCS# is asserted low while in any state, the UTC2000 will set all of its outputs to the default state and will transition
into the fault state. An internal overcurrent flag will be set and FAULT_IND will drive high. Normal operation will resume
after OCS# is deasserted. The FAULT_IND pin will continue to drive low until a reset or power cycle occurs.
If VMON exceeds 0.8V (6.4V on VBUS) at any state, the UTC2000 will set all of its outputs to the default state and will
transition into the fault state. An internal overvoltage flag will be set and FAULT_IND will drive high. Normal operation
will resume after VMON is deasserted. The FAULT_IND pin will continue to drive low until a reset or power cycle occurs.
3.4
VCONN Supply Control (DFP Modes Only)
VCONN1_OUT# and VCONN2_OUT# are open drain, active low output signals used to control a 5V voltage supply to
power a powered USB Type-C cable. Powered cable support is mandatory for all USB Type-C applications which implement USB 3.0/USB 3.1. For USB 2.0 systems, powered cable support is optional. The VCONN supply control signals
will assert low when one of the following conditions are met:
• VCONN1_OUT# will assert low if an Rd resistor is detected on CC2 and an Ra resistor is detected on CC1. The
signal will remain asserted until the Rd resistor on CC2 is no longer sensed (USB cable is detached).
• VCONN2_OUT# will assert low if an Rd resistor is detected on CC1 and an Ra resistor is detected on CC2. The
signal will remain to asserted until the Rd resistor on CC1 is no longer sensed (USB cable is detached).
3.5
Note:
USB Audio Adapter (DFP Modes Only)
Additional details for implementing Audio Adapter mode are detailed in Appendix A of the USB Type-CTM
Cable and Connector Specification.
AUDIO_ADAPTER is an active high output signal that is used to indicate when a USB audio adapter is detected.
AUDIO_ADAPTER will assert high when an Ra resistor is detected on both CC1 and CC2 pins. The signal will remain
asserted until either or both Ra resistors is no longer sensed. This signal is intended to control a high-speed switch that
toggles between USB differential data and an audio signal.The switch that is selected must be capable of supporting
USB 2.0 as well as audio signals ranging from -3.0V to +3.0V. Additional electrical details can be found in section A-3
of the USB Type-CTM Cable and Connector Specification.
 2015 Microchip Technology Inc.
DS00001957C-page 17
UTC2000
Two additional signals are also used when operating in Audio Adapter mode. These signals are Mic/AGND and AGND/
Mic which should be connected to SBU1 and SBU2 respectively.
3.6
UFP Mode Connection and Charging Capability Detection Indicator
While operating in UFP mode, there are 4 outputs that indicate connection state.
CONNECTED# is an open drain output that asserts when any of the three valid USB Type-C connections are detected.
Legacy charging mode (500mA for USB 2.0 connections, 900mA for USB 3.0/USB 3.1 connections) is detected when
a DFP with a 56k Rp pull-up resistor is detected. 1.5A charging is detected when a DFP with a 22k Rp pull-up resistor
is detected. 3.0A charging is detected when a DFP with a 10k Rp pull-up resistor is detected.
The LEGACY_IND#, 1.5A_IND#, and 3.0A_IND# open drain outputs assert low to indicate which type of connection
was detected. These outputs can be fed to the battery charging management circuitry of the USB device to appropriately
regulate the amount of current draw.
The CONNECTED# signal may also be used to gate the VBUS voltage to system power if an added level of protection
from high voltage is desired.
3.7
Connection and Disconnection Detection Debounce
A debounce is implemented to eliminate unwanted connect/disconnect events due to cable jostling or USB Power Delivery messaging.
A transition from the ENABLED IDLE state to any connected state is debounced by 100ms-200ms.
A transition from any connected state to any other connected state or from any connected state to the ENABLED IDLE
state is debounced by 10ms-20ms.
DS00001957C-page 18
 2015 Microchip Technology Inc.
UTC2000
4.0
OPERATIONAL CHARACTERISTICS
4.1
Absolute Maximum Ratings(†)
Ambient temperature under bias............................................................................................................ -40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on pins with respect to VSS
on VDD pin .................................................................................................................................. -0.3V to +6.5V
on all other pins .............................................................................................................. -0.3V to (VDD + 0.3V)
Maximum current
on VSS pin(4-1)
0°C ≤ TA ≤ +70°C ..................................................................................................................... 95 mA
-40°C ≤ TA ≤ +85°C .................................................................................................................. 85 mA
-40°C ≤ TA ≤ +125°C ................................................................................................................ 35 mA
on VDD pin(1)
0°C ≤ TA ≤ +70°C ..................................................................................................................... 95 mA
-40°C ≤ TA ≤ +85°C .................................................................................................................. 85 mA
-40°C ≤ TA ≤ +125°C ................................................................................................................ 35 mA
on any I/O pin ....................................................................................................................................... ±25 mA
Clamp current, IK (VPIN < 0 or VPIN > VDD) ......................................................................................................... ±20 mA
Note 4-1
Maximum current rating requires even load distribution across I/O pins. Maximum current rating may
be limited by the device package power dissipation characterizations.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
4.2
Standard Operating Conditions
The standard operating conditions for this device are defined as:
Operating Voltage:
Operating Temperature:
VDDMIN ≤ VDD ≤ VDDMAX
TA_MIN ≤ TA ≤ TA_MAX
VDD — Operating Supply Voltage(4-2)
VDDMIN ....................................................................................................................................... +4.5V
VDDMAX ...................................................................................................................................... +5.5V
TA — Operating Ambient Temperature Range
Commercial Temperature
TA_MIN ........................................................................................................................................... 0°C
TA_MAX ...................................................................................................................................... +70°C
Industrial Temperature
TA_MIN ........................................................................................................................................ -40°C
TA_MAX ...................................................................................................................................... +85°C
Extended Temperature
TA_MIN ........................................................................................................................................ -40°C
TA_MAX .................................................................................................................................... +125°C
Note 4-2
Refer to Parameter D001, DC Characteristics: Supply Voltage.
 2015 Microchip Technology Inc.
DS00001957C-page 19
UTC2000
4.3
DC Characteristics
TABLE 4-1:
SUPPLY VOLTAGE
Param.
No.
Sym.
D001
VDD
Characteristic
Min.
—
VPORR*
D004
SVDD
D005
VCFG_SAMP
Note 1:
Conditions
—
Vddmax
5.5
V
1.6
—
V
Power-on Reset Rearm Voltage(1)
VDD Rise Rate(2)
—
0.8
—
V
0.05
—
—
V/ms
Ensures that the Power-on
Reset signal is released
properly.
CFG_SEL Sampling Threshold Voltage
—
*
Units
Power-on Reset Release Voltage(1)
VPOR
D003
Max.
Supply Voltage
Vddmin
4.5
D002*
Typ†
3.6
—
V
These parameters are characterized but not tested.
See Figure 4-1, POR and POR REARM with Slow Rising VDD.
FIGURE 4-1:
POR AND POR REARM WITH SLOW RISING VDD
VDD
VPOR
VPORR
SVDD
VSS
NPOR(1)
POR REARM
VSS
TVLOW(3)
Note 1:
2:
3:
DS00001957C-page 20
TPOR(2)
When NPOR is low, the device is held in Reset.
TPOR 1 μs typical.
TVLOW 2.7 μs typical.
 2015 Microchip Technology Inc.
UTC2000
SUPPLY CURRENT (IDD)(1)
TABLE 4-2:
Conditions
Param.
No.
Device
Characteristics
Min.
Typ
Max.
Units
D006
Disabled
—
185
205
uA
D007
Enabled
—
185
205
uA
5.0
-40°C ≤ TA ≤ +85°C
D008
Enabled & Connected
—
1.30
1.35
mA
5.0
-40°C ≤ TA ≤ +85°C
Note 1:
VDD
Note
5.0
-40°C ≤ TA ≤ +85°C
The supply current is mainly a function of the operating voltage. Other factors, such as I/O pin loading and
switching rate also have an impact on the current consumption.
TABLE 4-3:
I/O PORTS
Standard Operating Conditions (unless otherwise stated)
Param.
No.
Sym.
Characteristic
Min.
Typ†
VIL
Max.
Units
Conditions
Input Low Voltage
I/O PORT:
D009
—
—
0.8
V
4.5V ≤ VDD ≤ 5.5V
D009A
—
—
0.15 VDD
V
3.0V ≤ VDD ≤ 4.5V
Input High Voltage
VIH
D010
2.0
—
—
V
4.5V ≤ VDD ≤ 5.5V
D010A
0.25 VDD +
0.8
—
—
V
3.0V ≤ VDD ≤ 4.5V
Input Leakage Current(1)
IIL
D011
I/O Ports
—
±5
± 125
nA
VSS ≤ VPIN ≤ VDD,
Pin at high-impedance, 85°C
—
±5
± 1000
nA
VSS ≤ VPIN ≤ VDD,
Pin at high-impedance, 125°C
V
Iol = 8 mA, Vdd = 5V
Iol = 6 mA, Vdd = 3.3V
Iol = 1.8 mA, Vdd = 1.8V
V
Ioh = 3.5 mA, Vdd = 5V
Ioh = 3 mA, Vdd = 3.3V
Ioh = 1 mA, Vdd = 1.8V
VOL
D012
Output Low Voltage
I/O Ports
—
0.6
—
Voh
D013
Output High Voltage
I/O Ports
Vdd - 0.7
—
—
Capacitive Loading Specifications on Output Pins
D014*
CIO
All I/O pins
—
—
50
pF
*
†
These parameters are characterized but not tested.
Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: Negative current is defined as current sourced by the pin.
 2015 Microchip Technology Inc.
DS00001957C-page 21
UTC2000
TABLE 4-4:
TIMING PARAMETERS
Standard Operating Conditions (unless otherwise stated)
Param. No.
Sym.
Min.
100
16
—
D018
200
ms
20
ms
VMON Fault Detection Reaction Delay
0.460
1
ms
OCS# Fault Detection Reaction Delay
tOCS#_FAULT
†
160
10
tVMON_FAULT
D017
Units
CC1/CC2 Disconnection or Connection Change Debounce Delay
tDISCONNECT_DEBOUNCE
D016
Max.
CC1/CC2 Connection Detection Debounce Delay
tCONNECT_DEBOUNCE
D015
Typ†
—
0.410
1
ms
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated.
TABLE 4-5:
THERMAL CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Param.
No.
Sym.
Characteristic
Typ.
Units
Conditions
TH01
θJA
Thermal Resistance Junction to
Ambient
55.3
°C/W
16-pin QFN 3x3x0.9mm package
TH02
θJC
Thermal Resistance Junction to
Case
10
°C/W
16-pin QFN 3x3x0.9mm package
TH03
TJMAX
Maximum Junction Temperature
150
°C
TH04
PD
Power Dissipation
—
W
PD = PINTERNAL + PI/O
TH05
Pinternal
Internal Power Dissipation
—
W
PINTERNAL = IDD x VDD(1)
TH06
PI/O
I/O Power Dissipation
—
W
PI/O = Σ (IOL * VOL) + Σ (IOH * (VDD
- VOH))
TH07
PDER
Derated Power
—
W
PDER = PDMAX (TJ - TA)/θJA(2)
Note 1:
2:
IDD is current to run the chip alone without driving any load on the output pins.
TA = Ambient Temperature; TJ = Junction Temperature
DS00001957C-page 22
 2015 Microchip Technology Inc.
UTC2000
5.0
UTC2000 SYSTEM APPLICATION
This chapter explains external requirements for UTC2000 applications and provides some example diagrams.
•
•
•
•
•
•
•
•
•
•
•
•
•
Section 5.1, 5V VBUS Switch (DFP Modes Only)
Section 5.2, Rp Pull-Up Resistor (DFP Modes Only)
Section 5.3, Rd Pull-Down Resistor (UFP Mode Only)
Section 5.4, VCONN Active Cable Supply (DFP Modes Only)
Section 5.5, CC Pin Isolation (DFP Only)
Section 5.6, CC Pin Current Limiting Resistors (UFP Only)
Section 5.7, VBUS Monitoring
Section 5.8, USB Signal Multiplexer
Section 5.9, Application Example: 3.0A Capable USB 3.0/USB 3.1 DFP
Section 5.10, Application Example: 1.5A Capable USB 2.0 DFP
Section 5.11, Application Example: 500mA Capable USB 2.0 DFP with Audio Adapter Support
Section 5.12, Application Example: 3.0A Capable USB Type-CTM Charging Port (AC Adapter)
Section 5.13, Application Example: UFP Device
5.1
5V VBUS Switch (DFP Modes Only)
A 5V USB port power switch with active high enable input and an overcurrent indicator output is required. The USB
Type-C receptacle must not supply 5V to the VBUS pins until a valid connection is detected. The UTC2000 controller
asserts the active high PPC_EN signal to control the 5V port power supply to VBUS upon detection of a valid USB TypeC connection. The port power switch controlled by the UTC2000 shall also have built in overcurrent detection set to a
threshold that is appropriate for the current capability profile that is being selected per Table 5-1. An overcurrent threshold of 125% (of the selected DFP profile current) is appropriate, as the threshold may not be tripped at any current less
than or equal to the selected current profile. The 5V VBUS port power controller should indicate that an overcurrent
event has occurred by pulling the OCS# signal to the UTC2000 controller low.
5.2
Rp Pull-Up Resistor (DFP Modes Only)
A Downstream Facing Port is required to supply voltage to both CC pins through a pull-up resistor. The pull-up voltage
may be either 5.0V volts or 3.3V. A UFP must implement a Rd pull-down resistor to ground. When a DFP to UFP connection is made, a resistor divider is formed, and the voltage at the CC pin can be measured to interpret the type of
connection. Table 5-1 describes the possible values of the Rp pull-up resistor.
Note:
A constant current source may also be implemented instead of a pull-up resistor.
TABLE 5-1:
RP PULL-UP RESISTOR VALUES
Resistor Pull-Up
to 4.75 - 5.5V
Resistor Pull-Up
to 3.3V ± 5%
Current Source
Legacy USB:
500mA USB 2.0
900mA USB 3.0/USB 3.1
56 kΩ ± 20%
36 kΩ ± 20%
80 µA ± 20%
1.5A
22 kΩ ± 5%
12 kΩ ± 5%
180 µA ± 8%
3.0A
10 kΩ ± 5%
4.7 kΩ ± 5%
330 µA ± 8%
DFP Advertisement
The UTC2000 measures the voltages on both CC pins via it’s internal ADCs. The CC pin voltage ranges, as defined in
the USB Type-CTM Cable and Connector Specification, are shown in Table 3-1.
5.3
Rd Pull-Down Resistor (UFP Mode Only)
An Upstream Facing Port is required to implement a 5.1k +/- 10% Rd pull-down resistor to ground connected to both
CC1 and CC2 pins on the Type-C receptacle. When a DFP to UFP connection is made, a resistor divider is formed, and
the voltage at the CC pin can be measured to interpret the charging capability of the DFP.
 2015 Microchip Technology Inc.
DS00001957C-page 23
UTC2000
5.4
VCONN Active Cable Supply (DFP Modes Only)
All USB Type-C receptacles must be able to supply power to an active cable if USB 3.0/USB 3.1 signaling is implemented. Supplying VCONN is optional if only USB 2.0 is implemented. The simplest implementation is to add a FET (or
series of FETs) that switches in the VCONN voltage directly to the CC pin node. The VCONN supply must be capable
of supplying 1.0W of continuous power and may not supply more than 1.25A at the moment of plug contact. A bulk
capacitance of 10µF to 220µF must also be switched in with VCONN. The bulk capacitance may not need to be a discrete capacitor if the supply’s output capacitance already meets this requirement. Overcurrent detection is recommended, but not required per the USB Type-CTM Cable and Connector Specification. A simple implementation example
is shown in Figure 5-1 below.
Note:
Rds_on must be carefully considered to ensure that the USB Type-CTM Cable and Connector Specification
requirements for VCONN supply current and voltage range are met.
FIGURE 5-1:
EXAMPLE VCONN SUPPLY CONNECTION
VCONN 1.0W Supply
10uF-220uF
Bulk Cap
Rp Pull-Up Voltage
VCONN1_OUT#
Rp
Rp
VCONN2_OUT#
CC1
CC2
Note:
5.5
It is also recommended to implement additional circuitry to make the CC1 and CC2 pins high impedance
when the DFP is in an unpowered state. Refer to Figure 5-7 for an example.
CC Pin Isolation (DFP Only)
The CC pins on a DFP must be high-impedance when the DFP is powered off. This is to prevent VBUS backdrive in a
situation when a DFP connects to an unpowered DFP and detects the Rp pull-up resistors as an Rd pull-down. Therefore, it is recommended that some isolation FETs are implemented that disconnect the CC pins from the Rp pull-up resistors and VCONN supply circuitry when powered off.
5.6
CC Pin Current Limiting Resistors (UFP Only)
Because most UFP designs require operation even when unpowered, resistors placed directly in front of the CC1 and
CC2 pins are recommended to limit the amount of leakage current through the UTC2000 ADC inputs when unpowered.
10kΩ resistors are the recommended value.
Failure to place current limiting resistors could result in a failure to detect a USB attach due to a shift in CC voltage.
DS00001957C-page 24
 2015 Microchip Technology Inc.
UTC2000
5.7
VBUS Monitoring
DFP Modes: An optional VBUS monitoring function may be implemented to protect the system from higher than
expected voltages on VBUS (from a malfunctioning connected USB device) by preventing the UTC2000 from enabling
the 5V port switch. Additional back-drive protection or isolation circuitry must be implemented for thorough protection.
This feature requires the VMON pin to be connected to VBUS through a resistor divider network that divides the VBUS
voltage by a factor of 8. A 35.7kΩ resistor over a 5.1kΩ resistor is recommended, as shown in the Figure 5-7, Figure 58, and Figure 5-9 below.
UFP Mode: The VBUS monitoring function is required and used to verify a valid VBUS range before asserting the CONNECTED pin or any charge capability indicator outputs. A fault condition will also be flagged if higher than expected
voltage on VBUS (from a malfunctioning connected USB device) is detected. Additional back-drive protection or isolation circuitry must be implemented for thorough protection. This features requires the VMON pin to be connected to
VBUS through a resistor divider network that divides the VBUS voltage by a factor of 8.
5.8
USB Signal Multiplexer
There are several options for connecting the USB signals to the USB Type-C receptacles. These options differ slightly
between USB 2.0 and USB 3.0/USB 3.1 applications, as detailed in the following sub-sections.
5.8.1
USB 2.0 OPTION 1: HIGH-SPEED MULTIPLEXER/SWITCH
The most robust solution for USB 2.0 applications is to use a USB High-Speed switch to control the routing of the USB
signals. The Microchip USB3740 is a cost-effective solution for this purpose and offers several benefits:
•
•
•
•
•
•
Extreme ESD: +- 15KV (IEC)
Low Power: 5uA(on), 1uA (off)
Off Isolation: less than -40dB
High bandwidth: up to 1 GHz
Preserves signal integrity
Small Package: 1.3 x 1.8 mm – 10pin DFN (.4mm pitch)
FIGURE 5-2:
BLOCK DIAGRAM OF USB 2.0 OPTION 1: HIGH-SPEED SWITCH
DM
DM
DM1
DM
DP2
DP2
S
PLUG_ORIENTATION#
(from UTC2000)
 2015 Microchip Technology Inc.
DD+
D-
USB Type-CTM Connector
DM
Microchip
USB
3740
Switch
B7
DP
D+
B6
DP
DP
A7
DP
DP1
A6
USB2.0
Host/
Hub/
Device
DS00001957C-page 25
UTC2000
5.8.2
USB 2.0 OPTION 2: SHORT DP/DM PINS TOGETHER
The simplest solution is to short together the DP / DM pins at the receptacle. Only one DP / DM pair at the connector
will be active at once. Note that this implementation will negatively affect the integrity of the USB signals because of the
creation of stubs on the USB traces.
FIGURE 5-3:
BLOCK DIAGRAM OF USB 2.0 OPTION 2: SHORT DP/DM PINS TOGETHER
USB2.0
Host/
Hub/
Device
5.8.3
DP
DP
DM
DM
A
6
D+
A
7
D-
B
6
D+
B
7
D-
USB 2.0 OPTION 3: USE TWO DOWNSTREAM PORTS (DFP ONLY)
If two downstream ports are available, then they may both be connected to the DP / DM pins on the USB Type-C receptacle. Only one of the ports will be active and able to be used at once.
Note:
If using a Microchip Hub with FlexConnect, a muxless UFP design is possible. Refer to the Microchip
USB5734 USB Type-C Reference Design and Evaluation Platform for details.
FIGURE 5-4:
BLOCK DIAGRAM OF USB 2.0 OPTION 3: USE TWO DOWNSTREAM PORTS
DP2
DS00001957C-page 26
D+
D-
USB Type-CTM Connector
DP2
D-
B7
DM
B6
DM1
D+
A7
DP
A6
USB
Host/
Hub
DP1
 2015 Microchip Technology Inc.
UTC2000
5.8.4
USB 3.0/USB 3.1 OPTION 1: SUPER SPEED MULTIPLEXER/SWITCH
In a USB 3.0/USB 3.1 UFP application, or a USB 3.0/USB 3.1 DFP application where only one downstream port is available, a Super-Speed USB 3.0/USB 3.1 switch must be used to control the routing of the USB signals.
FIGURE 5-5:
BLOCK DIAGRAM OF USB 3.0/USB 3.1 OPTION 1: SUPER-SPEED MUX/SWITCH
SSTX-
SSRX2DP
DM
SSTX2+
S
SSTX2-
RX1D+
DTX1+
TX1-
USB Type-CTM Connector
SSTX-
RX1+
A3
SSTX+
TX1-
A2
DM
USB3.0/ SSTX1USB 3.1
DM
Super-Speed
Mux
SSRX2+
SSTX+
DP
B7
DP
TX1+
B6
SSTX1+
B10
SSRX-
B11
SSRX-
D-
A3
DM
A2
SSRX+
D+
A7
USB 3.0/
USB 3.1
Host/
Hub/
Device
SSRX+
RX1-
A6
DP
RX1+
B10
SSRX1-
B11
SSRX1+
PLUG_ORIENTATION#
(from UTC2000)
 2015 Microchip Technology Inc.
DS00001957C-page 27
UTC2000
5.8.5
USB 3.0/USB 3.1 OPTION 2: USE TWO DOWNSTREAM PORTS (DFP ONLY)
If two downstream ports are available, then they may both be connected to the USB pins on the USB Type-C receptacle.
Only one of the ports will be active and able to be used at once.
Note:
If using a Microchip Hub with FlexConnect, a muxless UFP design is possible. Refer to the Microchip
USB5734 Type-C Reference Design and Evaluation Platform for details.
FIGURE 5-6:
BLOCK DIAGRAM OF USB 3.0/USB 3.1 OPTION 2: USE TWO DOWNSTREAM
PORTS
TX1-
USB Type-CTM Connector
DS00001957C-page 28
TX1+
A3
SSTX2-
D-
A2
SSTX2+
D+
B7
DM2
RX1-
B6
DP2
RX1+
B10
SSRX2-
TX1-
B11
SSRX2+
TX1+
A3
SSTX1DP
D-
A2
SSTX1+
USB 3.0/
USB 3.1
Host/
Hub
D+
A7
DM1
RX1-
A6
DP1
RX1+
B10
SSRX1-
B11
SSRX1+
 2015 Microchip Technology Inc.
UTC2000
5.9
Application Example: 3.0A Capable USB 3.0/USB 3.1 DFP
FIGURE 5-7:
USB 3.0/USB 3.1 APPLICATION SCHEMATIC
9
9
3RUW3RZHU&RQWUROOHU
9B,1
9B287
(1$%/(
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9
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 2015 Microchip Technology Inc.
DS00001957C-page 29
UTC2000
5.10
Application Example: 1.5A Capable USB 2.0 DFP
FIGURE 5-8:
USB 2.0 APPLICATION SCHEMATIC
9
3RUW3RZHU&RQWUROOHU
9
9B,1
9B287
(1$%/(
2&6
N
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$
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%
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9
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X)
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)URP+RVW+XE
7R62&
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$8',2B$'$37(5
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9
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5.11
Application Example: 500mA Capable USB 2.0 DFP with Audio Adapter Support
FIGURE 5-9:
USB 2.0 WITH AUDIO ADAPTER APPLICATION SCHEMATIC
9
9
N
3RUW3RZHU&RQWUROOHU
9B,1
9B287
(1$%/(
2&6
9%86
N
9
N
86%$XGLR6ZLWFK
86%'3
86%'0
9''
2&6
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(3$'
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9&211B287
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DS00001957C-page 30
86%7\SH& TM
 2015 Microchip Technology Inc.
UTC2000
Application Example: 3.0A Capable USB Type-CTM Charging Port (AC Adapter)
5.12
FIGURE 5-10:
3.0A CHARGING PORT (AC ADAPTER) APPLICATION SCHEMATIC
9
9
3RUW3RZHU&RQWUROOHU
9B,1
9B287
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$
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5.13
TM
Application Example: UFP Device
FIGURE 5-11:
UFP DEVICE APPLICATION SCHEMATIC
R_SENSE
VBUS
RX1+
RX1RX2RX2+
TX2+
TX2D+
DD+
DCC1
CC2
SBU1
SBU2
B11
B10
A10
A11
B2
B3
A6
A7
B6
B7
RX+A
RX-A
RXRX+
RX-B
RX+B
TX+
TX-
TX+B
TX-B
S
USB3 RXUSB3 RX+
Current Sense
10k
5V
USB3 TX+
USB3 TX-
1
5.1k
12
USB3.0 Switch
11
USB2 DP
USB2 DM
5
10
9
8
To PWR Management
To PWR Management
To PWR Management
A5
B5
A8
B8
35.7k
10k
10k
5.1lk
5.1k
-
TX+A
TX-A
+
A2
A3
OCS
TX1+
TX1-
To System Power
5V
7
6
VDD
OCS#
5V
VMON
PLUG_ORIENTATION#
CONNECTED#
3.0A_IND#
1.5A_IND#
LEGACY_IND#
CC1
CC2
16
VSS
EPAD
ENABLE
FAULT_IND
CFG_SEL
13
0.1uF
10k
3
4 To PWR Management
2
10k
UTC2000
GND
USB Type C
 2015 Microchip Technology Inc.
DS00001957C-page 31
UTC2000
Note:
The pass FET and current sense circuitry connected to VBUS are for high voltage protection and are
optional. If high voltage protection is required and the device is bus powered or battery powered (and may
have a dead battery), a high voltage tolerant regulator must also be implemented to power the UTC2000
while it qualifies the USB Type-C connection.
DS00001957C-page 32
 2015 Microchip Technology Inc.
UTC2000
6.0
Note:
6.1
PACKAGING INFORMATION
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Package Marking Information
FIGURE 6-1:
16-PIN QFN PACKAGE MARKING INFORMATION
Example
16-Lead QFN (3x3x0.9 mm)
PIN 1
PIN 1
Legend:
UC
X
A
YY
WW
NNN
Note:
UTC2000 Designator
Temperature range designator:
(Blank=commercial, i=industrial, e= extended)
Automotive designator
(0=non-automotive, V=automotive)
Year code (last two digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
In the event the full Microchip part number cannot be marked on one line, it
will be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2015 Microchip Technology Inc.
DS00001957C-page 33
UTC2000
6.2
Package Details
FIGURE 6-2:
DS00001957C-page 34
16-PIN QFN PACKAGE (DRAWING)
 2015 Microchip Technology Inc.
UTC2000
FIGURE 6-3:
16-PIN QFN PACKAGE (DIMENSIONS)
 2015 Microchip Technology Inc.
DS00001957C-page 35
UTC2000
FIGURE 6-4:
DS00001957C-page 36
16-PIN QFN PACKAGE (LAND PATTERN)
 2015 Microchip Technology Inc.
UTC2000
APPENDIX A:
TABLE A-1:
DATA SHEET REVISION HISTORY
REVISION HISTORY
Revision Level & Date
Section/Figure/Entry
DS00001957C (08-06-15)
Cover, Section 1.1, "General
Description", Section 4.2,
"Standard Operating Conditions", Figure 6-1, Product
Identification System on
page 40
• Changed “Automotive extended temperature”
to “extended temperature” as the extended
temperature range is available in automotive
and non-automotive versions.
• Updated “XXX” automotive code description.
Table 2.2, "Pin Descriptions"
Updated first sentence of CFG_SEL description
Section 3.1, "Configuration
Selection"
• Updated first sentence to reference VCFG_SAMP
• Updated 2nd and 3rd paragraph to make the
mode ranges conditional “upon power-on”.
• Added new sentence to third paragraph: “For
UFP designs, it is recommended to tie CFG_SEL to VDD through a pull-up resistor to
ensure that UFP mode is entered when VDD
crosses the POR threshold.”
FIGURE 3-1: DFP Modes
State Machine Diagram on
page 12, FIGURE 3-2: UFP
Mode State Machine Diagram on page 15, FIGURE
5-11: UFP Device Application Schematic on page 31
Updated figures
Table 3-1, "DFP Configuration Selection Voltage Monitoring Thresholds", Table 32, "UFP Configuration
Selection Voltage Monitoring
Thresholds"
Updated CFG_SEL Voltage column values
Table 4-1, "Supply Voltage"
Added VCFG_SAMP parameter
Table 4-2, "Supply Current
(Idd)(1)"
Added supply current numbers
Table 4-3, "I/O Ports"
DS00001957B (07-30-15)
 2015 Microchip Technology Inc.
Correction
• Removed text from “characteristics” column of
D008 and D009 rows
• Updated voltage to 5.0V in footer
Table 4-4, "Timing Parameters"
Added new timing parameters table
FIGURE 5-3: Block Diagram of USB 2.0 Option 2:
Short DP/DM Pins Together
on page 26
Corrected errant blue box around USB Type-C
Connector
Product Identification System on page 40
“Automotive Extended” changed to “Extended”
DS00001957C-page 37
UTC2000
Revision Level & Date
Section/Figure/Entry
Correction
Figure 1-2, "Typical UFP
Application Block Diagram"
and Figure 5-11, "UFP
Device Application Schematic"
Figures modified to include CC1/CC2 inputs
Table 2.2, "Pin Descriptions"
Configuration Selection and Fault Indicator descriptions modified
Section 3.1, "Configuration
Selection",
Section modified
Section 3.7, "Connection
and Disconnection Detection
Debounce" and Section 5.6,
"CC Pin Current Limiting
Resistors (UFP Only)"
Sections added
Document Release, “Confidential” removed from document footer
DS00001957A (06-25-15)
DS00001957C-page 38
All
Initial Preliminary Release
 2015 Microchip Technology Inc.
UTC2000
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make
files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:
• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s
guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion
groups, Microchip consultant program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives
CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive
e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or
development tool of interest.
To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales
offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.
Technical support is available through the web site at: http://www.microchip.com/support
 2015 Microchip Technology Inc.
DS00001957C-page 39
UTC2000
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
[X]( 1)
PART NO.
Device
-
[X]
Tape and Reel Temperature
Option
Range
/XX
Package
[XXX]
Automotive
a)
b)
Device:
UTC2000
Tape and Reel
Option:
Blank
T
= Standard packaging (tube or tray)
= Tape and Reel ( 1)
Temperature
Range:
Blank
I
E
= 0°C to +70°C (Commercial)
= -40°C to +85°C (Industrial)
= -40°C to +125°C (Extended)
Package:
MG
= 16-Pin QFN (3x3x0.9mm)
Automotive:
Blank
XXX
= Non-automotive
= Automotive (3 character internal designator)
DS00001957C-page 40
Examples:
c)
UTC2000/MG
Standard packaging,
Commercial temperature,
16-pin QFN package
UTC2000T-I/MG
Tape and Reel,
Industrial temperature,
16-pin QFN package
UTC2000-E/MG042
Standard packaging,
Automotive extended temperature,
16-pin QFN package
Note
1:
Tape and Reel identifier only appears in
the catalog part number description. This
identifier is used for ordering purposes
and is not printed on the device package.
Check with your Microchip Sales Office
for package availability with the Tape and
Reel option.
2:
For other small form-factor package availability and marking information, please
visit www.microchip.com/packaging or
contact your local sales office.
 2015 Microchip Technology Inc.
UTC2000
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be
superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO
REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold
harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck,
MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and
UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK,
MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial
Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their respective companies.
© 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
ISBN: 9781632776884
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2015 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS00001957C-page 41
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Germany - Dusseldorf
Tel: 49-2129-3766400
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Austin, TX
Tel: 512-257-3370
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
China - Dongguan
Tel: 86-769-8702-9880
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-213-7828
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
07/14/15
DS00001957C-page 42
 2015 Microchip Technology Inc.