MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS LQFP 52 CASE 848H−01 ISSUE B DATE 16 FEB 2010 SCALE 1:1 4 PL M M/2 −Z− 0.20 (0.008) T X-Y Z AJ AJ 52 40 39 1 PLATING −X− AA −Y− L ÇÇÇÇ ÉÉÉÉ ÉÉÉÉ ÇÇÇÇ B AB B/2 L/2 13 D REF 27 0.08 (0.003) 26 14 J M Y T-U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MM. 3. DATUM PLANE “E" IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING PLANE. 4. DATUM “X", “Y" AND “Z" TO BE DETERMINED AT DATUM PLANE DATUM “E". 5. DIMENSIONS M AND L TO BE DETERMINED AT SEATING PLANE DATUM “T". 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD BASE PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 METAL (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLAND “E". 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED THE MAXIMUM D DIMENSION BY MORE THAN 0.08 (0.003). DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT LEAD OR PROTRUSION 0.07 Z (0.003). DETAIL AJ−AJ A/2 DIM A B C D F G H J K L M N P R S V W AA AB AC AD AE 0.20 (0.008) E X-Y Z A DETAIL AH −E− −T− AG G SEATING PLANE AG 48 PL D 0.08 (0.003) 0.10 (0.004) T 52 PL M T X-Y V Z 0.05 (0.002) R S AC AD EXPOSED PAD 14 26 S C 27 13 K W N P F H AE MILLIMETERS MIN MAX 10.00 BSC 10.00 BSC 1.30 1.50 0.22 0.40 0.45 0.75 0.65 BSC 1.00 REF 0.09 0.20 0.05 0.20 12.00 BSC 12.00 BSC 0.20 REF 0_ 7_ 0_ ----1.70 12 _ REF 12 _ REF 0.20 0.35 0.07 0.16 0.08 0.20 4.58 4.78 4.58 4.78 INCHES MIN MAX 0.394 BSC 0.394 BSC 0.051 0.059 0.009 0.016 0.018 0.030 0.026 BSC 0.039 BSC 0.004 0.008 0.002 0.008 0.472 BSC 0.472 BSC 0.008 REF 0_ 7_ 0_ ----0.067 12 _ REF 12 _ REF 0.008 0.014 0.003 0.006 0.003 0.008 0.180 0.188 0.180 0.188 MARKING DIAGRAM 0.25 GAGE PLANE xxxxxxxxxxx xxxxxxxxxxx AWLYYWWG DETAIL AH 52 1 39 52 1 40 VIEW AG−AG RECOMMENDED SOLDERING FOOTPRINT ON PAGE 2 DOCUMENT NUMBER: 98AON10382D xx A WL YY WW G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed STATUS: ON SEMICONDUCTOR STANDARD versions are uncontrolled except when stamped 1 “CONTROLLED COPY” in red. NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 Case Outline Number: http://onsemi.com October, DESCRIPTION: 2002 − Rev. 0 PAGE 1 OFXXX 3 LQFP 52 1 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS RECOMMENDED SOLDERING FOOTPRINT 12.36 52X 1.18 4.80 4.80 PKG OUTLINE DOCUMENT NUMBER: 98AON10382D 0.65 PITCH 12.36 52X 0.40 DIMENSIONS: MILLIMETERS Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed STATUS: ON SEMICONDUCTOR STANDARD versions are uncontrolled except when stamped “CONTROLLED COPY” in red. NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 Case Outline Number: http://onsemi.com October, DESCRIPTION: 2002 − Rev. 0 PAGE 2 OFXXX 3 LQFP 52 2 DOCUMENT NUMBER: 98AON10382D PAGE 3 OF 3 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY V. BASS. 22 AUG 2001 A MOVED DIM G TO LEFT 1 PIN. REQ. BY V. BASS. 14 NOV 2001 B ADDED SOLDERING FOOTPRINT. REQ. BY E. RUPNOW. 16 FEB 2010 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. 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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2010 February, 2010 − Rev. 01B Case Outline Number: 848H