848H-01

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
LQFP 52
CASE 848H−01
ISSUE B
DATE 16 FEB 2010
SCALE 1:1
4 PL
M
M/2
−Z−
0.20 (0.008) T X-Y Z
AJ AJ
52
40
39
1
PLATING
−X−
AA
−Y−
L
ÇÇÇÇ
ÉÉÉÉ
ÉÉÉÉ
ÇÇÇÇ
B
AB
B/2
L/2
13
D
REF
27
0.08 (0.003)
26
14
J
M
Y T-U
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MM.
3. DATUM PLANE “E" IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING PLANE.
4. DATUM “X", “Y" AND “Z" TO BE DETERMINED AT
DATUM PLANE DATUM “E".
5. DIMENSIONS M AND L TO BE DETERMINED AT
SEATING PLANE DATUM “T".
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
BASE
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
METAL
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLAND “E".
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE LEAD
WIDTH TO EXCEED THE MAXIMUM D DIMENSION
BY MORE THAN 0.08 (0.003). DAMBAR CANNOT
BE LOCATED ON THE LOWER RADIUS OR THE
FOOT. MINIMUM SPACE BETWEEN PROTRUSION
AND ADJACENT LEAD OR PROTRUSION 0.07
Z
(0.003).
DETAIL AJ−AJ
A/2
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
R
S
V
W
AA
AB
AC
AD
AE
0.20 (0.008) E X-Y Z
A
DETAIL AH
−E−
−T−
AG
G
SEATING
PLANE
AG
48 PL
D
0.08 (0.003)
0.10 (0.004) T
52 PL
M
T X-Y
V
Z
0.05 (0.002)
R
S
AC
AD
EXPOSED PAD
14
26
S
C
27
13
K
W
N
P
F
H
AE
MILLIMETERS
MIN
MAX
10.00 BSC
10.00 BSC
1.30
1.50
0.22
0.40
0.45
0.75
0.65 BSC
1.00 REF
0.09
0.20
0.05
0.20
12.00 BSC
12.00 BSC
0.20 REF
0_
7_
0_
----1.70
12 _ REF
12 _ REF
0.20
0.35
0.07
0.16
0.08
0.20
4.58
4.78
4.58
4.78
INCHES
MIN
MAX
0.394 BSC
0.394 BSC
0.051
0.059
0.009
0.016
0.018
0.030
0.026 BSC
0.039 BSC
0.004
0.008
0.002
0.008
0.472 BSC
0.472 BSC
0.008 REF
0_
7_
0_
----0.067
12 _ REF
12 _ REF
0.008
0.014
0.003
0.006
0.003
0.008
0.180
0.188
0.180
0.188
MARKING
DIAGRAM
0.25
GAGE
PLANE
xxxxxxxxxxx
xxxxxxxxxxx
AWLYYWWG
DETAIL AH
52
1
39
52
1
40
VIEW AG−AG
RECOMMENDED
SOLDERING FOOTPRINT
ON PAGE 2
DOCUMENT NUMBER:
98AON10382D
xx
A
WL
YY
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
1
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
October, DESCRIPTION:
2002 − Rev. 0
PAGE 1 OFXXX
3
LQFP 52
1
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
RECOMMENDED
SOLDERING FOOTPRINT
12.36
52X
1.18
4.80
4.80
PKG
OUTLINE
DOCUMENT NUMBER:
98AON10382D
0.65
PITCH
12.36
52X
0.40
DIMENSIONS: MILLIMETERS
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
October, DESCRIPTION:
2002 − Rev. 0
PAGE 2 OFXXX
3
LQFP 52
2
DOCUMENT NUMBER:
98AON10382D
PAGE 3 OF 3
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY V. BASS.
22 AUG 2001
A
MOVED DIM G TO LEFT 1 PIN. REQ. BY V. BASS.
14 NOV 2001
B
ADDED SOLDERING FOOTPRINT. REQ. BY E. RUPNOW.
16 FEB 2010
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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© Semiconductor Components Industries, LLC, 2010
February, 2010 − Rev. 01B
Case Outline Number:
848H
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