Data Sheet

UBA2028
600 V dimmable power IC for compact fluorescent lamps
Rev. 02 — 19 July 2010
Product data sheet
1. General description
The UBA2028 is a high voltage power IC that drives and controls electronically ballasted
Compact Fluorescent Lamps (CFLs). The IC includes a Metal-Oxide-Semiconductor
Transistor (MOST) half-bridge power circuit, a dimming function, a high voltage level shift
circuit, an oscillator function, a lamp voltage monitor, a current control function, a timer
function and various protections.
2. Features and benefits
„
„
„
„
„
„
„
„
„
„
„
„
Two internal 600 V, 3 Ω max MOST half-bridge power circuits
For steady state currents up to 280 mA
For ignition currents up to 1.5 A
Adjustable preheat time
Adjustable preheat current
Current controlled operating
Single ignition attempt
Adaptive non-overlap time control
Integrated high voltage level shift function
Power-down function
Protection against lamp failures or lamp removal
Capacitive mode protection
3. Applications
„ 5 W to 25 W dimmable CFLs, provided that the maximum junction temperature is not
exceeded.
UBA2028
NXP Semiconductors
600 V dimmable power IC for compact fluorescent lamps
4. Quick reference data
Table 1.
Quick reference data
VDD = 13 V; VFS − VSH = 13 V; Tamb = 25 °C; all voltages are referenced to GND; unless otherwise
specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDD(startup)
start-up supply voltage for oscillator
12.4
13.0
13.6
V
VDD(stop)
stop supply voltage
8.6
9.1
9.6
V
IDD(startup)
start-up supply current for oscillator;
VDD < VDD(startup)
-
170
200
μA
IHV < 30 μA; t < 1 s
-
-
600
V
Ileak = 10 μA
2.86
2.95
3.04
V
Start-up state
for oscillator
High voltage supply
Vhs
high-side supply
voltage
Reference voltage
Vref
reference voltage
Voltage controlled oscillator
fmax
maximum frequency
for bridge; CCF = 100 pF
90
100
110
kHz
fmin
minimum frequency
for bridge; CCF = 100 pF
38.9
40.5
42.1
kHz
Half-bridge power transistors
Ron
on-state resistance
half-bridge power
-
-
3
Ω
ID
drain current
pulsed; tp limited by Tj(max);
T < Tj(max)
-
-
1.5
A
0.57
0.60
0.63
V
Preheat current sensor
Vph
preheat voltage
Lamp voltage sensor
Vlamp(fail)
lamp fail voltage
0.77
0.81
0.85
V
Vlamp(max)
maximum lamp
voltage
1.44
1.49
1.54
V
0
+2
mV
Average current sensor
Voffset
offset voltage
Vi(CSP) = Vi(CSN) =
0 V to 2.5 V
−2
gm
transconductance
f = 1 kHz
1900 3800 5700 μA/mV
CCT = 330 nF;
RIREF = 33 kΩ
1.6
1.8
2.0
s
Preheat timer
UBA2028
Product data sheet
tph
preheat time
VOL
LOW-level output
voltage
-
1.4
-
V
VOH
HIGH-level output
voltage
-
3.6
-
V
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 19 July 2010
© NXP B.V. 2010. All rights reserved.
2 of 23
UBA2028
NXP Semiconductors
600 V dimmable power IC for compact fluorescent lamps
5. Ordering information
Table 2.
Ordering information
Type number
UBA2028T
UBA2028
Product data sheet
Package
Name
Description
SO20
plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 19 July 2010
Version
© NXP B.V. 2010. All rights reserved.
3 of 23
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
NXP Semiconductors
UBA2028
Product data sheet
6. Block diagram
VREF
VDD
16
7
3V
2, 3
1
BOOTSTRAP
Vpd
SUPPLY
LEVEL
SHIFTER
reference
voltages
digital
HS
DRIVER
LS
DRIVER
analog
UBA2028
18
DRIVER
LOGIC
15
SL
GLI
GLO
reset
5
CT
COUNTER
LOGIC
10
VOLTAGE
CONTROLLED
OSCILLATOR
• reset state
• start-up state
• preheat state
• ignition state
• burn state
• hold state
• power-down state
LOGIC
PREHEAT TIMER
ACM
ANT/CMD
STATE LOGIC
PCS
17
PCS
AVERAGE
CURRENT
SENSOR
LOGIC
LAMP
VOLTAGE
SENSOR
8
9
REFERENCE
CURRENT
Vlamp(fail)
V
12
Vlamp(max)
6
FREQUENCY
CONTROL
11
014aaa906
IREF
Fig 1.
Block diagram
CF
LVS
CSW
UBA2028
4 of 23
© NXP B.V. 2010. All rights reserved.
13
I
CSP
CSN
600 V dimmable power IC for compact fluorescent lamps
Rev. 02 — 19 July 2010
All information provided in this document is subject to legal disclaimers.
GND
SH
TR2
20
VDD(L)
4
HV
TR1
19
supply (5 V)
FS
UBA2028
NXP Semiconductors
600 V dimmable power IC for compact fluorescent lamps
7. Pinning information
7.1 Pinning
HV
1
20 SL
FS
2
19 SH
FS
3
18 GLI
GND
4
17 PCS
ACM
5
LVS
6
VREF
7
14 GND
CSP
8
13 IREF
CSN
9
12 CF
UBA2028
CT 10
16 VDD
15 GLO
11 CSW
014aaa904
Fig 2.
Pin diagram
7.2 Pin description
Table 3.
UBA2028
Product data sheet
Pin description
Symbol
Pin
Description
HV
1
high voltage input
FS
2
floating supply voltage; supply for high-side switch
FS
3
floating supply voltage; supply for high-side switch
GND
4
ground
ACM
5
capacitive mode input
LVS
6
lamp voltage sensor input
VREF
7
reference voltage output
CSP
8
positive input for the average current sensor
CSN
9
negative input for the average current sensor
CT
10
preheat timer output
CSW
11
input of voltage controlled oscillator
CF
12
voltage controlled oscillator output
IREF
13
internal reference current input
GND
14
ground
GLO
15
gate output for the low-side switch, must be wired to pin 18
VDD
16
low voltage supply
PCS
17
preheat current sensor input
GLI
18
gate input for the low-side switch, must be wired to pin 15.
SH
19
source for the high-side switch
SL
20
source low-side switch, connected to PGND via a resistor;
see Figure 7
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 19 July 2010
© NXP B.V. 2010. All rights reserved.
5 of 23
UBA2028
NXP Semiconductors
600 V dimmable power IC for compact fluorescent lamps
8. Functional description
8.1 Start-up state
Initial start-up can be achieved by charging the low voltage supply capacitor at pin 16 (see
Figure 8 and Figure 9) via an external start-up resistor. Start-up of the circuit is achieved
under the condition that both half-bridge transistors TR1 and TR2 are non-conductive.
The circuit will be reset in the start-up state. If the low voltage supply (VDD) reaches the
value of VDD(startup) the circuit will start oscillating. A DC reset circuit is incorporated in the
High-Side (HS) driver. Below the lockout voltage at the FS pin the output voltage (TR1
gate voltage − VSH) is zero. The voltages at pins CF and CT are zero during the start-up
state.
8.2 Oscillation
The internal oscillator is a Voltage Controlled Oscillator (VCO) circuit which generates a
sawtooth waveform between the Vo(osc)max level and 0 V. The frequency of the sawtooth is
determined by capacitor CCF, resistor RIREF, and the voltage at pin CSW. The minimum
and maximum switching frequencies are determined by RIREF and CCF; their ratio is
internally fixed. The sawtooth frequency is twice the half-bridge frequency. The UBA2028
brings the transistors TR1 and TR2 into conduction alternately with a duty cycle of
approximately 50 %. An overview of the oscillator signal and driver signals is illustrated in
Figure 7. The oscillator starts oscillating at fmax. During the first switching cycle the
Low-Side (LS) transistor (TR2) is switched on. The first conducting time is made extra
long to enable the bootstrap capacitor to charge.
8.3 Adaptive non-overlap
The non-overlap time is realized with an adaptive non-overlap timing circuit (ANT). By
using an adaptive non-overlap circuit, the application can determine the duration of the
non-overlap time and make it optimum for each frequency; see Figure 7. The non-overlap
time is determined by the slope of the half-bridge voltage, and is detected by the signal
across resistor R15 see Figure 8 (R6 in Figure 9) which is connected directly to pin ACM.
The minimum non-overlap time is internally fixed. The maximum non-overlap time is
internally fixed at approximately 25 % of the bridge period time. An internal filter of 30 ns
is included at the ACM pin to increase the noise immunity.
8.4 Timing circuit
A timing circuit is included to determine the preheat time and the ignition time. The circuit
consists of a clock generator and a counter.
The preheat time is defined by CCT and RIREF connected to pins 10 and 13, and consists
of 7 pulses at CCT; the maximum ignition time is 1 pulse at CCT. The timing circuit starts
operating after the start-up state, as soon as the low supply voltage (VDD) has reached
VDD(startup) or when a critical value of the lamp voltage (Vlamp(fail)) is exceeded. When the
timer is not operating CCT is discharged to 0 V at 1 mA.
UBA2028
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 19 July 2010
© NXP B.V. 2010. All rights reserved.
6 of 23
UBA2028
NXP Semiconductors
600 V dimmable power IC for compact fluorescent lamps
8.5 Preheat state
After starting at fmax, the frequency decreases until the momentary value of the voltage
across sense resistor R21 (see Figure 8) or R5 (Figure 9) reaches the internally fixed
preheat voltage level (pin PCS). Detection of the preheat voltage occurs during the end of
the ‘on-time’ of the low-side switch TR2 when the internal preheat fixed voltage reference
level is exceeded. Once detection has occurred the output current of the Preheat Current
Sensor (PCS) circuit discharges the capacitor CCSW, thus raising the frequency. The
internal preheat control is reset during each “on-time’ of the high-side switch TR1, thus
CCSW is charged, and the frequency decreases. It remains in this condition when no
detection occurs. The preheat time begins at the moment that the circuit starts oscillating.
During the preheat time the Average Current Sensor (ACS) circuit is disabled. An internal
filter of 30 ns is included at pin PCS to increase the noise immunity.
8.6 Ignition state
After the preheat time the ignition state is entered and the frequency will sweep down due
to charging of the capacitor at pin CSW with an internally fixed current; see Figure 4.
During this continuous decrease in frequency, the circuit approaches the resonant
frequency of the load. This will cause a high voltage across the load, which normally
ignites the lamp. The ignition voltage of a lamp is designed above the Vlamp(fail) level. If the
lamp voltage exceeds the Vlamp(fail) level the ignition timer is started.
8.7 Burn state
If the lamp voltage does not exceed the Vlamp(max) level the voltage at pin CSW will
continue to increase until the clamp level at pin CSW is reached; see Figure 4. As a
consequence the frequency will decrease until the minimum frequency is reached.
When the frequency reaches its minimum level it is assumed that the lamp has ignited
and the circuit will enter the burn state. The Average Current Sensor (ACS) circuit will be
enabled. As soon as the averaged voltage across sense resistor R21 (see Figure 8) or R5
(Figure 9), measured at pin CSN, reaches the reference level at pin CSP, the average
current sensor circuit will take over the control of the lamp current. The average current
through R21 or R5, is transferred to a voltage at the voltage controlled oscillator and
regulates the frequency and, as a result, the lamp current.
8.8 Lamp failure mode
8.8.1 During ignition state
If the lamp does not ignite, the voltage level increases. When the lamp voltage exceeds
the Vlamp(max) level, the voltage will be regulated at the Vlamp(max) level; see Figure 5.
When the Vlamp(fail) level is crossed the ignition timer has already started. If the voltage at
pin LVS is above the Vlamp(fail) level at the end of the ignition time the circuit stops
oscillating and is forced into the Power-down mode. The circuit will be reset only when the
supply voltage is powered down.
8.8.2 During burn state
If the lamp fails during normal operation, the voltage across the lamp will increase and the
lamp voltage will exceed the Vlamp(fail) level; see Figure 6. At that moment the ignition
timer is started. If the lamp voltage increases further it will reach the Vlamp(max) level. This
forces the circuit to re-enter the ignition state and results in an attempt to reignite the
UBA2028
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 19 July 2010
© NXP B.V. 2010. All rights reserved.
7 of 23
UBA2028
NXP Semiconductors
600 V dimmable power IC for compact fluorescent lamps
lamp. If during restart the lamp still fails, the voltage remains high until the end of the
ignition time. At the end of the ignition time the circuit stops oscillating and the circuit will
enter the Power-down mode.
8.9 Power-down mode
The Power-down mode will be entered if, at the end of the ignition time, the voltage at pin
LVS is above Vlamp(fail). In the Power-down mode the oscillator will be stopped and both
TR1 and TR2 will be non-conductive. The VDD supply is internally clamped. The circuit is
released from the Power-down mode by lowering the low voltage supply below VDD(rst).
8.10 Capacitive mode protection
The signal across R15 see Figure 8 (R6 in Figure 9) also gives information about the
switching behavior of the half-bridge. If, after the preheat state, the voltage across the
ACM resistor (R15 or R6) does not exceed the Vdet(capm) level during the non-overlap
time, the Capacitive Mode Detection circuit (CMD) assumes that the circuit is in the
capacitive mode of operation. As a consequence the frequency will directly be increased
to fmax. The frequency behavior is de coupled from the voltage at pin CSW until CCSW has
been discharged to zero.
8.11 Charge coupling
Due to parasitic capacitive coupling to the high voltage circuitry all pins are burdened with
a repetitive charge injection. Given the typical application the pins IREF and CF are
sensitive to this charge injection. For charge coupling of approximately 8 pC, a safe
functional operation of the IC is guaranteed, independent of the current level.
Charge coupling at current levels below 50 μA will not interfere with the accuracy of the
VCS, Vi(PCS) and Vi(ACM) levels.
Charge coupling at current levels below 20 μA will not interfere with the accuracy of any
parameter.
8.12 Design equations
The following design equations are used to calculate the desired preheat time, the
maximum ignition time, and the minimum and the maximum switching frequency.
C CT
R IREF
- × ------------------t ph = 1.8 × ------------------------–9
3
330 × 10
33 × 10
(1)
C CT
R IREF
- × ------------------t ign = 0.26 × ------------------------–9
3
330 × 10
33 × 10
(2)
– 12
3
33 × 10
3 100 × 10
f min = 40.5 × 10 × ---------------------------- × -------------------C CF
R IREF
(3)
f max = 2.5 × f min
(4)
Start of ignition is defined as the moment at which the measured lamp voltage crosses the
Vlamp(fail) level; see Section 8.8.
UBA2028
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 19 July 2010
© NXP B.V. 2010. All rights reserved.
8 of 23
UBA2028
NXP Semiconductors
600 V dimmable power IC for compact fluorescent lamps
mgw582
VCF
0
V(GH-SH)
0
VGL
0
Vhalfbridge
0
VACM
0
time
Fig 3.
Oscillator and drive signals
Vlamp
preheat state
ignition
state
burn state
Vlamp(max)
Vlamp(fail)
f min detection
Timer
on
off
time
Fig 4.
UBA2028
Product data sheet
mgw583
Normal ignition behavior
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 19 July 2010
© NXP B.V. 2010. All rights reserved.
9 of 23
UBA2028
NXP Semiconductors
600 V dimmable power IC for compact fluorescent lamps
ignition
state
preheat state
Vlamp
power-down
state
Vlamp(max)
Vlamp(fail)
Timer
on
timer
ended
off
time
Fig 5.
mgw584
Failure mode during ignition
Vlamp
burn state
ignition
state
power-down
state
Vlamp(max)
Vlamp(fail)
Timer
on
timer
started
timer
ended
off
time
Fig 6.
mgw585
Failure mode during burn
8.13 Layout considerations
The connection of PGND and GND is shown in Figure 7
UBA2028
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 19 July 2010
© NXP B.V. 2010. All rights reserved.
10 of 23
UBA2028
NXP Semiconductors
600 V dimmable power IC for compact fluorescent lamps
VDD
HV
GND
SH
GND
PGND
IREF
CT
ACM
UBA2028
CF
SL
PCS
CSW
VREF
CSP
CSN
PGND
014aaa938
Fig 7.
UBA2028
Product data sheet
PGND and GND connection
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 19 July 2010
© NXP B.V. 2010. All rights reserved.
11 of 23
UBA2028
NXP Semiconductors
600 V dimmable power IC for compact fluorescent lamps
9. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages referenced to GND.
Symbol
Parameter
Conditions
Min
Max
Unit
VHV
voltage on pin HV
operating; during 1 s
-
600
V
operating
-
510
V
ID
drain current
TR1 pulsed; tp limited by Tj(max);
T < Tj(max)
-
1.5
A
TR2 pulsed; tp limited by Tj(max);
T < Tj(max)
-
1.5
A
-
14
V
0
14
V
VVDD
voltage on pin VDD
VFS
voltage on pin FS
Vi(ACM)
input voltage on pin ACM
−5
+5
V
Vi(PCS)
input voltage on pin PCS
−5
+5
V
Vi(LVS)
input voltage on pin LVS
0
5
V
Vi(CSP)
input voltage on pin CSP
0
5
V
Vi(CSN)
input voltage on pin CSN
−0.3
+5
V
0
5
V
−4
+4
V/ns
with respect to SH
Vi(CSW)
input voltage on pin CSW
SR
slew rate
Tamb
ambient temperature
−25
+80
°C
Tj
junction temperature
−25
+150
°C
Tstg
storage temperature
VESD
electrostatic discharge voltage
pin SH; repetitive
−55
+150
°C
pin HV
[1]
-
1500
V
pins FS, SH
[1]
-
1000
V
pin GLO
[1]
-
< 500
V
pin GLO
[2]
-
150
V
[1]
In accordance with the human body model, i.e. equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
[2]
In accordance with the machine model, i.e. equivalent to discharging a 200 pF capacitor through a 0.75 μH coil and a 10 Ω resistor.
10. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from junction to ambient
SO20; in free air
75
K/W
UBA2028
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 19 July 2010
© NXP B.V. 2010. All rights reserved.
12 of 23
UBA2028
NXP Semiconductors
600 V dimmable power IC for compact fluorescent lamps
11. Characteristics
Table 6.
Characteristics
VDD = 13 V; VFS − VSH = 13 V; Tamb = 25 °C; all voltages referenced to GND unless otherwise specified
(see application circuits of Figure 8 and Figure 9).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Start-up state: pin VDD
VDD
supply voltage
for defined driver output;
TR1 = off; TR2 = off
-
-
6
V
VDD(rst)
reset supply voltage
TR1 = off; TR2 = off
4.5
5.5
7.0
V
VDD(startup)
start-up supply voltage
for oscillator
12.4
13.0
13.6
V
VDD(stop)
stop supply voltage
for oscillator
8.6
9.1
9.6
V
VDD(hys)
hysteresis of supply voltage
for start-stop
3.5
3.9
4.4
V
Vclamp(VDD)
clamp voltage on pin VDD
Power-down mode
10
11
12
V
IDD(startup)
start-up supply current
for oscillator;
VDD < VDD(startup)
-
170
200
μA
IDD
supply current
half-bridge frequency =
40 kHz without gate drive
-
1.5
2.2
mA
IDD(pd)
power-down supply current
VDD = 9 V
-
170
200
μA
High voltage supply: pins HV, SH and FS
Vhs
high-side supply voltage
IHV < 30 μA; t < 1 s
-
-
600
V
Ileak
leakage current
600 V at high voltage pins
-
-
30
μA
Reference voltage: pin VREF
Vref
reference voltage
Ileak = 10 μA
2.86
2.95
3.04
V
ΔVref/Vref
relative reference voltage
variation
Ileak = 10 μA;
Tamb = 25 °C to 150 °C
-
−0.64
-
%
Isource
source current
1
-
-
mA
Isink
sink current
1
-
-
mA
Zo
output impedance
Ileak = 1 mA source
-
3.0
-
Ω
-
2.5
-
V
reference range
65
-
95
μA
Current supply: pin IREF
VI
input voltage
II
input current
Voltage controlled oscillator
Output: pin CSW
VO
output voltage
for control
2.7
3.0
3.3
V
Vclamp
clamp voltage
burn state
2.8
3.1
3.4
V
90
100
110
kHz
Voltage controlled oscillator output: pin CF
fmax
maximum frequency
for bridge; CCF = 100 pF
fmin
minimum frequency
for bridge; CCF = 100 pF
38.9
40.5
42.1
kHz
Δf/f
relative frequency variation
Tamb = −20 °C to +80 °C
-
1.3
-
%
tstart
start time
first output oscillator stroke
-
50
-
μs
tno(min)
minimum non-overlap time
TR1 to TR2 gate voltages
0.68
0.90
1.13
μs
0.75
1.00
1.25
μs
tno(max)
maximum non-overlap time
-
7.5
-
μs
TR2 to TR1 gate voltages
UBA2028
Product data sheet
fbridge = 40 kHz
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 19 July 2010
[1]
© NXP B.V. 2010. All rights reserved.
13 of 23
UBA2028
NXP Semiconductors
600 V dimmable power IC for compact fluorescent lamps
Table 6.
Characteristics …continued
VDD = 13 V; VFS − VSH = 13 V; Tamb = 25 °C; all voltages referenced to GND unless otherwise specified
(see application circuits of Figure 8 and Figure 9).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VO(osc)max
maximum oscillator output
voltage
f = fmin
-
2.5
-
V
Io(startup)
start-up output current
for oscillator; VCF = 1.5 V
3.8
4.5
5.2
μA
Iosc
oscillator current
VCF = 1.5 V
21
-
54
μA
Output driver
Low-side driver output: pin GLO
VOH
HIGH-level output voltage
Io = 10 mA
12.5
-
-
V
VOL
LOW-level output voltage
Io = 10 mA
-
-
0.5
V
IO(source)
output source current
VGLO = 0 V
135
180
235
mA
Isink(o)
output sink current
VGLO = 13 V
265
330
415
mA
Ron
on-state resistance
Io = 10 mA
32
39
45
Ω
Roff
off-state resistance
Io = 10 mA
16
21
26
Ω
TR1 high-side power
-
-
3
Ω
TR2 low-side power
-
-
3
Ω
-
2.7
-
-
Output stage
Power transistors
Ron
on-state resistance
Ron(150)/Ron(25) on-state resistance ratio
(150 °C to 25 °C)
Floating supply voltage: pin FS
VFS
voltage on pin FS
for lockout
2.8
3.5
4.2
V
IFS
current on pin FS
DC level at TR1 gate
voltage − VSH = 13 V
-
35
-
μA
bootstrap diode forward voltage
I = 5 mA
1.3
1.7
2.1
V
Vi(PCS) = 0.6 V
-
-
1
μA
0.57
0.60
0.63
V
Bootstrap diode
VFd(bs)
Preheat current sensor
Input: pin PCS
II
input current
Vph
preheat voltage
Output: pin CSW
Isource(o)
output source current
Vi(CSW) = 2.0 V
9.0
10
11
μA
Isink(o)
output sink current
Vi(CSW) = 2.0 V
-
10
-
μA
Adaptive non-overlap and capacitive mode detection; pin ACM
II
input current
Vi(ACM) = 0.6 V
-
-
1
μA
Vdet(capm)
capacitive mode detection
voltage
positive
80
100
120
mV
negative
−68
−85
−102
mV
II
input current
Vi(LVS) = 0.81 V
-
-
1
μA
Vlamp(fail)
lamp fail voltage
0.77
0.81
0.85
V
Vlamp(fail)hys
lamp fail voltage hysteresis
119
144
169
mV
Vlamp(max)
maximum lamp voltage
1.44
1.49
1.54
V
Input: pin LVS
UBA2028
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 19 July 2010
© NXP B.V. 2010. All rights reserved.
14 of 23
UBA2028
NXP Semiconductors
600 V dimmable power IC for compact fluorescent lamps
Table 6.
Characteristics …continued
VDD = 13 V; VFS − VSH = 13 V; Tamb = 25 °C; all voltages referenced to GND unless otherwise specified
(see application circuits of Figure 8 and Figure 9).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Output: pin CSW
Isink(o)
output sink current
Vi(CSW) = 2.0 V
27
30
33
μA
Isource(o)
output source current
Vi(CSW) = 2.0 V
9.0
10
11
μA
Average current sensor
Input: pins CSP and CSN
II
input current
VCS = 0 V
-
-
1
μA
Voffset
offset voltage
Vi(CSP) = Vi(CSN) =
0 V to 2.5 V
−2
0
+2
mV
gm
transconductance
f = 1 kHz
1900
3800
5700
μA/mV
source and sink;
Vi(CSW) = 2 V
85
95
105
μA
Output: pin CSW
output current
Io
Preheat timer; pin CT
tph
preheat time
CCT = 330 nF;
RIREF = 33 kΩ
1.6
1.8
2.0
s
tign
ignition time
CCT = 330 nF;
RIREF = 33 kΩ
-
0.32
-
s
Vo(CT) = 2.5 V
Io
output current
5.5
5.9
6.3
μA
VOL
LOW-level output voltage
-
1.4
-
V
VOH
HIGH-level output voltage
-
3.6
-
V
Vhys
hysteresis voltage
2.05
2.20
2.35
V
[1]
for output
The maximum non-overlap time is determined by the level of the CF signal. If this signal exceeds a level of 1.25 V, the non-overlap will
end, resulting in a maximum non-overlap time of 7.5 μs at a bridge frequency of 40 kHz.
UBA2028
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 19 July 2010
© NXP B.V. 2010. All rights reserved.
15 of 23
UBA2028
NXP Semiconductors
600 V dimmable power IC for compact fluorescent lamps
12. Application information
D1D1
US1M
C2
22 μF 250V
R1
D1C1
US1M
L
FUSISTOR
2.2 Ω 1 W
C5
100 nF
400 V
120 V AC
60 Hz
D8
1N4148
R19
1 kΩ N.M.
C8
22 nF
250 V
C11
3.9 nF
1000 V
R9
47 kΩ
R14
150 kΩ
C6
22 nF
250 V
C4
3.3 nF
250 V N.M.
R13
100 kΩ
N
L2 6.8 mH
D1B1
US1M
D1A1
US1M
D3
75V
R12
0Ω
C10
1nF
250V
N.M.
C16
470nF
50V
D12
5.6 V
R26
22 kΩ
R2
33 kΩ
R11
47 kΩ
C22
470 nF
50V
C27
4.7 μF
50V
C1
22 μF 250V
R8
100 kΩ
R10
110 kΩ
12 V
C12
100 nF
R6
20 kΩ
HV
R23
VREF
6.8 MΩ
CSP
IREF
CF
CT
R7
33 kΩ
C25
100 pF
C9
220 nF
C20
220 nF
CSW
LVS
1
VDD
16
FS
3
C13
100 nF
FS
7
2
SH
19
8
GLI
18
13
UBA2028
12
15
10
9
GLO
5
6
4
14
R16
5.1 kΩ
GND
20
SL
C17
L1 2.5 mH
R12
12 kΩ
N.M.
C14
680 pF
1000 V
C31
150 nF
250 V
L1B1
1.8 μH
CFL 18 W
150 V RMS
C30
150 nF
250 V
68 nF
C15
1 nF
1000 V
N.M.
CSN
11
GND
C23
10 nF N.M.
L1A1
1.8 μH
D6
1N4148
ACM
D23
12 V
C26
5.6 nF
17
PCS
R15
2.4 Ω 1W
R21
1.5 Ω
R17
D5
1 kΩ
M7
R18
33 Ω
1W
C21
470 nF
D7
M7
014aaa916
Fig 8.
Application circuit 120 V
UBA2028
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 19 July 2010
© NXP B.V. 2010. All rights reserved.
16 of 23
UBA2028
NXP Semiconductors
600 V dimmable power IC for compact fluorescent lamps
C21
1 nF
1000 V
R8
R10
560 kΩ
560 kΩ
R16
200 kΩ
D3
D4
FR107
FR107
C6
100 nF
L3
C8
CD1
10 μF,
400 V
R1
220 kΩ
HV
FS
FS
GND
R2
220 kΩ
ACM
LVS
R14
C4
4.7 μF
D2
D8
R6
5.1 V
IN4148
33 kΩ
R3
24 kΩ
R4
22 kΩ
R5
33 kΩ
3 MΩ
VREF
CSP
CSN
C7
4.7 μF
CT
1
20
2
19
3
18
4
5
17
UBA2028
16
6
15
7
14
8
13
9
12
10
11
SL
C14
1 nF,
1000 V
D5
1N4148
GLI
PCS
C15
1 nF
D9
12 V
IN4007
D1b
D1d
D1c
VDD
GLO
R9
1.5 Ω,
2W
L3A
1.8 μH
R15
2.4 Ω
IREF
C18
220 nF
100 V
EF20-CFL
CF
CSW
R7
33 kΩ
C9
220 nF
R16
1 kΩ
C12
10 nF
C11
100 pF
R13
D7
1 kΩ
FR107
C22
470 pF
L1
6.8 mH
CX2
L3B
1.8 μH
C19
220 nF
100 V
GND
CX1
47 nF, 400 V
47 nF,
400 V
C16
3.9 nF,
1000 V
SH
C10
220 nF
D1a
C17
2.5 mH
100 nF
47 nF 400 V
Dc
IN4148
Rc1
Rc
15 Ω, 1 W
15 Ω, 1 W
C20
470 nF
D6
FR107
R11
4.7 Ω, 1W
L
230 V AC
N
014aaa917
Fig 9.
Application circuit 230 V
13. Test information
13.1 Quality information
13.1.1 Safety: Electric, Magnetic and ElectroMagnetic Fields (EMF)
• NXP Semiconductors manufactures and sells many products, which, like any
electronic apparatus, in general may have the ability to emit and receive
electromagnetic signals.
• One of NXP Semiconductors’ leading business principles is to take health and safety
measures for our products, to comply with all applicable legal requirements and to
stay well within the EMF standards applicable at the time of printing this document for
each individual product.
• NXP Semiconductors aims, at all times, to supply safe products and services.
UBA2028
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 19 July 2010
© NXP B.V. 2010. All rights reserved.
17 of 23
UBA2028
NXP Semiconductors
600 V dimmable power IC for compact fluorescent lamps
• The consensus of scientific opinion is that EMF exposure below the limits prescribed
by safety standards and recommendations, applicable at the time of printing this
document, poses no risk to human health.
• NXP Semiconductors plays an active role in the development of international EMF
and safety standards, enabling NXP Semiconductors to anticipate further
developments in standardization for early integration in its products.
• Additional information can be obtained from:
– Institute of Electrical and Electronic Engineers (www.ieee.org)
– Office of Communications (www.ofcom.org.uk)
– EU pages on EMF and Public Health (ec.europa.eu/health/index_en.htm).
UBA2028
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 19 July 2010
© NXP B.V. 2010. All rights reserved.
18 of 23
UBA2028
NXP Semiconductors
600 V dimmable power IC for compact fluorescent lamps
14. Package outline
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
HE
y
v M A
Z
20
11
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
10
1
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.05
0.419
0.043
0.055
0.394
0.016
inches
0.1
0.012 0.096
0.004 0.089
0.043
0.039
0.01
0.01
Z
(1)
0.9
0.4
0.035
0.004
0.016
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT163-1
075E04
MS-013
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 10. Package outline SOT163-1 (SO20)
UBA2028
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 19 July 2010
© NXP B.V. 2010. All rights reserved.
19 of 23
UBA2028
NXP Semiconductors
600 V dimmable power IC for compact fluorescent lamps
15. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
UBA2028 v.2
20100719
Product data sheet
-
UBA2028_1
Modifications:
UBA2028_1
UBA2028
Product data sheet
•
•
•
Pinning standardized on Figure 1, Figure 2, Figure 8, and Figure 9
Symbol for pin 15 changed from GL to GLO in Table 3, Table 4 and Table 6
Section 16 “Legal information” updated.
20091009
Product data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 19 July 2010
-
© NXP B.V. 2010. All rights reserved.
20 of 23
UBA2028
NXP Semiconductors
600 V dimmable power IC for compact fluorescent lamps
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
UBA2028
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 19 July 2010
© NXP B.V. 2010. All rights reserved.
21 of 23
UBA2028
NXP Semiconductors
600 V dimmable power IC for compact fluorescent lamps
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
UBA2028
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 19 July 2010
© NXP B.V. 2010. All rights reserved.
22 of 23
UBA2028
NXP Semiconductors
600 V dimmable power IC for compact fluorescent lamps
18. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.8.1
8.8.2
8.9
8.10
8.11
8.12
8.13
9
10
11
12
13
13.1
13.1.1
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
Start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Oscillation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Adaptive non-overlap . . . . . . . . . . . . . . . . . . . . 6
Timing circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Preheat state . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Ignition state . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Burn state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Lamp failure mode . . . . . . . . . . . . . . . . . . . . . . 7
During ignition state . . . . . . . . . . . . . . . . . . . . . 7
During burn state . . . . . . . . . . . . . . . . . . . . . . . 7
Power-down mode . . . . . . . . . . . . . . . . . . . . . . 8
Capacitive mode protection . . . . . . . . . . . . . . . 8
Charge coupling . . . . . . . . . . . . . . . . . . . . . . . . 8
Design equations . . . . . . . . . . . . . . . . . . . . . . . 8
Layout considerations. . . . . . . . . . . . . . . . . . . 10
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12
Thermal characteristics . . . . . . . . . . . . . . . . . 12
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13
Application information. . . . . . . . . . . . . . . . . . 16
Test information . . . . . . . . . . . . . . . . . . . . . . . . 17
Quality information . . . . . . . . . . . . . . . . . . . . . 17
Safety: Electric, Magnetic and
ElectroMagnetic Fields (EMF) . . . . . . . . . . . . 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 20
Legal information. . . . . . . . . . . . . . . . . . . . . . . 21
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Contact information. . . . . . . . . . . . . . . . . . . . . 22
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 19 July 2010
Document identifier: UBA2028
Similar pages