AP2301 11

AP2301/AP2311
2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH
Description
Pin Assignments
The AP2301 and AP2311 are single channel current-limited
integrated high-side power switches optimized for Universal Serial
Bus (USB) and other hot-swap applications. The family of devices
complies with USB standards and is available with both polarities of
Enable input.
(Top
( Top View)
View )
GND 1
8
NC
IN 2
7
OUT
IN 3
6
OUT
The devices have fast short-circuit response time for improved overall
system robustness, and have integrated output discharge function to
ensure completely controlled discharging of the output voltage
capacitor. They provide a complete protection solution for applications
subject to heavy capacitive loads and the prospect of short circuit,
and offer reverse current blocking, over-current, over-temperature
and short-circuit protection, as well as controlled rise time and undervoltage lockout functionality. A 7ms deglitch capability on the opendrain Flag output prevents false over-current reporting and does not
require any external components.
EN 4
5 FLG
SO-8
SO-8
(Top View)
MSOP-8 /MSOP-8EP
Note: latter with exposed pad (dotted line)
All devices are available in SO-8, MSOP-8, MSOP-8EP, U-DFN30308 (Type E) and U-DFN2020-6 packages.
(Top View)
Features















Single Channel Current-limited Power Switch
Output Discharge Function
Fast Short-circuit Response Time: 2µs
2.5A Accurate Current Limiting
Reverse Current Blocking
70mΩ On-resistance
Input Voltage Range: 2.7V to 5.5V
Built-in Soft-start with 0.6ms Typical Rise Time
Over-current and Thermal Protection
Fault Report (FLG) with Blanking Time (7ms Typ)
ESD Protection: 2kV HBM, 200V MM
Ambient Temperature Range: -40°C to +85°C
SO-8, MSOP-8, MSOP-8EP, U-DFN3030-8 (Type E) and
U-DFN2020-6: Available in “Green” Molding Compound (No Br,
Sb)

Totally Lead-free & Fully RoHS Compliant (Notes 1 & 2)

Halogen and Antimony Free. “Green” Device (Note 3)
UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified
Notes:
U-DFN3030-8 (Type E)
(Top View)
U-DFN2020-6
Applications



LCD TVs & Monitors
Set-Top-Boxes, Residential Gateways
Laptops, Desktops, Servers, e-Readers, Printers, Docking
Stations, HUBs
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
AP2301/AP2311
Document number: DS32241 Rev. 6 - 2
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AP2301/AP2311
Typical Applications Circuit
Enable Active High
IN
Power Supply
2.7V to 5.5V
0.1μF
0.1μF
10k
Load
OUT
120μF
FLG
EN
ON
GND
OFF
Available Options
Part Number
Channel
Enable Pin (EN)
AP2301
1
Active Low
AP2311
1
Active High
Recommended Maximum
Continuous Load Current (A)
2A
Typical Current
Limit (A)
Package
2.5A
SO-8
MSOP-8
MSOP-8EP
U-DFN3030-8 (Type E)
U-DFN2020-6
Pin Descriptions
Pin
Name
SO-8,
MSOP-8
Pin Number
MSOP-8EP,
U-DFN3030-8
U-DFN2020-6
(Type E)
GND
1
1
2
IN
2, 3
2, 3
1
EN
4
4
3
FLG
5
5
4
OUT
NC
6, 7
8
6, 7
8
5
6
Exposed
Pad
–
Exposed
Pad
Exposed
Pad
AP2301/AP2311
Document number: DS32241 Rev. 6 - 2
Function
Ground
Voltage Input Pin; Connect a 0.1µF or larger ceramic capacitor from IN to GND as close
as possible. (all IN pins must be tied together externally)
Enable input, active low (AP2301) or active high (AP2311)
Over-temperature and over-current fault reporting with 7ms deglitch; active low opendrain output. FLG is disabled for 7ms after turn-on.
Voltage Output Pin All OUT pins must be tied together externally.
No Internal Connection; recommend tie to OUT pins
Exposed pad.
It should be externally connected to GND and thermal mass for enhanced thermal
impedance. It should not be used as electrical ground conduction path.
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AP2301/AP2311
Functional Block Diagram
Current
Sense
IN
OUT
Discharge
Control
UVLO
Driver
EN
Current
Limit
FLG
Deglitch
Thermal
Sense
GND
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol
ESD HBM
ESD MM
Parameter
Human Body Model ESD Protection
Machine Model ESD Protection
Input Voltage (Note 4)
Ratings
Unit
2
200
kV
V
-0.3 to 6.5
V
VOUT
Output Voltage (Note 4)
-0.3 to (VIN +0.3) or 6.5
V
VEN , VFLG
Enable Voltage (Note 4)
-0.3 to (VIN +0.3) or 6.5
V
VIN
ILOAD
TJ(MAX)
TST
Notes:
Maximum Continuous Load Current
Maximum Junction Temperature
Storage Temperature Range (Note 5)
Internal Limited
A
+150
°C
-65 to +150
°C
4. All voltages referred to GND pin. Maximums are the lower of (VIN +0.3) and 6.5V.
5. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C).
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings
only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability
may be affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices.
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol
VIN
Parameter
Input Voltage
Min
Max
Unit
2.7
5.5
V
IOUT
Output Current
0
2
A
VIL
EN Input Logic Low Voltage
0
0.8
V
VIH
EN Input Logic High Voltage
2
VIN
V
TA
Operating Ambient Temperature
-40
+85
C
AP2301/AP2311
Document number: DS32241 Rev. 6 - 2
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AP2301/AP2311
Electrical Characteristics
Symbol
(@TA = +25°C, VIN = +5V, CIN = 0.1µF, CL = 1µF, unless otherwise specified.)
Parameter
Test Conditions
Min
Typ
Max
1.6
2.0
2.4
V
VIN Decreasing
–
50
–
mV
Input Shutdown Current
Disabled, OUT = Open
–
0.1
1
µA
Input UVLO
VIN Rising
ΔVUVLO
Input UVLO Hysteresis
ISHDN
IQ
VUVLO
Unit
Input Quiescent Current
Enabled, OUT = Open
–
60
100
µA
ILEAK
Input Leakage Current
Disabled, OUT Grounded
–
0.1
1
µA
IREV
Reverse Leakage Current
Disabled, VIN = 0V, VOUT = 5V, IREV at VIN
–
0.01
1
µA
TA = +25°C
–
70
84
-40°C ≤ TA ≤ +85°C
–
–
105
TA = +25°C
–
90
108
-40°C ≤ TA ≤ +85°C
–
–
135
2.05
2.50
2.85
A
–
2.5
–
A
VIN = 5V, IOUT = 2.0A
RDS(ON)
Switch On-resistance
VIN = 3.3V, IOUT = 2.0A
ILIMIT
ITRIG
Over-Load Current Limit (Note 6) VIN = 5V, VOUT = 4.5V
-40°C ≤ TA ≤ +85°C
Current Limiting Trigger
Output Current Slew Rate (<100A/s)
Threshold
mΩ
ISHORT
Short-Circuit Current Limit
Enabled into Short Circuit
–
2.75
–
A
tSHORT
Short-Circuit Response Time
VOUT = 0V to IOUT = ILIMIT (OUT Shorted to Ground)
–
2
–
µs
VIL
EN Input Logic Low Voltage
VIN = 2.7V to 5.5V
–
–
0.8
V
VIH
EN Input Logic High Voltage
VIN = 2.7V to 5.5V
2
–
–
V
ILEAK-EN
EN Input Leakage
VIN = 5V, VEN = 0V and 5.5V
–
0.01
1
µA
ILEAK-O
Output Leakage Current
Disabled, VOUT = 0V
–
0.5
1
µA
tD(ON)
Output Turn-on Delay Time
CL= 1µF, RLOAD = 5Ω
–
0.1
–
ms
tR
Output Turn-on Rise Time
CL= 1µF, RLOAD = 5Ω
–
0.6
1.5
ms
tD(OFF)
Output Turn-off Delay Time
CL= 1µF, RLOAD = 5Ω
–
0.1
–
ms
ms
Output Turn-off Fall Time
CL= 1µF, RLOAD = 5Ω
–
0.05
0.1
RFLG
FLG Output FET On-resistance
IFLG = 10mA
–
20
40
Ω
IFOH
FLG Off Current
–
0.01
1
µA
tBlank
FLG Blanking Time
VFLG = 5V
Assertion or Deassertion due to Overcurrent and Overtemperature Condition
4
7
15
ms
ms
tF
tDIS
Discharge Time
CL= 1µF, VIN = 5V, Disabled to VOUT < 0.5V
–
0.6
–
RDIS
Discharge Resistance (Note 7)
VIN = 5V, Disabled, IOUT = 1mA
–
100
–
Ω
TSHDN
Thermal Shutdown Threshold
Enabled
–
+140
–
C
THYS
Thermal Shutdown Hysteresis
–
–
+20
–
C
SO-8 (Note 8)
–
96
–
C/W
–
130
–
C/W
–
92
–
C/W
–
84
–
–
90
–
C/W
°C/W
θJA
MSOP-8 (Note 8)
Thermal Resistance Junction-toMSOP-8EP (Note 9)
Ambient
U-DFN3030-8 (Type E) (Note 9)
U-DFN2020-6 (Note 10)
Notes:
6. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
7. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when VIN < VUVLO).
The discharge function offers a resistive discharge path for the external storage capacitor for limited time.
8. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.
9. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground
plane.
10. Device mounted on 1" x 1" FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground.
AP2301/AP2311
Document number: DS32241 Rev. 6 - 2
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AP2301/AP2311
Typical Performance Characteristics
VEN
50%
VEN
50%
tD(OFF)
tR
tD(ON)
tD(ON)
90%
VOUT
tD(OFF)
tR
tF
90%
50%
50%
tF
90%
90%
VOUT
10%
10%
10%
10%
Figure 1. Voltage Waveforms: AP2301 (Left), AP2311 (Right)
All Enable Plots are for Enable Active Low
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
TA=25°C
VIN=5V
CL=1µF
ROUT=2.5Ω
VOUT
2V/div
VEN
5V/div
TA=25°C
VIN=5V
CL=1µF
ROUT=2.5Ω
VOUT
2V/div
VEN
5V/div
Device enabled
Device disabled
IIN
1A/div
IIN
1A/div
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
TA=25°C
VIN=5V
CL=120µF
ROUT=2.5Ω
VOUT
2V/div
TA=25°C
VIN=5V
CL=120µF
ROUT=2.5Ω
VOUT
2V/div
VEN
5V/div
Device enabled
Device disabled
VEN
5V/div
IIN
1A/div
Inrush current limit
AP2301/AP2311
Document number: DS32241 Rev. 6 - 2
IIN
1A/div
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AP2301/AP2311
Typical Performance Characteristics (Cont.)
Device Enabled Into Short-Circuit
Inrush Current
TA=25°C
VIN=5V
CL=120µF
ROUT=1Ω
VEN
5V/div
TA=25°C
VIN=5V
ROUT=2.5Ω
VEN
5V/div
CL=120µF
IOUT
1A/div
IOUT
1A/div
Full-Load to Short-Circuit
Transient Response
VOUT
2V/div
Output short
circuited
CL=220µF
CL=470µF
Short-Circuit to Full-Load
Recovery Response
Output short
circuit removed
TA=25°C
VIN=5V
ROUT=2.5Ω
VOUT
2V/div
TA=25°C
VIN=5V
ROUT=2.5Ω
IIN
2A/div
Device turns off and re-enables
into current limit
FLG
5V/div
IIN
2A/div
FLG
5V/div
No-Load to Short-Circuit
Transient Response
VOUT
2V/div
IIN
2A/div
Short circuit present and
device thermal cycles
Output short
circuited
Short-Circuit to No-Load
Recovery Response
Output short
circuit removed
TA=25°C
VIN=5V
ROUT=0Ω
VOUT
2V/div
TA=25°C
VIN=5V
ROUT=0Ω
Device enters current limit
IIN
2A/div
FLG
5V/div
AP2301/AP2311
Document number: DS32241 Rev. 6 - 2
Short circuit present and
device thermal cycles
FLG
5V/div
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AP2301/AP2311
Typical Performance Characteristics (Cont.)
Short-Circuit with Blanking Time and
Recovery
Power ON
FLG
5V/div
FLG
5V/div
TA=25°C
VIN=5V
ROUT=2.5Ω
CL=120µF
IOUT
1A/div
TA=25°C
VIN=5V
VOUT
5V/div
VOUT
5V/div
IOUT
2A/div
VIN
5V/div
UVLO Increasing
VIN
2V/div
UVLO Decreasing
TA=25°C
VIN=5V
ROUT=2.5Ω
CL=120µF
VIN
2V/div
IOUT
2A/div
TA=25°C
VIN=5V
ROUT=2.5Ω
CL=120µF
IOUT
2A/div
AP2301/AP2311
Document number: DS32241 Rev. 6 - 2
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AP2301/AP2311
Typical Performance Characteristics (Cont.)
Turn-off Time vs. Input voltage
Turn-on Time vs. Input voltage
100
Turn-off Time (us)
Turn-on Time (us)
90
80
70
60
50
40
CL=1µF
RL=5Ω
TA=25°C
30
20
10
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
260
240
220
200
180
160
140
120
100
80
60
40
20
0
2.0
2.5
3.5
4.0
4.5
5.0
5.5
6.0
5.5
6.0
Fall Time vs. Input voltage
100
90
80
Fall Time (us)
Rise Time (us)
Rise Time vs. Input voltage
1000
900
800
700
600
500
400
300
200
100
0
2.0
3.0
Input Voltage (V)
Input Voltage (V)
CL=1µF
RL=5Ω
TA=25°C
70
60
50
40
30
20
10
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Document number: DS32241 Rev. 6 - 2
2.5
3.0
3.5
4.0
4.5
5.0
Input Voltage (V)
Input Voltage (V)
AP2301/AP2311
2.0
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AP2301/AP2311
Typical Performance Characteristics (Cont.)
Supply Current,Output Disabled vs. Temperature
Supply Current,Output Enabled vs. Temperature
Supply Current Output Disabled
(uA)
Supply Current Output Enabled
(uA)
100
VIN=5.5V
90
80
VIN=5V
70
60
50
40
VIN=3.3V
VIN=2.7V
30
20
10
0.30
VIN=5.5V
0.25
0.20
VIN=5V
0.15
0.10
0.05
0.00
VIN=3.3V
-0.05
VIN=2.7V
-0.10
-0.15
-0.20
-0.25
-0.30
0
-50
-25
0
25
50
75
100
-50
125
-25
0
Temperature (°C)
50
100
125
3.0
VIN=2.7V
VIN=3.3V
VIN=5V
VIN=5.5V
VIN=2.7V
2.9
VIN=3.3V
2.8
2.7
2.6
VIN=5V
2.5
VIN=5.5V
2.4
2.3
2.2
2.1
2.0
-50
-25
0
25
50
75
100
125
-50
-25
Temperature (°C)
0
25
50
75
100
125
Temperature (°C)
Undervoltage Lockout vs. Temperature
Threshold Trip Current vs. Input Voltage
2.2
3.5
3.4
CL=120µF
TA=25°C
2.1
2.0
Threshold Trip Current (A)
Undervoltage Lockout (V)
75
Short-Circuit Output Current vs. Temperature
Short-Circuit Output Current (A)
RDS(ON) (mΩ)
RDS(ON) vs. Temperature
180
170
160
150
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
25
Temperature (°C)
UVLO Rising
1.9
1.8
UVLO Falling
1.7
3.3
3.2
3.1
3.0
2.9
2.8
2.7
2.6
1.6
-50
-25
0
25
50
75
100
125
2.5
Temperature (°C)
AP2301/AP2311
Document number: DS32241 Rev. 6 - 2
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2.0
2.5
3.0
3.5 4.0 4.5
Input Voltage (V)
5.0
5.5
6.0
May 2016
© Diodes Incorporated
AP2301/AP2311
Application Information
Power Supply Considerations
A 0.1μF to 2.2μF X7R or X5R ceramic bypass capacitor placed between IN and GND, close to the device, is recommended. When an external
power supply is used, or an additional ferrite bead is added to the input, high inrush current may cause voltage spikes higher than the device
maximum input rating during short circuit condition. In this case a 2.2μF or bigger capacitor is recommended. Placing a high-value electrolytic
capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may
cause ringing on the input. Additionally, bypassing the output with a 0.1μF to 1.0μF ceramic capacitor improves the immunity of the device to short
circuit transients.
Over-Current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an over-current condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before V IN
has been applied. The AP2301/AP2311 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher inrush
current may flow for a very short period of time before the current limit function can react. The input capacitor(s) rapidly discharge through the
device, activating current limit circuitry. Protection is achieved by momentarily opening the P-MOS high-side power switch and then gradually
turning it on. After the current limit function has tripped (reached the over-current trip threshold), the device switches into current limiting mode and
the current is clamped at ILIMIT.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2301/AP2311 is capable of delivering current up
to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode
and is set at ILIMIT.
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7ms
deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7ms deglitch timeout.
The AP2301/AP2311 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
PD = RDS(ON)× I2
Finally, calculate the junction temperature:
TJ = PD x RθJA + TA
Where:
TA= Ambient temperature °C
RθJA = Thermal resistance
PD = Total power dissipation
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2301/AP2311 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately +140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal
sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing
the device to cool down approximately +20°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or
input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7ms deglitch.
AP2301/AP2311
Document number: DS32241 Rev. 6 - 2
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AP2301/AP2311
Application Information (Cont.)
Under-Voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 2V, even if
the switch is enabled. Whenever the input voltage falls below approximately 2V, the power switch is quickly turned off. This facilitates the design of
hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Discharge Function
The discharge function of the device is active when enable is disabled or de-asserted. The discharge function with the N-MOS power switch
implementation is activated and offers a resistive discharge path for the external storage capacitor. This is designed for discharging any residue of
the output voltage when either no external output resistance or load resistance is present at the output.
Dual-Purpose Port Applications
The AP2301/AP2311 is not recommended for use in dual-purpose port applications in which a single port is used for data communication between
the host and peripheral devices while simultaneously maintaining a charge to the battery of the peripheral device. An example of such a nonrecommended application is a shared HDMI/MHL (Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box
and a smartphone or tablet while maintaining a charge to the smartphone or tablet battery. Since the AP2301/AP2311 includes an embedded
discharge feature that discharges the output load of the device when the device is disabled, the batteries of the connected peripheral device will be
subject to continual discharge whenever the AP2301/AP2311 is disabled. An overstress condition to the device's discharge MOS transistor may
result. In addition, if the output of the AP2301/AP2311 is subjected to a constant voltage that would be present during a dual-purpose port
application such as MHL, an overstress condition to the device may result.
Ordering Information
AP23X1 X X - X
Product Name
Part Number
AP23X1SG-13
AP23X1M8G-13
AP23X1MPG-13
AP23X1FGEG-7
AP23X1SN-7
Enable
Channel
0 : Active Low
1 : Active High
1 : 1 Channel
Package
Code
Packaging
S
M8
MP
FGE
SN
SO-8
MSOP-8
MSOP-8EP
U-DFN3030-8 (Type E)
U-DFN2020-6
Package
Lead Free
Packing
G/Blank:Green 7 : 7" Tape & Reel
S:
SO-8
M8 : MSOP-8
13 : 13" Tape & Reel
MP : MSOP-8EP
FGE : U-DFN3030-8
(Type E)
SN : U-DFN2020-6
Quantity
7”/13” Tape and Reel
Part Number Suffix
2500/Tape & Reel
2500/Tape & Reel
2500/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
-13
-13
-13
-7
-7
Marking Information
(1)
SO-8
AP2301/AP2311
Document number: DS32241 Rev. 6 - 2
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May 2016
© Diodes Incorporated
AP2301/AP2311
Marking Information (Cont.)
(2)
MSOP-8
(3) MSOP-8EP
(4) U-DFN3030-8 (Type E)
( Top View )
XX
YW X
XX : Identification Code
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Green
Part Number
Package
Identification Code
AP2301FGEG-7
AP2311FGEG-7
U-DFN3030-8 (Type E)
U-DFN3030-8 (Type E)
BB
BC
(5) U-DFN2020-6
( Top View )
XX
YW X
Part Number
AP2301SN-7
AP2311SN-7
AP2301/AP2311
Document number: DS32241 Rev. 6 - 2
XX : Identification Code
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Internal Code
Package
U-DFN2020-6
U-DFN2020-6
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Identification Code
DB
DC
May 2016
© Diodes Incorporated
AP2301/AP2311
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
(1)
Package Type: SO-8
SO-8
Dim
Min
Max
A
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
0.35
L
0.62
0.82

0
8
All Dimensions in mm
(2)
Package Type: MSOP-8
D
4x
10
°
0.25
E Gauge Plane
x
Seating Plane
a
y
4x10°
L
Detail C
1
b
E3
A3
A2
A
e
A1
AP2301/AP2311
Document number: DS32241 Rev. 6 - 2
E1
c
See Detail C
13 of 18
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MSOP-8
Dim Min Max Typ
A
1.10
A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
b 0.22 0.38 0.30
c 0.08 0.23 0.15
D 2.90 3.10 3.00
E 4.70 5.10 4.90
E1 2.90 3.10 3.00
E3 2.85 3.05 2.95
e
0.65
L 0.40 0.80 0.60
a
0°
8°
4°
x
0.750
y
0.750
All Dimensions in mm
May 2016
© Diodes Incorporated
AP2301/AP2311
Package Outline Dimensions (Cont.)
Please see http://www.diodes.com/package-outlines.html for the latest version.
(3)
Package Type: MSOP-8EP
D
4X
10
°
0.25
D1
x
E
E2
Gauge Plane
Seating Plane
a
y
1
4X
10
°
8Xb
e
Detail C
E3
A1
L
A3
c
A2
A
D
E1
See Detail C
(4)
Package Type: U-DFN3030-8 (Type E)
U-DFN3030-8
Type E
Dim Min Max Typ
A
0.57 0.63 0.60
A1
0
0.05 0.02
A3
0.15


b
0.20 0.30 0.25
D
2.95 3.05 3.00
D2 2.15 2.35 2.25
E
2.95 3.05 3.00
e
0.65


E2 1.40 1.60 1.50
L
0.30 0.60 0.45
Z
0.40


All Dimensions in mm
A
A3
A1
D
D2
L (x8)
E
E2
Z (x4)
(5)
MSOP-8EP
Dim Min Max Typ
A
1.10
A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
b
0.22 0.38 0.30
c
0.08 0.23 0.15
D
2.90 3.10 3.00
D1 1.60 2.00 1.80
E
4.70 5.10 4.90
E1 2.90 3.10 3.00
E2 1.30 1.70 1.50
E3 2.85 3.05 2.95
e
0.65
L
0.40 0.80 0.60
a
0°
8°
4°
x
0.750
y
0.750
All Dimensions in mm
e
b (x8)
Package Type: U-DFN2020-6
A1
A3
A
Seating Plane
D
D2
D2/2
R0
E E2
.10
0
E2/2
Pin #1 ID
U-DFN2020-6
Dim Min Max Typ
A
0.57 0.63 0.60
A1
0
0.05 0.03
A3
0.15
b
0.20 0.30 0.25
D
1.95 2.075 2.00
D2 1.45 1.65 1.55
e
0.65
E
1.95 2.075 2.00
E2 0.76 0.96 0.86
L
0.30 0.40 0.35
All Dimensions in mm
L
e
AP2301/AP2311
Document number: DS32241 Rev. 6 - 2
b
14 of 18
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May 2016
© Diodes Incorporated
AP2301/AP2311
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
(1) Package Type: SO-8
X
Dimensions
X
Y
C1
C2
C1
C2
Value (in mm)
0.60
1.55
5.4
1.27
Y
(2) Package Type: MSOP-8
X
C
Y
Dimensions Value (in mm)
C
0.650
X
0.450
Y
1.350
Y1
5.300
Y1
(3) Package type: MSOP-8EP
X
C
Dimensions
C
G
X
X1
Y
Y1
Y2
Y
G
Y2
Y1
X1
AP2301/AP2311
Document number: DS32241 Rev. 6 - 2
15 of 18
www.diodes.com
Value
(in mm)
0.650
0.450
0.450
2.000
1.350
1.700
5.300
May 2016
© Diodes Incorporated
AP2301/AP2311
Suggested Pad Layout (Cont.)
Please see http://www.diodes.com/package-outlines.html for the latest version.
(4) Package Type: U-DFN3030-8 (Type E)
X (x8)
C
Y
(x8)
Y1
Dimensions
C
C1
X
Y
Y1
Y2
Y2
Value (in mm)
0.65
2.35
0.30
0.65
1.60
2.75
C1
(5) Package Type: U-DFN2020-6
X
C
G
Y
Dimensions
C
G
X
X1
Y
Y1
Y1
G
Value
(in mm)
0.65
0.15
0.37
1.67
0.45
0.90
X
X1
AP2301/AP2311
Document number: DS32241 Rev. 6 - 2
16 of 18
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© Diodes Incorporated
AP2301/AP2311
Taping Orientation (Note 11)
For U-DFN2020-6 and U-DFN3030-8 (Type E)
Note:
11. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf
AP2301/AP2311
Document number: DS32241 Rev. 6 - 2
17 of 18
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May 2016
© Diodes Incorporated
AP2301/AP2311
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
www.diodes.com
AP2301/AP2311
Document number: DS32241 Rev. 6 - 2
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© Diodes Incorporated
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