AP25x1A

AP2501A/AP2511A
Green
2.5A SINGLE CHANNEL CURRENT - LIMITED POWER SWITCH
Description
Pin Assignments
The AP2501A and AP2511A are single channel current-limited
integrated high-side power switches optimized for Universal Serial
Bus (USB) and other hot-swap applications. The family of devices
complies with USB standards and is available with both polarities of
Enable input.
The devices have fast short-circuit response time for improved
overall system robustness, and include integrated output discharge
function to ensure completely controlled discharging of the output
voltage capacitor. They provide a complete protection solution for
applications subject to heavy capacitive loads and the prospect of
short circuit, and offer reverse current blocking, over-current, overtemperature and short-circuit protection, as well as controlled rise
time and under-voltage lockout functionality. A 7ms deglitch
capability on the open-drain Flag output prevents false overcurrent
reporting and does not require any external components.
All devices are available in SO-8, MSOP-8,
U-DFN3030-8 and U-DFN2020-6 packages.
(Top View)
GND
IN
IN
EN
8 NC
2
7 OUT
3
6 OUT
4
5 FLG
Applications


















UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified
Moisture Sensitivity: Level 1 per J-STD-020
Notes:
IN
OUT
IN
OUT
EN
FLG
(SO-8)
(Top View)
(Top View)
Features



NC
U-DFN3030-8
Type E
U-DFN2020-6


GND
1
MSOP-8EP,
Single channel current-limited power switch
Output discharge function
Fast short-circuit response time: 2µs
3.7A accurate current limiting (typ)
Reverse current blocking
70mΩ on-resistance (typ)
Input voltage range: 2.7V – 5.5V
Built-in soft-start with 0.6ms typical rise time
Overcurrent and thermal protection
Fault report (FLG) with blanking time (7ms typ)
ESD protection: 2KV HBM, 200V MM
Active low (AP2501A) or active high (AP2511A) enable
Ambient temperature range: -40°C to +85°C
SO-8, MSOP-8, MSOP-8EP, U-DFN3030-8 and U-DFN2020-6:
Available in “Green” Molding Compound (No Br, Sb)
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
(Top View)
GND
1
8
NC
IN
2
7
OUT
IN
EN
3
6
4
5
OUT
FLG
MSOP-8/MSOP-8EP
Note: Latter with exposed pad
(dotted line)
LCD TVs & Monitors
Set-Top-Boxes, Residential Gateways
Laptops, Desktops, Servers, E-Readers
Printers, Docking Stations, HUBs
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
AP2501A/AP2511A
Document number: DS37745 Rev. 4 - 2
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AP2501A/AP2511A
Typical Applications Circuit
Enable Active High (AP2511A)
IN
Power Supply
2.7V to 5.5V
0.1uF
0.1uF
10k
Load
OUT
120uF
FLG
EN
ON
GND
OFF
Available Options
Part Number
Channel
Enable Pin
(EN)
AP2501A
1
Active Low
AP2511A
1
Active High
Recommended Maximum
Continuous Load Current (A)
2.5A
Typical Current Limit
(A)
Package
3.7A
SO-8
MSOP-8
MSOP-8EP
U-DFN3030-8
U-DFN2020-6
Pin Descriptions
Pin Number
SO-8,
MSOP-8
1
Pin Name
MSOP-8EP,
U-DFN3030-8
GND
1
IN
2, 3
2, 3
EN
4
4
FLG
5
5
OUT
NC
6, 7
8
6, 7
8
Exposed Pad
Exposed Pad
Not applicable
AP2501A/AP2511A
Document number: DS37745 Rev. 4 - 2
Function
U-DFN2020-6
2
1
Ground
Voltage Input Pin. Connect a 0.1µF or larger ceramic capacitor from IN to
GND as close as possible. (all IN pins must be tied together externally)
3
Enable Input. Active low (AP2501A) or active high (AP2511A).
Over-temperature and over-current fault reporting with 7ms deglitch; active
4
low open-drain output. FLG is disabled for 7ms after turn-on.
5
Voltage Output Pin (all OUT pins must be tied together externally)
6
No internal connection; recommend tie to OUT pins.
Exposed pad. It should be externally connected to GND and thermal mass for
Exposed Pad enhanced thermal impedance. It should not be used as electrical ground
conduction path.
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November 2015
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AP2501A/AP2511A
Functional Block Diagram
Current
Sense
IN
OUT
Discharge
Control
UVLO
Current
Limit
Driver
EN
FLG
Deglitch
Thermal
Sense
GND
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol
ESD HBM
ESD MM
VIN
VOUT
VEN , VFLG
ILOAD
TJMAX
TST
Notes:
Parameter
Human Body Model ESD Protection
Machine Model ESD Protection
Input Voltage (Note 4)
Output Voltage (Note 4)
Enable Voltage (Note 4)
Maximum Continuous Load Current
Maximum Junction Temperature
Storage Temperature Range (Note 5)
Rating
2
200
-0.3 to +6.5
-0.3 to VIN +0.3 or 6.5
-0.3 to VIN +0.3 0r 6.5
Internal Limited
+150
-65 to +150
Unit
KV
V
V
V
V
A
°C
°C
4. All voltages referred to GND pin. Maximums are the lower of (VIN + 0.3V) and 6.5V.
5. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C).
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings
only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may
be affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and
transporting these devices
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol
Note:
Parameter
VIN
Input Voltage
IOUT
Output Current
VIH
High-Level Input Voltage on EN
VIL
Low-Level Input Voltage on EN
TA
Operating Ambient Temperature (Note 6)
Min
Max
Unit
2.7
5.5
V
0
2.5
A
2.0
VIN
V
0
0.8
V
-40
+85
°C
6. TA(MAX) = +70°C if VIN ≤ 4.1V and IOUT = 2.5A to keep device from going into thermal protection.
AP2501A/AP2511A
Document number: DS37745 Rev. 4 - 2
3 of 19
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AP2501A/AP2511A
Electrical Characteristics
Symbol
VUVLO
ΔVUVLO
ISHDN
IQ
ILEAK
IREV
RDS(ON)
ILIMIT
ITRIG
(@ TA = +25°C, VIN = +5.0V, CIN = 0.1µF, CL = 1µF, unless otherwise specified.)
Parameter
Input UVLO
Input UVLO Hysteresis
Input Shutdown Current
Input Quiescent Current
Input Leakage Current
Reverse Leakage Current
Switch on-Resistance
ISHORT
TSHORT
VIL
VIH
ILEAK-EN
ILEAK-O
TD(ON)
TR
TD(OFF)
TF
RFLG
IFOH
Overload Current Limit (Note 7)
Current Limiting Trigger Threshold
Short-Circuit Current Limit
Short-Circuit Response Time
EN Input Logic Low Voltage
EN Input Logic High Voltage
EN Input Leakage
Output Leakage Current
Output turn-on Delay Time
Output turn-on Rise Time
Output turn-off Delay Time
Output turn-off Fall Time
FLG output FET on-Resistance
FLG Off Current
TBLANK
FLG Blanking Time
TDIS
RDIS
TSHDN
THYS
Discharge Time
Discharge Resistance (Note 8)
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
θJA
Notes:
Thermal Resistance Junction-toAmbient
Conditions (Note 7)
VIN rising
VIN decreasing
Disabled, OUT = open
Enabled, OUT = open
Disabled, OUT grounded
Disabled, VIN = 0V, VOUT = 5V, IREV at VIN
TA = 25oC
VIN = 5V, IOUT = 1A
-40°C ≤ TA ≤ +85°C
TA = 25°C
VIN = 3.3V, IOUT = 1A
-40°C ≤ TA ≤ +85°C
VIN = 5V, VOUT = 4.5V
-40°C≤ TA ≤ +85°C
Output Current Slew rate (<100A/s)
Enabled into short circuit
VOUT = 0V to IOUT = ILIMIT (OUT shorted to ground)
VIN = 2.7V to 5.5V
VIN = 2.7V to 5.5V
VIN = 5V, VEN = 0V and 5.5V
Disabled, VOUT = 0V
CL = 1µF, RLOAD = 5Ω
CL = 1µF, RLOAD = 5Ω
CL = 1µF, RLOAD = 5Ω
CL = 1µF, RLOAD = 5Ω
IFLG = 10mA
VFLG = 5V
Assertion or deassertion due to overcurrent and
over-temperature condition
CL= 1µF, VIN = 5V, disabled to VOUT < 0.5V
VIN = 5V, disabled, IOUT = 1mA
Enabled
-
Min
1.6
2.8
2
-
Typ
2.0
50
0.1
60
0.1
0.01
70
90
3.7
3.7
3.7
2
0.01
0.5
0.1
0.6
0.1
0.05
20
0.01
Max
2.4
0.10
40
1.00
A
A
A
µs
V
V
µA
µA
ms
ms
ms
ms
Ω
µA
4
7
15
ms
-
0.6
105
+140
+20
-
ms
Ω
°C
°C
SO-8 (Note 9)
-
96
-
°C/W
MSOP-8 (Note 9)
-
130
-
°C/W
MSOP-8EP (Note 10)
-
92
-
°C/W
U-DFN3030-8 (Note 10)
U-DFN2020-6 (Note 11)
-
84
90
-
°C/W
°C/W
1.0
100
1.0
1.00
78
105
108
135
4.6
0.8
1.00
1
1.5
Unit
V
mV
µA
µA
µA
µA
mΩ
7. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
8. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when VIN < VUVLO). The
discharge function offers a resistive discharge path for the external storage capacitor for limited time.
9. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.
10. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground
plane.
11. Device mounted on 1" x 1" FR-4 substrate PCB, 2oz copper, with minimum recommended padon top layer and thermal vias to bottom layer ground
plane.
AP2501A/AP2511A
Document number: DS37745 Rev. 4 - 2
4 of 19
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AP2501A/AP2511A
Typical Performance Characteristics
VEN
50%
TD(ON)
TD(ON)
90%
10%
10%
TD(OFF)
TR
TF
90%
50%
50%
TD(OFF)
TR
VOUT
VEN
50%
VOUT
TF
90%
10%
90%
10%
Figure 1 Voltage Waveforms: AP2501A (left), AP2511A (right)
All Enable Plots are for Enable Active Low
Turn-On Delay and Rise Time
Vout
2V/div
Turn-Off Delay and Fall Time
TA=25°C
Vin=5V
CL=1uF
Rout=2.5Ω
Ven
5V/div
TA=25°C
Vin=5V
CL=1uF
Rout=2.5Ω
Vout
2V/div
Ven
5V/div
Device Enable
Device Disable
Iin
1A/div
Iin
1A/div
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
TA=25°C
Vin=5V
CL=120uF
Rout=2.5Ω
Vout
2V/div
TA=25°C
Vin=5V
CL=120uF
Rout=2.5Ω
Vout
2V/div
Ven
5V/div
Device Enable
Ven
5V/div
Device Disable
Iin
1A/div
AP2501A/AP2511A
Document number: DS37745 Rev. 4 - 2
Iin
1A/div
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AP2501A/AP2511A
Typical Performance Characteristics (continued)
Device Enabled Into Short-Circuit
Ven
5V/div
TA=25°C
Vin=5V
CL=120uF
Rout=1Ω
Inrush Current
Ven
5V/div
CL=470uF
CL=220uF
Iin
1A/div
Iin
1A/div
Full-Load to Short-Circuit
Transient Response
CL=120uF
Short-Circuit to Full-Load
Recovery Response
TA=25°C
Vin=5V
Rout=2Ω
Output Short Circuit
Vout
2V/div
TA=25°C
Vin=5V
CL=120uF,220uF,470uF
Rout=2.5Ω
Output Short Circuit Removed
TA=25°C
Vin=5V
Rout=2Ω
Vout
2V/div
Iin
2A/div
Device Turns off and Re-enables
Into Current-Limit
Iin
Short Circuit Present Device
2A/div Thermal Cycles
FLG
5V/div
FLG
5V/div
No-Load to Short-Circuit
Transient Response
Vout
2V/div
Iin
2A/div
Output Short Circuit
TA=25°C
Vin=5V
Short-Circuit to No-Load
Recovery Response
Output Short Circuit Removed
Vout
2V/div
TA=25°C
Vin=5V
Device Enable Current-Limit
FLG
5V/div
AP2501A/AP2511A
Document number: DS37745 Rev. 4 - 2
Iin
2A/div
FLG
5V/div
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Short Circuit Present Device
Thermal Cycles
November 2015
© Diodes Incorporated
AP2501A/AP2511A
Typical Performance Characteristics (cont.)
Power ON
FLG
5V/div
Short-Circuit with Blanking Time and
Recovery
FLG
5V/div
TA=25°C
Vin=5V
Rout=2.5Ω
CL=120uF
Iout
1A/div
TA=25°C
Vin=5V
Vout
5V/div
Vout
5V/div
Iout
2A/div
Vin
5V/div
UVLO Increasing
UVLO Decreasing
Vout
2A/div
Vout
2V/div
TA=25°C
Vin=5V
Rout=33Ω
CL=120uF
Vin
2V/div
TA=25°C
Vin=5V
Rout=33Ω
CL=120uF
Vin
2A/div
AP2501A/AP2511A
Document number: DS37745 Rev. 4 - 2
7 of 19
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AP2501A/AP2511A
150
140
130
120
110
100
90
80
70
60
50
40
30
TURN-ON TIME (µs)
20
10
0
2.0
200
TURN-OFF TIME (µs)
CL = 1µF
3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
Turn-On Time vs. Input Voltage
100
80
60
20
0
6.0
2.0
900
90
800
80
700
70
600
500
400
300
CL = 1µF
200
3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
Rise Time vs. Input Voltage
100
VIN = 5.5V
90
VIN = 5V
70
60
VIN = 2.7V
50
VIN =3.3V
40
30
20
10
0
-50
-25
0
25
50
75
100 125
TEMPERATURE (C)
Supply Current, Output Enabled vs. Temperature
AP2501A/AP2511A
Document number: DS37745 Rev. 4 - 2
3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
Turn-Off Time vs. Input Voltage
6.0
CL = 1µF
RL = 5
TA = 25°C
60
50
40
30
0
2.0
6.0
SUPPLY CURRENT OUTPUT DISABLED (µA)
3.0
3.0
10
0
2.5
2.5
20
RL = 5
TA = 25°C
100
SUPPLY CURRENT OUTPUT ENABLED (µA)
120
40
RL = 5
TA = 25°C
2.5
140
100
80
R L = 5
TA = 25°C
160
1000
2.0
C L = 1µF
180
FALL TIME (µs)
TURN-ON TIME (µs)
Typical Performance Characteristics (cont.)
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2.5
3.0
3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
Rise Time vs. Input Voltage
6.0
0.30
0.25
0.20
VIN = 5.5V
0.15
VIN = 5V
0.10
0.05
0.00
-0.05
VIN = 2.7V
VIN =3.3V
-0.10
-0.15
-0.20
-0.25
-0.30
-50
-25
0
25
50
75
100 125
TEMPERATURE (C)
Supply Current, Output Disabled vs. Temperature
November 2015
© Diodes Incorporated
AP2501A/AP2511A
180
170
160
150
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
-50
SHORT-CIRCUIT OUTPUT CURRENT(A)
R DS(ON) (m)
Typical Performance Characteristics (cont.)
VIN = 2.7V
VIN =3.3V
VIN = 5.5V
VIN = 5V
-25
0
25
50
75
100
TEMPERATURE (C)
RDS(ON) vs. Temperature
4.5
4.4
4.3
4.2
4.1
4.0
3.9
3.8
3.7
3.6
3.5
3.4
33
VIN =3.3V
VIN = 5V
3.2
3.1
3.0
-50
-25
4.5
CL = 120µF
TA = 25°C
2.1
2.0
UVLO Rising
1.9
UVLO Falling
1.8
1.7
THRESHOLD TRIP CURRENT(A)
4.4
UNDERVOLTAGE LOCKOUT (V)
VIN = 5.5V
0
25
50
75
100 125
TEMPERATURE (C)
Short-Circuit Output Current vs. Temperature
125
2.2
1.6
-50
VIN = 2.7V
4.1
4.0
3.9
3.8
3.7
3.6
3.0 3.5 4.0 4.5 5.0 5.5 6.0
INPUT VOLTAGE (V)
Threshold Trip Current vs. Input Voltage
0
25
50
75
100 125
TEMPERATURE (C)
Undervoltage Lockout vs. Temperature
Document number: DS37745 Rev. 4 - 2
4.2
3.5
2.0 2.5
-25
AP2501A/AP2511A
4.3
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AP2501A/AP2511A
Application Note
Power Supply Considerations
A 0.1μF to 2.2μF X7R or X5R ceramic bypass capacitor placed between IN and GND, close to the device, is recommended. When an external
power supply is used, or an additional ferrite bead is added to the input, high inrush current may cause voltage spikes higher than the device
maximum input rating during short circuit condition. In this case a 2.2μF or bigger capacitor is recommended. Placing a high-value electrolytic
capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that
may cause ringing on the input. Additionally, bypassing the output with a 0.1μF to 1.0μF ceramic capacitor improves the immunity of the device
to short circuit transients.
Overcurrent and Short Circuit Protection
An internal sensing FET is employed to check for overcurrent conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the
output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before
VIN has been applied. The AP2501A/AP2511A senses the short circuit and immediately clamps output current to a certain safe level namely
ISHORT.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher inrush
current may flow for a very short period of time before the current limit function can react. The input capacitor(s) rapidly discharge through the
device, activating current limit circuitry. Protection is achieved by momentarily opening the P-MOS high-side power switch and then gradually
turning it on. After the current limit function has tripped (reached the overcurrent trip threshold), the device switches into current limiting mode
and the current is clamped at ILIMIT.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until
the current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2501A/AP2511A is capable of delivering
current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current
limiting mode and is set at ILIMIT.
FLG Response
When an overcurrent or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms
deglitch timeout. The FLG output remains low until both overcurrent and over-temperature conditions are removed.
Connecting a heavy capacitive load to the output of the device can cause a momentary overcurrent condition, which does not trigger the
FLG due to the 7-ms deglitch timeout. The AP2501A/AP2511A is designed to eliminate false overcurrent reporting without the need of external
components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
PD = RDS(ON) × I
2
Finally, calculate the junction temperature:
TJ = PD x RJA + TA
Where:
TA = Ambient temperature °C
RJA = Thermal resistance
PD = Total power dissipation
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2501A/AP2511A implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately 140°C due to excessive power dissipation in an overcurrent or short-circuit condition the internal thermal
sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit
allowing the device to cool down approximately 20°C before the switch turns back on. The switch continues to cycle in this manner until the load
fault or input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or overcurrent occurs with 7-ms
deglitch.
AP2501A/AP2511A
Document number: DS37745 Rev. 4 - 2
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AP2501A/AP2511A
Application Note (continued)
Undervoltage Lockout (UVLO)
Undervoltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 2V,
even if the switch is enabled. Whenever the input voltage falls below approximately 2V, the power switch is quickly turned off. This facilitates the
design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Discharge Function
The discharge function of the device is active when enable is disabled or de-asserted. The discharge function with the N-MOS power switch
implementation is activated and offers a resistive discharge path for the external storage capacitor. This is designed for discharging any residue
of the output voltage when either no external output resistance or load resistance is present at the output.
Dual-Purpose Port Applications
AP2501A/AP2511A requires special consideration for use in dual-purpose port applications in which a single port is used for data communication
between the host and peripheral devices while simultaneously maintaining a charge to the battery of the peripheral device. An example of such
application is a shared HDMI/MHL (Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box and a
smartphone or tablet while maintaining a charge to the smartphone or tablet battery. Since the AP2501A/AP2511A includes an embedded
discharge feature that discharges the output load of the device when the device is disabled, the batteries of the connected peripheral device will
be subject to continual discharge whenever the AP2501A/AP2511A is disabled. An overstress condition to the device's discharge MOS transistor
may result. In addition, if the output of the AP2501A/AP2511A is subjected to a constant voltage that would be present during a dual-purpose port
application such as MHL, an overstress condition to the device may result.
AP2501A/AP2511A
Document number: DS37745 Rev. 4 - 2
11 of 19
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© Diodes Incorporated
AP2501A/AP2511A
Ordering Information
AP25X 1 A X -X
Enable
Channel
0 : Active Low
1 : Active High
1 : 1 Channel
Packing
Package
Part Number
Package Code
Packaging
AP25X1AS-13
AP25X1AM8-13
AP25X1AMP-13
AP25X1AFGE-7
AP25X1ASN-7
S
M8
MP
FGE
SN
SO-8
MSOP-8
MSOP-8EP
U-DFN3030-8
U-DFN2020-6
S:
SO-8
7 : 7" Tape & Reel
M8 : MSOP-8
13 : 13" Tape & Reel
MP : MSOP-8EP
FGE : U-DFN3030-8
7”/13” Tape and Reel
Quantity
Part Number Suffix
2,500/Tape & Reel
-13
2,500/Tape & Reel
-13
2,500/Tape & Reel
-13
3,000/Tape & Reel
-7
3,000/Tape & Reel
-7
Marking Information
(1)
SO-8
( Top view )
8
7
6
5
Logo
Part Number
0 : Active Low
1 : Active High
YY WW XX
2
1
(2)
YY : Year : 08, 09,10~
WW : Week : 01~52; 52
represents 52 and 53 week
X : Internal Code
AP25X 1 A
3
4
MSOP-8
( Top view )
8
7
Logo
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X : Internal Code
AP25X1A
1
Document number: DS37745 Rev. 4 - 2
5
YWX
Part Number
0 : Active Low
1 : Active High
AP2501A/AP2511A
6
2
3
4
12 of 19
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November 2015
© Diodes Incorporated
AP2501A/AP2511A
Marking Information (continued)
(3)
MSOP-8EP
( Top view )
8
7
Logo
5
YWXE
Part Number
0 : Active Low
1 : Active High
AP25X1A
1
(4)
6
2
3
MSOP-8EP
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X : Internal Code
4
U-DFN3030-8
( Top View )
XX
YW X
Part Number
AP2501AFGE-7
AP2511AFGE-7
(5)
XX : Identification Code
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Internal Code
Package
U-DFN3030-8
U-DFN3030-8
Identification Code
5W
5X
U-DFN2020-6
( Top View )
XX
YW X
Part Number
AP2501ASN-7
AP2511ASN-7
AP2501A/AP2511A
Document number: DS37745 Rev. 4 - 2
XX : Identification Code
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Internal Code
Package
U-DFN2020-6
U-DFN2020-6
13 of 19
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Identification Code
5Y
5Z
November 2015
© Diodes Incorporated
AP2501A/AP2511A
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
Package type: SO-8
0.254
1.
E1 E
Gauge Plane
Seating Plane
A1
L
Detail ‘A’
7°~9°
h
45°
Detail ‘A’
A2 A A3
b
e
SO-8
Dim
Min
Max
A
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
0.35
L
0.62
0.82

0
8
All Dimensions in mm
D
2.
Package type: MSOP-8
D
4x
10
°
0.25
E Gauge Plane
x
Seating Plane
a
y
4x10°
L
Detail C
1
b
E3
A3
A2
A
e
A1
AP2501A/AP2511A
Document number: DS37745 Rev. 4 - 2
E1
c
See Detail C
14 of 19
www.diodes.com
MSOP-8
Dim Min Max Typ
A
1.10
A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
b 0.22 0.38 0.30
c 0.08 0.23 0.15
D 2.90 3.10 3.00
E 4.70 5.10 4.90
E1 2.90 3.10 3.00
E3 2.85 3.05 2.95
e
0.65
L 0.40 0.80 0.60
a
0°
8°
4°
x
0.750
y
0.750
All Dimensions in mm
November 2015
© Diodes Incorporated
AP2501A/AP2511A
Package Outline Dimensions (continued) (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
3.
Package type: MSOP-8EP
D
4X
10
°
0.25
D1
x
E
E2
Gauge Plane
Seating Plane
a
y
1
4X
10
°
8Xb
e
Detail C
E3
A1
L
A3
c
A2
A
D
E1
See Detail C
4.
MSOP-8EP
Dim Min Max Typ
A
1.10
A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
b
0.22 0.38 0.30
c
0.08 0.23 0.15
D
2.90 3.10 3.00
D1 1.60 2.00 1.80
E
4.70 5.10 4.90
E1 2.90 3.10 3.00
E2 1.30 1.70 1.50
E3 2.85 3.05 2.95
e
0.65
L
0.40 0.80 0.60
a
0°
8°
4°
x
0.750
y
0.750
All Dimensions in mm
Package type: U-DFN3030-8 Type E
A
A3
U-DFN3030-8
Type E
Dim Min Max Typ
A
0.57 0.63 0.60
A1
0
0.05 0.02
A3
0.15


b
0.20 0.30 0.25
D
2.95 3.05 3.00
D2 2.15 2.35 2.25
E
2.95 3.05 3.00
e
0.65


E2 1.40 1.60 1.50
L
0.30 0.60 0.45
Z
0.40


All Dimensions in mm
A1
D
D2
L (x8)
E
E2
Z (x4)
5.
e
b (x8)
Package type: U-DFN2020-6
A1
A3
A
Seating Plane
D
D2
D2/2
R0
E E2
0
.10
E2/2
Pin #1 ID
U-DFN2020-6
Dim Min Max Typ
A
0.57 0.63 0.60
A1
0
0.05 0.03
A3

 0.15
b
0.20 0.30 0.25
D
1.95 2.075 2.00
D2 1.45 1.65 1.55
e

 0.65
E
1.95 2.075 2.00
E2
0.76 0.96 0.86
L
0.30 0.40 0.35
All Dimensions in mm
L
e
AP2501A/AP2511A
Document number: DS37745 Rev. 4 - 2
b
15 of 19
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November 2015
© Diodes Incorporated
AP2501A/AP2511A
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) Package type: SO-8
X
Dimensions
X
Y
C1
C2
C1
C2
Value (in mm)
0.60
1.55
5.4
1.27
Y
(2) Package type: MSOP-8
X
C
Y
Dimensions Value (in mm)
C
0.650
X
0.450
Y
1.350
Y1
5.300
Y1
(3) Package type: MSOP-8EP
X
C
Dimensions
C
G
X
X1
Y
Y1
Y2
Y
G
Y2
Y1
X1
AP2501A/AP2511A
Document number: DS37745 Rev. 4 - 2
16 of 19
www.diodes.com
Value
(in mm)
0.650
0.450
0.450
2.000
1.350
1.700
5.300
November 2015
© Diodes Incorporated
AP2501A/AP2511A
Suggested Pad Layout (continued)
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(4) Package type: U-DFN3030-8 Type E
X (x8)
C
Y
(x8)
Y1
Dimensions
C
C1
X
Y
Y1
Y2
Y2
Value (in mm)
0.65
2.35
0.30
0.65
1.60
2.75
C1
(5) Package type: U-DFN2020-6
X
C
G
Y
Dimensions
C
G
X
X1
Y
Y1
Y1
Value
(in mm)
0.65
0.15
0.37
1.67
0.45
0.90
G
X
X1
AP2501A/AP2511A
Document number: DS37745 Rev. 4 - 2
17 of 19
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November 2015
© Diodes Incorporated
AP2501A/AP2511A
Taping Orientation (Note 12)
For U-DFN2020-6 and U-DFN3030-8 Type E
Note:
12. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf.
AP2501A/AP2511A
Document number: DS37745 Rev. 4 - 2
18 of 19
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November 2015
© Diodes Incorporated
AP2501A/AP2511A
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
www.diodes.com
AP2501A/AP2511A
Document number: DS37745 Rev. 4 - 2
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© Diodes Incorporated
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