AP2161D/AP2171D Green Description 1A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH WITH OUTPUT DISCHARGE Pin Assignments The AP2161D and AP2171D are integrated high-side power switches optimized for Universal Serial Bus (USB) and other hot-swap applications. The family of devices complies with USB 2.0 and is available with both polarities of Enable input. They offer current and thermal limiting and short circuit protection as well as controlled rise time and undervoltage lockout functionality. A 7ms deglitch capability on the open-drain Flag output prevents false over-current reporting and does not require any external components. ( Top View ) GND 1 8 NC IN 2 7 OUT IN 3 6 OUT EN 4 5 FLG All devices are available in SOT25, SO-8, MSOP-8, MSOP-8EP, and U-DFN2018-6 packages. SO-8 Features • • • Single USB Port Power Switches with Output Discharge Over-Current and Thermal Protection 1.5A Accurate Current Limiting Fast Transient Response Reverse Current Blocking 90mΩ On-Resistance Input Voltage Range: 2.7V – 5.5V 0.6ms Typical Rise Time Very Low Shutdown Current: 1µA (max) Fault Report (FLG) with Blanking Time (7ms typ) ESD Protection: 4kV HBM, 300V MM Active High (AP2171D) or Active Low (AP2161D) Enable Ambient Temperature Range -40°C to +85°C SOT25, SO-8, MSOP-8, MSOP-8EP (Exposed Pad), and U-DFN2018-6: Available in “Green” Molding Compound (No Br, Sb) Lead-Free Finish; RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) • • UL Recognized, File Number E322375 IEC60950-1 CB Scheme Certified • • • • • • • • • • • • • • ( Top View ) 8 NC IN 2 7 OUT IN 3 6 OUT EN 4 5 FLG ( Top View ) OUT 1 GND 2 FLG 3 5 IN 4 EN SOT25 ( Top View ) Consumer Electronics – LCD TVs & Monitors, Game Machines Communications – Set-Top-Boxes, GPS, Smartphones Computing – Laptops, Desktops, Servers, Printers, Docking Stations, HUBs Notes: 1 MSOP-8 / MSOP-8EP Note: Latter with Exposed Pad (Dotted Line) Applications • • • GND GND 1 6 OUT IN 2 5 OUT EN 3 4 FLG U-DFN2018-6 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. AP2161D/AP2171D Document number: DS32250 Rev. 6 - 2 1 of 19 www.diodes.com March 2015 © Diodes Incorporated AP2161D/AP2171D Typical Applications Circuit AP2171D Enable Active High IN Power Supply 2.7V to 5.5V 10k 0.1uF 0.1uF 10uF Load OUT 120uF FLG ON EN GND OFF Available Options Enable Pin (EN) Current Limit (Typical) Recommended Maximum Continuous Load Current Part Number Channel AP2161D 1 Active Low 1.5A 1A AP2171D 1 Active High 1.5A 1A Pin Descriptions Pin Name Pin Number SO-8 MSOP-8 MSOP-8EP SOT25 U-DFN2018-6 Functions GND 1 1 2 1 IN 2, 3 2, 3 5 2 Voltage input pin (all IN pins must be tied together externally) EN 4 4 4 3 FLG 5 5 3 4 Enable input, active low (AP2161D) or active high (AP2171D) Over-current and over-temperature fault report; open-drain flag is active low when triggered OUT 6, 7 6, 7 1 5, 6 NC 8 8 N/A N/A Exposed tab - Exposed tab AP2161D/AP2171D Document number: DS32250 Rev. 6 - 2 - Exposed tab Ground Voltage output pin (all OUT pins must be tied together externally) No internal connection; recommend tie to OUT pins Exposed pad. It should be connected to GND and thermal mass for enhanced thermal impedance. It should not be used as electrical ground conduction path. 2 of 19 www.diodes.com March 2015 © Diodes Incorporated AP2161D/AP2171D Functional Block Diagram Current Sense IN OUT Discharge Control UVLO Driver EN Current Limit FLG Deglitch Thermal Sense GND Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol Ratings Unit 4 kV Machine Model ESD Protection 300 V Input Voltage 6.5 V Human Body Model ESD Protection ESD MM VIN VOUT Output Voltage VIN +0.3 V VEN , VFLG Enable Voltage 6.5 V ILOAD Maximum Continuous Load Current TJMAX Maximum Junction Temperature TST Note: Parameter ESD HBM Internal Limited A 150 °C -65 to +150 °C Storage Temperature Range (Note 4) 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C). Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter Min Max 2.7 5.5 V Output Current 0 1.0 A VIN Input Voltage IOUT Unit VIL EN Input Logic Low Voltage 0 0.8 V VIH EN Input Logic High Voltage 2 VIN V TA Operating Ambient Temperature -40 +85 °C AP2161D/AP2171D Document number: DS32250 Rev. 6 - 2 3 of 19 www.diodes.com March 2015 © Diodes Incorporated AP2161D/AP2171D Electrical Characteristics (@TA = +25°C, VIN = +5.0V, unless otherwise specified.) Symbol Min Typ Max VUVLO Input UVLO Parameter — Test Conditions 1.6 1.9 2.5 Unit V ISHDN Input Shutdown Current Disabled, IOUT = 0 — 0.5 1 µA IQ Input Quiescent Current Enabled, IOUT = 0 — 45 70 µA ILEAK Input Leakage Current Disabled, OUT grounded — 0.1 1 µA IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN — 0.1 1 µA — 95 115 RDS(ON) ISHORT ILIMIT SOT25, MSOP-8, TA = +25°C MSOP-8EP, SO-8 U-DFN2018-6 VIN = 5V, IOUT= 1A — 90 110 -40°C ≤ TA ≤ +85°C — — 140 VIN = 3.3V, IOUT= TA = +25°C 1A -40°C ≤ TA ≤ +85°C — 120 140 — — 170 Short-Circuit Current Limit Enabled into short circuit, CL = 22µF — 1.2 — Over-Load Current Limit VIN = 5V, VOUT = 4.0V, CL = 120µF, -40°C ≤ TA ≤ +85°C 1.1 1.5 1.9 A Switch On-Resistance mΩ A ITrig Current Limiting Trigger Threshold Output Current Slew rate (<100A/s) , CL = 22µF — 2.0 — A VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V — — 0.8 V VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V 2 — — V EN Input Leakage VEN = 5V — — 1 µA Output Turn-On Delay Time CL = 1µF, RLOAD = 10Ω — 0.05 — ms ISINK TD(ON) TR Output Turn-On Rise Time CL = 1µF, RLOAD = 10Ω — 0.6 1.5 ms TD(OFF) Output Turn-Off Delay Time CL = 1µF, RLOAD = 10Ω — 0.05 — ms Output Turn-Off Fall Time CL = 1µF, RLOAD = 10Ω — 0.05 0.1 ms RFLG FLG Output FET On-Resistance IFLG = 10mA — 20 40 Ω TBlank FLG Blanking Time CIN = 10µF, CL = 22µF 4 7 15 ms RDIS Discharge Resistance (Note 5) VIN = 5V, disabled, IOUT = 1mA — 100 — Ω TDIS Discharge Time CL = 1µF, VIN = 5V, disabled to VOUT < 0.5V — 0.6 — ms TSHDN Thermal Shutdown Threshold Enabled, RLOAD = 1kΩ — 140 — °C THYS Thermal Shutdown Hysteresis °C TF θJA Notes: Thermal Resistance Junction-toAmbient — — 25 — SOT25 (Note 6) — 170 — SO-8 (Note 6) MSOP-8 (Note 6) — — 127 118 — — MSOP-8EP (Note 7) U-DFN2018-6 (Note 7) — — 67 70 — — °C/W 5. The discharge function is active when the device is disabled (when enable is de-asserted). The discharge function offers a resistive discharge path for the external storage capacitor. 6. Device mounted on FR-4 4 substrate PCB, 2oz copper, with minimum recommended pad layout. 7. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane. AP2161D/AP2171D Document number: DS32250 Rev. 6 - 2 4 of 19 www.diodes.com March 2015 © Diodes Incorporated AP2161D/AP2171D Typical Performance Characteristics VEN 50% 50% VEN 50% 50% TD(OFF) OFF) TR TD(ON) ON) 50% 50% TD(OFF) OFF) TR TF 90% 90% 50% 50% TF TD(ON) ON) 90% 90% VOUT 90% 90% 90% 90% VOUT 10% 10% 10% 10% 10% 10% 10% 10% Figure 1 Voltage Waveforms: AP2161D (left), AP2171D (right) All Enable Plots are for AP2171D Active High Turn-On Delay and Rise Time Turn-Off Delay and Fall Time VEN 5V/div VEN 5V/div VOUT 2V/div CL =1µF TA = +25°C RL = 10Ω CL = 1µF TA = +25°C RL = 10Ω VOUT 2V/div 100µs/div 100µs/div Turn-On Delay and Rise Time Turn-Off Delay and Fall Time VEN 5V/div VEN 5V/div VOUT 2V/div CL = 120µF TA = +25°C RL = 10Ω CL = 120µF TA = +25°C RL = 10Ω VOUT 2V/div 500µs/div AP2161D/AP2171D Document number: DS32250 Rev. 6 - 2 500µs/div 5 of 19 www.diodes.com March 2015 © Diodes Incorporated AP2161D/AP2171D Typical Performance Characteristics (continued) Short Circuit with Blanking Time and Recovery Short Circuit Current, VOUT 5V/div VFLAG 2V/div Device Enabled Into Short VEN 5V/div VIN = 5V TA = +25°C CL = 22µF IOUT 500mA/d iv VIN = 5V TA = +25°C CL = 22µF IOUT 1A/div 20ms/div 100µs/div 1Ω Load Connected to Enabled Device VFLAG 2V/div 2Ω Load Connected to Enabled Device VIN = 5V TA = +25°C CL = 22µF IOUT 1A/div VFLAG 2V/div VIN = 5V TA = +25°C CL = 22µF IOUT 1A/div 1ms/div AP2161D/AP2171D Document number: DS32250 Rev. 6 - 2 1ms/div 6 of 19 www.diodes.com March 2015 © Diodes Incorporated AP2161D/AP2171D Typical Performance Characteristics (cont.) Power On TA = +25°C CL = 120µF RL = 10Ω VFLAG 5V/div Power Off VFLAG 5V/div TA = +25°C CL = 120µF RL = 10Ω IOUT 500mA/d iv IOUT 500mA/d iv VEN 5V/div VEN 5V/div VOUT 5V/div VOUT 5V/div 2ms/div 20ms/div UVLO Increasing TA = +25°C CL = 22µF RL = 10Ω UVLO Decreasing TA = +25°C CL = 22µF RL = 10Ω VIN 2V/div VIN 2V/div IOUT 500mA/div IOUT 500mA/d iv 2ms/div 20ms/div Discharge Time No Load Resistance Inrush Current VIN = 5V TA = +25°C RL = 10Ω CL=680µF TA = +25°C VIN = 5V No Load VOUT 2V/div CL = 470µF CL=220µF IIN 400mA/d CL=100µF CL = 120µF VEN 2V/div CL=22µF VEN 5V/div 1ms/div 100ms/div AP2161D/AP2171D Document number: DS32250 Rev. 6 - 2 7 of 19 www.diodes.com March 2015 © Diodes Incorporated AP2161D/AP2171D Typical Performance Characteristics (cont.) Turn-Off Time vs Input Voltage 800 31 700 31 600 Turn-Off Time (us) Turn-On Time (us) Turn-On Time vs Input Voltage 500 400 CL = 1µF RL = 10Ω TA = 25°C 300 200 30 CL = 1µF RL = 10Ω TA = +25°C 30 29 29 28 100 28 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 1.5 6 2 2.5 3 25 500 24 400 23 Fall Time (us) Rise Time (us) 600 300 CL = 1µF RL = 10Ω TA = +25°C 100 4.5 5 5.5 6 22 CL = 1µF RL = 10Ω TA = +25°C 21 20 19 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 1.5 6 2 2.5 3 3.5 4 4.5 5 5.5 6 Input Voltage (V) Input Voltage (V) Supply Current, Output Enabled vs Ambient Temperature Supply Current, Output Disabled vs Ambient Temperature 1.60 Supply Current, Output Disabled (uA) 65 Supply Current, Output Enabled (uA) 4 Fall Time vs Input Voltage Rise Time vs Input Voltage 200 3.5 Input Voltage (V) Input Voltage (V) 60 VIN = 5.0V 55 VIN = 5.5V 50 45 VIN = 2.7V 40 VIN = 3.3V 35 VIN = 5.5V 1.40 1.20 VIN = 5.0V 1.00 VIN = 3.3V 0.80 0.60 VIN = 2.7V 0.40 0.20 0.00 30 -60 -40 -20 0 20 40 60 80 100 -45 AP2161D/AP2171D Document number: DS32250 Rev. 6 - 2 -25 -5 15 35 55 75 95 Ambient Temperature (°C) Ambient Temperature (°C) 8 of 19 www.diodes.com March 2015 © Diodes Incorporated AP2161D/AP2171D Typical Performance Characteristics (cont.) Static Drain-Source On-State Resistance vs Ambient Temperature Short-Circuit Output Current vs Ambient Temperature 710 Short-Circuit Output Current (mA) 200 Static Drain-Source On-State Resistance (mΩ) 190 180 VIN = 2.7V 170 VIN = 3.3V 160 150 140 130 120 110 VIN = 5V 100 -60 -40 -20 0 20 40 60 80 700 VIN = 2.7V 690 VIN = 3.3V VIN = 5.0V 680 670 660 650 640 VIN = 5.5V 630 100 -60 -40 -20 Ambient Temperature (°C) 0 20 40 60 80 100 Ambient Temperature (°C) Undervoltage Lockout vs Ambient Temperature Threshold Trip Current vs Input Voltage 1.15 2.05 Threshold Trip Current (A) Undervoltage Lockout (V) 2.04 2.03 UVLO Rising 2.02 2.01 2.00 1.99 UVLO Falling 1.98 1.97 1.14 1.13 1.12 TA = +25°C CL = 22µF 1.11 1.96 1.10 1.95 -60 -40 -20 0 20 40 60 80 100 2.8 AP2161D/AP2171D Document number: DS32250 Rev. 6 - 2 3.3 3.8 4.3 4.8 5.3 Input Voltage (V) Ambient Temperature (°C) 9 of 19 www.diodes.com March 2015 © Diodes Incorporated AP2161D/AP2171D Application Note The AP2161D and AP2171D are integrated high-side power switches optimized for Universal Serial Bus (USB) that require protection functions. The power switches are equipped with a driver that controls the gate voltage and incorporates slew-rate limitation. This, along with the various protection features and special functions, makes these power switches ideal for hot-swap or hot-plug applications. Protection Features: Undervoltage Lockout (UVLO) Undervoltage lockout function (UVLO) guarantees that the internal power switch is initially off during start-up. The UVLO functions only when the switch is enabled. Even if the switch is enabled, the switch is not turned ON until the power supply has reached at least 1.9V. Whenever the input voltage falls below approximately 1.9V, the power switch is turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Over-current and Short Circuit Protection An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an over-current condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. The different overload conditions and the corresponding response of the AP2161D/2171D are outlined below: S.NO 1 Conditions Short circuit condition at start-up Explanation Output is shorted before input voltage is applied or before the part is enabled Behavior of the AP2161D/2171D The IC senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT. 2 Short-circuit or over-current condition Short-Circuit or Overload condition that occurs when the part is enabled. • At the instance the overload occurs, higher current may flow for a very short period of time before the current limit function can react. • After the current limit function has tripped (reached the overcurrent trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT. 3 Gradual increase from nominal operating current to ILIMIT Load increases gradually until the current-limit threshold.(ITRIG) The current rises until ITRIG or thermal limit. Once the threshold has been reached, the device switches into its current limiting mode and is set at ILIMIT. Note that when the output has been shorted to GND at an extremely low temperature (< -30°C), a minimum 120-µF electrolytic capacitor on the output pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature characteristics of less than a 10% variation of capacitance change when operated at extremely low temperatures. Our recommended aluminum electrolytic capacitor type is Panasonic FC series. Thermal Protection Thermal protection prevents the IC from damage when the die temperature exceeds safe margins. This mainly occurs when heavy-overload or short-circuit faults are present for extended periods of time. The AP2161D/AP2171D implements thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately 140°C, the Thermal protection feature gets activated as follows: The internal thermal sense circuitry turns the power switch off and the FLG output is asserted thus preventing the power switch from damage. Hysteresis in the thermal sense circuit allows the device to cool down to approximately 25°C before the output is turned back on. The built-in thermal hysteresis feature avoids undesirable oscillations of the thermal protection circuit. The switch continues to cycle in this manner until the load fault is removed, resulting in a pulsed output. The FLG open-drain output is asserted when an over-current occurs with 7-ms deglitch. Reverse Current Protection In a normal MOSFET switch, current can flow in reverse direction (from the output side to the input side) when the output side voltage is higher than the input side, even when the switch is turned off. A reverse-current blocking feature is implemented in the AP21x1 series to prevent such back currents. This circuit is activated by the difference between the output voltage and the input voltage. When the switch is disabled, this feature blocks reverse current flow from the output back to the input. AP2161D/AP2171D Document number: DS32250 Rev. 6 - 2 10 of 19 www.diodes.com March 2015 © Diodes Incorporated AP2161D/AP2171D Application Note (continued) Special Functions: Discharge Function When enable is de-asserted, the discharge function is active. The output capacitor is discharged through an internal NMOS that has a discharge resistance of 100Ω. Hence, the output voltage drops down to zero. The time taken for discharge is dependent on the RC time constant of the resistance and the output capacitor. FLG Response The FLG open-drain output goes active low for any of the two conditions: Over-Current or Over-Temperature. The time from when a fault condition is encountered to when the FLG output goes low is 7-ms (TYP). The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary Over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout. The 7-ms timeout is also applicable for Over-current recovery and Thermal recovery. The AP2161D/AP2171D are designed to eliminate erroneous Over-current reporting without the need for external components, such as an RC delay network. Applications Information: Power Supply Considerations A 0.01-µF to 0.1-µF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. This limits the input voltage drop during line transients. Placing a high-value electrolytic capacitor on the input (10-µF minimum) and output pin(s) is recommended when the output load is heavy. This precaution also reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-µF to 0.1-µF ceramic capacitor improves the immunity of the device to short-circuit transients. This capacitor also prevents output from going negative during turn-off due to inductive parasitics. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: PD = RDS(ON)× I2 The junction temperature can be calculated by: TJ = PD x RθJA + TA Where: TA = Ambient Temperature °C RθJA = Thermal Resistance PD = Total Power Dissipation Generic Hot-Plug Applications In many applications it may be necessary to remove modules or PC boards while the main unit is still operating. These are considered hot-plug applications. Such implementations require the control of current surges as seen by the main power supply and the card being inserted. The most effective way to control these surges is to limit and slowly ramp up the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Due to the controlled rise and fall times of the AP2161D/AP2171D, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2161D/AP2171D also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion. By placing the AP2161D/AP2171D between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls the system surge current and provides a hot-plugging mechanism for any device. AP2161D/AP2171D Document number: DS32250 Rev. 6 - 2 11 of 19 www.diodes.com March 2015 © Diodes Incorporated AP2161D/AP2171D Application Note (cont.) Dual-Purpose Port Applications AP2161D/AP2171D is not recommended for use in dual-purpose port applications in which a single port is used for data communication between the host and peripheral devices while simultaneously maintaining a charge to the battery of the peripheral device. An example of such a nonrecommended application is a shared HDMI/MHL (Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box and a smartphone or tablet while maintaining a charge to the smartphone or tablet battery. Since the AP2161D/AP2171D includes an embedded discharge feature that discharges the output load of the device when the device is disabled, the batteries of the connected peripheral device will be subject to continual discharge whenever the AP2161D/AP2171D is disabled. An overstress condition to the device's discharge MOS transistor may result. In addition, if the output of the AP2161D/AP2171D is subjected to a constant voltage that would be present during a dual-purpose port application such as MHL, an overstress condition to the device may result. Ordering Information AP 21 X 1 D XX G - X Enable Channel Package Green Packing 6 : Active Low 7 : Active High 1 : 1 Channel S : SO-8 M8 : MSOP-8 MP : MSOP-8EP W : SOT25 FM : U-DFN2018-6 G : Green 7/13 : Tape & Reel Part Number Package Code Packaging AP21X1DSG-13 AP21X1DM8G-13 AP21X1DMPG-13 AP21X1DWG-7 AP21X1DFMG-7 S M8 MP W FM SO-8 MSOP-8 MSOP-8EP SOT25 U-DFN2018-6 Quantity 7”/13” Tape and Reel Part Number Suffix 2,500/Tape & Reel 2,500/Tape & Reel 2,500/Tape & Reel 3,000/Tape & Reel 3,000/Tape & Reel -13 -13 -13 -7 -7 Marking Information (1) SO-8 ( Top View ) 8 7 6 5 1 : 1 Channel YY : Year : 08, 09,10~ WW : Week : 01~52; 52 represents 52 and 53 week X : Internal Code G : Green Logo Part Number 6 : Active Low 7 : Active High AP21X X D YY WW X X 1 AP2161D/AP2171D Document number: DS32250 Rev. 6 - 2 2 3 4 12 of 19 www.diodes.com March 2015 © Diodes Incorporated AP2161D/AP2171D (2) MSOP-8 ( Top view ) 8 7 6 5 A~Z : Green X : Internal Code Logo Logo YWX Y Year: :0~9 0~9 Y :: Year W Week: :A~Z A~Z: 1~26 : 1~26week; week; W : Week a~z :: 27~52 27~52week; week; z represents z represents 52 and53 53week week 52 and 11 : 11 Channel Channel AP21 X AP23 X1 D PartNumber Number Part Active Low 06::Active Low Active High 17: :Active High 2 1 3 4 Marking Information (continued) (3) MSOP-8EP ( Top view ) 8 7 6 Logo YWXE AP21 AP23XX11 D PartNumber Number Part 6 :: Active 0 Active Low Low 7 : Active 1 Active High High 1 (4) 5 2 3 4 A~Z : Green X : Internal Code MSOP-8-EP MSOP-8EP Y Year :: 0~9 0~9 Y :: Year W A~Z :: 1~26 1~26week; week; W :: Week Week :: A~Z a~z 27~52 week; week;zzrepresents represents a~z :: 27~52 52 and 53 53 week week 52 and 11 :: 1 1 Channel Channel SOT25 ( Top View ) 4 7 5 XX Y W X 1 (5) 2 3 XX : Identification code Y : Year 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Green Device Package Type Identification Code AP2161DW AP2171DW SOT25 SOT25 JC JD Device Package Type Identification Code AP2161DFM AP2171DFM U-DFN2018-6 U-DFN2018-6 JC JD U-DFN2018-6 AP2161D/AP2171D Document number: DS32250 Rev. 6 - 2 13 of 19 www.diodes.com March 2015 © Diodes Incorporated AP2161D/AP2171D Package Outline Dimensions (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. SO-8 0.254 (1) E1 E A1 L Gauge Plane Seating Plane Detail ‘A’ 7°~9° h 45° Detail ‘A’ A2 A A3 b e D (2) SO-8 Dim Min Max A 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25 b 0.3 0.5 D 4.85 4.95 E 5.90 6.10 E1 3.85 3.95 e 1.27 Typ h 0.35 L 0.62 0.82 0° 8° θ All Dimensions in mm MSOP-8 MSOP-8 Dim Min Max Typ A 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E3 2.85 3.05 2.95 e 0.65 L 0.40 0.80 0.60 a 0° 8° 4° x 0.750 y 0.750 All Dimensions in mm D 4x 10 ° 0.25 E Gauge Plane x Seating Plane a y 4x10° L Detail C 1 b E3 A3 A2 A e E1 A1 (3) c See Detail C MSOP-8EP D x E E2 4X 10 ° 0.25 D1 Gauge Plane Seating Plane a y 1 4X 10 ° 8Xb e Detail C E3 A1 A3 L c A2 A D E1 See Detail C AP2161D/AP2171D Document number: DS32250 Rev. 6 - 2 14 of 19 www.diodes.com MSOP-8EP Dim Min Max Typ A 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 D1 1.60 2.00 1.80 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E2 1.30 1.70 1.50 E3 2.85 3.05 2.95 e 0.65 L 0.40 0.80 0.60 a 0° 8° 4° x 0.750 y 0.750 All Dimensions in mm March 2015 © Diodes Incorporated AP2161D/AP2171D Package Outline Dimensions (cont.) (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. (4) SOT25 A B C H K J (5) M N L D SOT25 Dim Min Max Typ A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D 0.95 H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40 M 0.10 0.20 0.15 N 0.70 0.80 0.75 0° 8° α All Dimensions in mm U-DFN2018-6 A3 A SEATING PLANE U-DFN2018-6 Dim Min Max Typ A 0.545 0.605 0.575 A1 0 0.05 0.02 A3 0.13 b 0.15 0.25 0.20 D 1.750 1.875 1.80 D2 1.30 1.50 1.40 e 0.50 E 1.95 2.075 2.00 E2 0.90 1.10 1.00 L 0.20 0.30 0.25 z 0.30 All Dimensions in mm A1 Pin#1 ID D D2 L E2 E z e AP2161D/AP2171D Document number: DS32250 Rev. 6 - 2 b 15 of 19 www.diodes.com March 2015 © Diodes Incorporated AP2161D/AP2171D Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (1) SO-8 X Dimensions X Y C1 C2 C1 Value (in mm) 0.60 1.55 5.4 1.27 C2 Y (2) MSOP-8 X C Y Dimensions Value (in mm) C 0.650 X 0.450 Y 1.350 Y1 5.300 Y1 (3) MSOP-8-EP X C G Y2 Y Dimensions Y1 C G X X1 Y Y1 Y2 X1 AP2161D/AP2171D Document number: DS32250 Rev. 6 - 2 16 of 19 www.diodes.com Value (in mm) 0.650 0.450 0.450 2.000 1.350 1.700 5.300 March 2015 © Diodes Incorporated AP2161D/AP2171D Suggested Pad Layout (continued) Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (4) SOT25 C2 C2 Dimensions Value (in mm) 3.20 Z Z C1 G Y X (5) G 1.60 X 0.55 Y 0.80 C1 C2 2.40 0.95 U-DFN2018-6 X C Y Y1 G Dimensions C G X X1 Y Y1 Value (in mm) 0.50 0.20 0.25 1.60 0.35 1.20 X1 AP2161D/AP2171D Document number: DS32250 Rev. 6 - 2 17 of 19 www.diodes.com March 2015 © Diodes Incorporated AP2161D/AP2171D Taping Orientation (Note 8) For U-DFN2018-6 Note: 8. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf AP2161D/AP2171D Document number: DS32250 Rev. 6 - 2 18 of 19 www.diodes.com March 2015 © Diodes Incorporated AP2161D/AP2171D IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. 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LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2015, Diodes Incorporated www.diodes.com AP2161D/AP2171D Document number: DS32250 Rev. 6 - 2 19 of 19 www.diodes.com March 2015 © Diodes Incorporated