516AA

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WDFN10 2.5x2, 0.5P
CASE 516AA−01
ISSUE C
DATE 06 FEB 2007
SCALE 4:1
D
PIN ONE
REFERENCE
0.10 C
2X
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
B
ÍÍÍ
ÍÍÍ
ÍÍÍ
E
DIM
A
A1
A3
b
D
D2
D3
e
E
E2
G
G1
K
L
0.10 C
2X
A3
0.10 C
A
10X
0.08 C
A1
C
0.10 C A
MAX
0.80
0.05
0.30
1.18
0.78
1.00
−−−
0.40
GENERIC
MARKING DIAGRAM*
B G1
D3
0.05 C
10X
SEATING
PLANE
MILLIMETERS
MIN
NOM
0.70
0.75
0.00
−−−
0.20 REF
0.20
0.25
2.50 BSC
0.97
1.08
0.57
0.68
0.50 BSC
2.00 BSC
0.80
0.90
0.375 BSC
0.35 BSC
0.20
−−−
0.20
0.30
D2
L
1
XXXM
G
K
5
XXX
M
G
E2
10
8X
0.10 C A
b
B
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
6
e
G
10X
0.10 C A
0.05 C
0.05 C
= Specific Device Code
= Date Code
= Pb−Free Package
B
NOTE 3
SOLDERING FOOTPRINT*
2.50
10X
0.58
0.95
1.13
10X
0.30
0.50
PITCH
0.05
0.73
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON21397D
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
WDFN10 2.5X2, 0.5P
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON21397D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY C. GIOIA.
19 JAN 2006
A
ADDED NOMINAL VALUES AND MODIFIED DIMENSIONS. MODIFIED SOLDERING FOOTPRINT VALUES. ADDED MARKING DIAGRAM. REQ. BY W. CLEMENS.
27 NOV 2006
B
MODIFIED SOLDERING FOOTPRINT VALUES. REQ. BY W. CLEMENS.
23 JAN 2007
C
CORRECTED G AND G1 VALUES TO 0.375 & 0.35 RESPECTIVELY. REQ. BY W.
CLEMENS.
06 FEB 2007
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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© Semiconductor Components Industries, LLC, 2007
February, 2007 − Rev. 01B
Case Outline Number:
516AA
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