511BK

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WDFN10 3x3, 0.5P
CASE 511BK−01
ISSUE O
1
SCALE 4:1
D
DATE 11 MAY 2010
L
A B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L1
PIN ONE
REFERENCE
2X
0.10 C
2X
0.10 C
ÍÍÍ
ÍÍÍ
ÍÍÍ
DETAIL A
E
ALTERNATE TERMINAL
CONSTRUCTIONS
ÉÉ
ÇÇÇ
ÉÉÉ
ÇÇ ÇÇÇ
EXPOSED Cu
TOP VIEW
DETAIL B
ALTERNATE
CONSTRUCTIONS
A
0.08 C
A1
NOTE 4
C
SIDE VIEW
DETAIL A
D2
1
SEATING
PLANE
10
XXXXX
XXXXX
ALYWG
G
L
6
10X
e
b
0.10 C A
0.05 C
BOTTOM VIEW
10X
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.20
0.30
3.00 BSC
2.20
2.40
3.00 BSC
1.50
1.70
0.50 BSC
0.20
--0.35
0.45
--0.15
GENERIC
MARKING DIAGRAM*
5
E2
K
MOLD CMPD
A1
A3
DETAIL B
0.10 C
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
A3
A
L
Y
W
G
B
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
2.46
0.62
1.76 3.30
PACKAGE
OUTLINE
1
0.50
PITCH
10X
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON51183E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
October, DESCRIPTION:
2002 − Rev. 0
PAGE 1 OFXXX
2
WDFN10 3X3, 0.5P
1
DOCUMENT NUMBER:
98AON51183E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
DATE
11 MAY 2010
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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© Semiconductor Components Industries, LLC, 2010
May, 2010 − Rev. 01O
Case Outline Number:
511BK
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