Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MC13892DJVLR2 MAPBGA 186 12*12*0.8P0.8 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2016-01-18 5385K00148D006A1.18 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles Yes Yes Yes e2 MC13892DJVLR2 MAPBGA 186 12*12*0.8P0.8 ALL 0.375800 g EACH 3 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 1 - Item(s) do not contain RoHS restricted substances per the definition above Accepted Daniel Binyon 2012/51/EU 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Non-Conductive Epoxy/Adhesive 0.006 Non-Conductive Epoxy/Adhesive Plastics/polymers Proprietary Material-Other Epoxy resins - 0.00045 g Non-Conductive Epoxy/Adhesive Plastics/polymers Crosslinked acrylate polymer 25767-43-5 0.0012 g Non-Conductive Epoxy/Adhesive Plastics/polymers Other polymers - 0.00045 Non-Conductive Epoxy/Adhesive Plastics/polymers Proprietary Material-Other polymers - Non-Conductive Epoxy/Adhesive Glass Silica, vitreous 60676-86-0 Solder Balls - Pb Free, Sn/Ag Exemption SubstanceWeight UoM SubPart PPM SubPart% ARTICLEPPM ARTICLE% 75000 7.5 1197 0.1197 200000 20 3193 0.3193 g 75000 7.5 1197 0.1197 0.0012 g 200000 20 3193 0.3193 0.0027 g 450000 45 7184 0.7184 g 0.0571 g Solder Balls - Pb Free, Sn/Ag Metals Aluminum, metal 7429-90-5 0.00000183 g 32 0.0032 4 0.0004 Solder Balls - Pb Free, Sn/Ag Antimony/Antimony Compounds Antimony (metallic) 7440-36-0 0.00000714 g 125 0.0125 18 0.0018 Solder Balls - Pb Free, Sn/Ag Arsenic/Arsenic Compounds Arsenic 7440-38-2 0.00000428 g 75 0.0075 11 0.0011 Solder Balls - Pb Free, Sn/Ag Bismuth/Bismuth Compounds Bismuth 7440-69-9 0.00001073 g 188 0.0188 28 0.0028 Solder Balls - Pb Free, Sn/Ag Cadmium/Cadmium Compounds Cadmium 7440-43-9 0.00000074 g 13 0.0013 1 0.0001 Solder Balls - Pb Free, Sn/Ag Metals Copper, metal 7440-50-8 0.0000036 g 63 0.0063 9 0.0009 Solder Balls - Pb Free, Sn/Ag Metals Gold, metal 7440-57-5 0.0000036 g 63 0.0063 9 0.0009 Solder Balls - Pb Free, Sn/Ag Metals Indium, metal 7440-74-6 0.0000036 g 63 0.0063 9 0.0009 Solder Balls - Pb Free, Sn/Ag Solvents, additives, and other materials Sulfur 7704-34-9 0.0000004 g 7 0.0007 1 0.0001 Solder Balls - Pb Free, Sn/Ag Solvents, additives, and other materials Phosphorus, elemental (not containing red allotrope) 7723-14-0 0.0000036 g 63 0.0063 9 0.0009 Solder Balls - Pb Free, Sn/Ag Metals Iron, metal 7439-89-6 0.00000714 g 125 0.0125 18 0.0018 Solder Balls - Pb Free, Sn/Ag Lead/Lead Compounds Lead 7439-92-1 0.00001787 g 313 0.0313 47 0.0047 Solder Balls - Pb Free, Sn/Ag Nickel (external applications only) Nickel 7440-02-0 0.00000183 g 32 0.0032 4 0.0004 Solder Balls - Pb Free, Sn/Ag Metals Silver, metal 7440-22-4 0.00199861 g 35002 3.5002 5318 0.5318 Solder Balls - Pb Free, Sn/Ag Metals Tin, metal 7440-31-5 0.05503395 g 963817 96.3817 146444 14.6444 Solder Balls - Pb Free, Sn/Ag Metals Zinc, metal 7440-66-6 0.00000108 g 19 0.0019 2 0.0002 Die Encapsulant, Halogen-free 0.1879 g Die Encapsulant, Halogen-free Metals Other aluminum compounds - 0.005637 g 30000 3 15000 1.5 Die Encapsulant, Halogen-free Solvents, additives, and other materials Carbon Black 1333-86-4 0.001879 g 10000 1 5000 0.5 Die Encapsulant, Halogen-free Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.005637 g 30000 3 15000 1.5 Die Encapsulant, Halogen-free Plastics/polymers Other phenolic resins - 0.005637 g 30000 3 15000 1.5 Die Encapsulant, Halogen-free Glass Silica, vitreous 60676-86-0 0.159715 g 850000 85 425022 42.5022 Die Encapsulant, Halogen-free Plastics/polymers Other Non-halogenated Epoxy resins - 0.009395 g 50000 5 25000 2.5 Silicon Semiconductor Die 0.0293 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000586 g 20000 2 1559 0.1559 Silicon Semiconductor Die Glass Silicon, doped - 0.028714 g 980000 98 76407 7.6407 Bonding Wire, PdCu 0.0029 g Bonding Wire, PdCu Metals Copper, metal 7440-50-8 0.00282169 g 972995 97.2995 7508 0.7508 Bonding Wire, PdCu Metals Palladium, metal 7440-05-3 0.00007831 g 27005 2.7005 208 0.0208 Organic Substrate 0.0926 g Organic Substrate Solvents, additives, and other materials Other aromatic amines and their salts - 0.00001546 g 167 0.0167 41 0.0041 Organic Substrate Metals Barium sulfate 7727-43-7 0.00052106 g 5627 0.5627 1386 0.1386 Organic Substrate Metals Copper, metal 7440-50-8 0.04092041 g 441905 44.1905 108888 10.8888 Organic Substrate Plastics/polymers Phenolic Polymer Resin, Epikote 155 9003-36-5 0.00162096 g 17505 1.7505 4313 0.4313 Organic Substrate Plastics/polymers Other Epoxy resins - 0.00387475 g 41844 4.1844 10310 1.031 Organic Substrate Metals Gold, metal 7440-57-5 0.00123362 g 13322 1.3322 3282 0.3282 Organic Substrate Metals Talc 14807-96-6 0.00026243 g 2834 0.2834 698 0.0698 Organic Substrate Nickel (external applications only) Nickel 7440-02-0 0.00962642 g 103957 10.3957 25615 2.5615 Organic Substrate Glass Fibrous-glass-wool 65997-17-3 0.02205649 g 238191 23.8191 58692 5.8692 Organic Substrate Glass Silicon dioxide 7631-86-9 0.0028456 g 30730 3.073 7572 0.7572 Organic Substrate Solvents, additives, and other materials Other Aromatic carbonyl compounds - 0.0000976 g 1054 0.1054 259 0.0259 Organic Substrate Plastics/polymers Triazine 25722-66-1 0.00162096 g 17505 1.7505 4313 0.4313 Organic Substrate Metals Aluminum Hydroxide 21645-51-2 0.00403856 g 43613 4.3613 10746 1.0746 Organic Substrate Metals Copper phthalocyanine 147-14-8 0.00000463 g 50 0.005 12 0.0012 Organic Substrate Solvents, additives, and other materials Quinacridone pigment 1047-16-1 0.00000463 g 50 0.005 12 0.0012 Organic Substrate Solvents, additives, and other materials 3-methoxy-3-methyl-1-butyl acetate 103429-90-9 0.00057125 g 6169 0.6169 1520 0.152 Organic Substrate Solvents, additives, and other materials Bis(3-ethyl-5-methyl-4-maleimidophenyl)methane 105391-33-1 0.00162096 g 17505 1.7505 4313 0.4313 Organic Substrate Plastics/polymers Epoxy Resin 115254-47-2 0.00165958 g 17922 1.7922 4416 0.4416 Organic Substrate Solvents, additives, and other materials 1,2,4-Trimethylbenzene 95-63-6 0.00000463 g 50 0.005 12 0.0012 LINKS MCD LINK NXP website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement NXP ENVIRONMENTAL INFORMATION Environmental Compliance website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.nxp.com http://www.nxp.com/files/corporate/doc/support_info/NXP-ROHS-DECLARATION.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/china-rohs:ENV_CHINA_ROHS_STRATEGY http://www.nxp.com/files/corporate/doc/support_info/NXP-REACH-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-ELV-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-STATEMENT-CONFLICT-MINERALS.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization:ABUENVPRFPRDX http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/eco-product-faqs:ENVIRON_FAQ http://www.nxp.com/support/sales-and-support:SUPPORTHOME http://www.NXP.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MC13892DJVLR2_IPC1752_v11.xml http://www.freescale.com/mcds/MC13892DJVLR2_IPC1752A.xml