Data Sheet

INTEGRATED CIRCUITS
DATA SHEET
TDA7052A/AT
1 W BTL mono audio amplifier with
DC volume control
Product specification
Supersedes data of August 1991
July 1994
NXP Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
TDA7052A/AT
FEATURES
GENERAL DESCRIPTION
• DC volume control
The TDA7052A/AT are mono BTL output amplifiers with
DC volume control. They are designed for use in TV and
monitors, but also suitable for battery-fed portable
recorders and radios.
• Few external components
• Mute mode
• Thermal protection
• Short-circuit proof
Missing Current Limiter (MCL)
• No switch-on and off clicks
A MCL protection circuit is built-in. The MCL circuit is
activated when the difference in current between the
output terminal of each amplifier exceeds 100 mA (typical
300 mA). This level of 100 mA allows for headphone
applications (single-ended).
• Good overall stability
• Low power consumption
• Low HF radiation
• ESD protected on all pins
QUICK REFERENCE DATA
SYMBOL
PARAMETERS
VP
positive supply voltage range
PO
output power
CONDITIONS
MIN.
TYP.
MAX.
UNIT
4.5
−
18
V
W
TDA7052A
RL = 8 Ω; VP = 6 V
1.0
1.1
−
TDA7052AT
RL = 16 Ω; VP = 6 V
0.5
0.55
−
W
Gv
maximum total voltage gain
34.5
35.5
36.5
dB
φ
gain control range
75
80
−
dB
VP = 6 V; RL = ∞
−
7
12
mA
TDA7052A
PO = 0.5 W
−
0.3
1
%
TDA7052AT
PO = 0.25 W
−
0.3
1
%
IP
total quiescent current
THD
total harmonic distortion
ORDERING INFORMATION
PACKAGE
EXTENDED TYPE
NUMBER
PINS
PIN POSITION
MATERIAL
CODE
TDA7052A
8
DIL
plastic
SOT97(1)
TDA7052AT
8
mini-pack
plastic
SOT96A(2)
Notes
1. SOT97-1.
2. SOT96-1.
July 1994
2
NXP Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
TDA7052A/AT
VP
handbook, full pagewidth
1
n.c.
positive input
DC volume
control
7
TDA7052A
TDA7052AT
I + i
5
I – i
8
positive output
2
4
STABILIZER
Vref
negative output
TEMPERATURE
PROTECTION
3
6
MCD385 - 1
power
ground
signal
ground
Fig.1 Block diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
VP
1
positive supply voltage
IN+
2
positive input
GND1
3
signal ground
VC
4
DC volume control
OUT+
5
positive output
GND2
6
power ground
n.c
7
not connected
OUT−
8
negative output
July 1994
handbook, halfpage
VP
1
IN +
2
GND1
3
VC
4
TDA7052A
TDA7052AT
8
OUT –
7
n.c.
6
GND2
5
OUT +
MCD384
Fig.2 Pin configuration.
3
NXP Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
FUNCTIONAL DESCRIPTION
TDA7052A/AT
Thus a reduced power supply with smaller capacitors can
be used which results in cost savings.
The TDA7052A/AT are mono BTL output amplifiers with
DC volume control, designed for use in TV and monitors
but also suitable for battery fed portable recorders and
radios.
For portable applications there is a trend to decrease the
supply voltage, resulting in a reduction of output power at
conventional output stages. Using the BTL principle
increases the output power.
In conventional DC volume circuits the control or input
stage is AC coupled to the output stage via external
capacitors to keep the offset voltage low.
The maximum gain of the amplifier is fixed at 35.5 dB. The
DC volume control stage has a logarithmic control
characteristic.
In the TDA7052A/AT the DC volume control stage is
integrated into the input stage so that no coupling
capacitors are required and yet a low offset voltage is
maintained. At the same time the minimum supply remains
low.
The total gain can be controlled from 35.5 dB to −44 dB. If
the DC volume control voltage is below 0.3 V, the device
switches to the mute mode.
The amplifier is short-circuit proof to ground, VP and
across the load. Also a thermal protection circuit is
implemented. If the crystal temperature rises above
+150 °C the gain will be reduced, so the output power is
reduced.
The BTL principle offers the following advantages:
• Lower peak value of the supply current
• The frequency of the ripple on the supply voltage is twice
the signal frequency.
Special attention is given to switch on and off clicks, low
HF radiation and a good overall stability.
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134)
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VP
supply voltage range
−
18
V
IORM
repetitive peak output current
−
1.25
A
IOSM
non-repetitive peak output current
−
1.5
A
Ptot
total power dissipation
TDA7052A
−
1.25
W
TDA7052AT
−
0.8
W
Tamb ≤ 25%
Tamb
operating ambient temperature range
−40
+85
°C
Tstg
storage temperature range
−55
+150
°C
Tvj
virtual junction temperature
−
+150
°C
Tsc
short-circuit time
−
1
hr
V2
input voltage pin 2
−
8
V
V4
input voltage pin 4
−
8
V
July 1994
4
NXP Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
TDA7052A/AT
THERMAL RESISTANCE
SYMBOL
Rth j-a
PARAMETER
THERMAL RESISTANCE
from junction to ambient in free air
TDA7052A
100 K/W
TDA7052AT
155 K/W
Notes to the thermal resistance
TDA7052A: VP = 6 V; RL = 8 Ω. The maximum sine-wave dissipation is 0.9 W.
Therefore Tamb(max) = 150 − 100 × 0.9 = 60 °C.
TDA7052AT: VP = 6 V; RL = 16 Ω. The maximum sine-wave dissipation is 0.46 W.
Therefore Tamb(max) = 150 − 155 × 0.46 = 78 °C.
July 1994
5
NXP Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
TDA7052A/AT
CHARACTERISTICS
VP = 6 V; Tamb = 25 °C; f = 1 kHz; TDA7052A: RL = 8 Ω; TDA7052AT: RL = 16 Ω; unless otherwise specified (see Fig.6).
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
4.5
−
18
V
−
7
12
mA
TDA7052A
1.0
1.1
−
W
TDA7052AT
0.5
0.55
−
W
VP
positive supply voltage range
IP
total quiescent current
VP = 6 V; RL = ∞
note 1
Maximum gain; V4 = 1.4 V
PO
THD
output power
THD = 10%
total harmonic distortion
TDA7052A
PO = 0.5 W
−
0.3
1
%
TDA7052AT
PO = 0.25 W
−
0.3
1
%
Gv
voltage gain
34.5
35.5
36.5
dB
VI
input signal handling
V4 = 0.8 V; THD < 1%
0.5
0.65
−
V
Vno(rms)
noise output voltage (RMS value)
f = 500 kHz; note 2
−
210
−
μV
B
bandwidth
−1 dB
−
20 Hz to
300 kHz
−
SVRR
supply voltage ripple rejection
note 3
38
46
−
dB
|Voff|
DC output offset voltage
−
0
150
mV
ZI
input impedance (pin 2)
15
20
25
kΩ
−
−44
−
dB
note 4
−
20
30
μV
V4 ≤ 0.3 V; VI = 600 mV
−
−
30
μV
75
80
−
dB
60
70
80
μA
Minimum gain; V4 = 0.5 V
Gv
voltage gain
Vno(rms)
noise output voltage (RMS value)
Mute position
VO
output voltage in mute position
DC volume control
φ
gain control range
I4
control current
V4 = 0.4 V
Notes to the characteristics
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage dividend by RL.
2. The noise output voltage (RMS value) at f = 500 kHz is measured with RS = 0 Ω and bandwidth = 5 kHz.
3. The ripple rejection is measured with RS = 0 Ω and f = 100 Hz to 10 kHz. The ripple voltage of 200 mV, (RMS value)
is applied to the positive supply rail.
4. The noise output voltage (RMS value) is measured with RS = 5 kΩ unweighted.
July 1994
6
NXP Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
TDA7052A/AT
MCD389 - 1
MCD388
1000
V
noise
(μV)
800
40
gain
(dB)
20
handbook, halfpage
handbook, halfpage
0
600
– 20
400
– 40
200
– 60
0
– 80
0
0.4
0.8
1.2
1.6
0
2.0
V (V)
4
Fig.4
MCD390 - 1
100
handbook, halfpage
I4
(μA)
60
20
– 20
– 60
– 100
Fig.5
July 1994
0.4
0.8
1.2
1.6
0.8
1.2
1.6
2.0
V4 (V)
Fig.3 Gain control as a function of DC volume control.
0
0.4
2.0
V4 (V)
Control current as a function of DC volume
control.
7
Noise output voltage as a function of DC
volume control.
NXP Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
TDA7052A/AT
APPLICATION INFORMATION
(1)
VP = 6 V
handbook, full pagewidth
220 μF
100 nF
1
n.c.
7
TDA7052A
TDA7052AT
positive
input
0.47 μF
I + i
5
2
R L= 8 Ω
4
(TDA7052A)
R L = 16 Ω
(TDA7052A/AT)
I – i
RS
8
5 kΩ
STABILIZER
Vref
TEMPERATURE
PROTECTION
DC
volume
control
3
6
MCD386 - 1
This capacitor can be omitted if the 220 μF electrolytic capacitor is connected close to pin 1.
Fig.6 Test and application diagram.
handbook, halfpage
volume
control
4
1 μF
1 MΩ
MCD387
Fig.7
July 1994
Application with potentiometer as volume
control; maximum gain = 30 dB.
8
ground
NXP Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
TDA7052A/AT
PACKAGE OUTLINES
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
ME
seating plane
D
A2
A
A1
L
c
Z
w M
b1
e
(e 1)
b
MH
b2
5
8
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches
0.17
0.02
0.13
0.068
0.045
0.021
0.015
0.042
0.035
0.014
0.009
0.39
0.36
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.045
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT97-1
050G01
MO-001
SC-504-8
July 1994
9
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
NXP Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
TDA7052A/AT
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
HE
v M A
Z
5
8
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
inches
0.010 0.057
0.069
0.004 0.049
0.05
0.244
0.039 0.028
0.041
0.228
0.016 0.024
0.01
0.01
0.028
0.004
0.012
θ
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03
MS-012
July 1994
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
10
NXP Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
SOLDERING
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
July 1994
TDA7052A/AT
11
NXP Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
TDA7052A/AT
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Qualification
This document contains data from the preliminary specification.
Product data sheet
Production
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Limited warranty and liability ⎯ Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
In no event shall NXP Semiconductors be liable for any
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damages (including - without limitation - lost profits, lost
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accepts no liability for any assistance with applications or
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Semiconductors product is suitable and fit for the
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associated with their applications and products.
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for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the application or use by customer’s third
party customer(s). Customer is responsible for doing all
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avoid a default of the applications and the products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
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not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
July 1994
12
NXP Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Non-automotive qualified products ⎯ Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with automotive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or
applications.
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Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
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Semiconductors hereby expressly objects to applying the
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purchase of NXP Semiconductors products by customer.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and
specifications, and (b) whenever customer uses the
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customer’s own risk, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed
product claims resulting from customer design and use of
the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
Semiconductors’ product specifications.
No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
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other industrial or intellectual property rights.
Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
July 1994
TDA7052A/AT
13
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
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Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: [email protected]
© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
RM5/02/pp14
Date of release: July 1994
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